FORMOSA RB521S_10

Formosa MS
Small Signal Schottky Diode
RB521S
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 1
DS-221662
Issued Date
2008/02/10
Revised Date
Revision
2010/05/10
B
Page.
7
Formosa MS
Small Signal Schottky Diode
RB521S
200mA Surface Mount Small Signal
Schottky Diodes-30V
Package outline
Features
0.035(0.90)
0.028(0.70)
• Low current rectification and high speed switching.
• Extremely small surface mount type.
• Up to 200mA current capability.
• Low forward voltage drop (V F = 0.5V typ. @200mA)
• Silicon epitaxial planar chip, metal silicon junction.
• Lead-free parts meet exceeds environmental
0.014(0.35)
0.009(0.25)
SOD-523FL
0.051(1.30)
0.043(1.10)
standards of MIL-STD-19500 /228
• Suffix "-H" indicates Halogen-free parts, ex. RB521S-H.
0.007(0.20)
0.002(0.05)
0.028(0.70)
0.020(0.50)
Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-523FL
• Terminals : Solder plated, solderable per
0.067(1.70)
0.059(1.50)
MIL-STD-750, Method 2026
Dimensions in inches and (millimeters)
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.002 gram
Maximum ratings and Electrical Characteristics (AT T =25 C unless otherwise noted)
o
A
PARAMETER
CONDITIONS
Symbol
MIN.
TYP.
MAX. UNIT
Repetitive peak reverse voltage
V RM
30
V
Continuous reverse voltage
VR
30
V
Mean rectifying current
IO
200
mA
I FSM
1000
mA
Forward surge current
60Hz for 1cycle
Operating temperature
Storage temperature
TJ
-40
+125
o
C
T STG
-40
+125
o
C
Forward voltage
I F = 200 mA
Reverse current
V R = 10 V
IR
Diode capacitance
V R = 10 V, f = 1MHz
CT
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TEL:886-2-22696661
FAX:886-2-22696141
VF
Document ID
Page 2
DS-221662
0.50
30
4.0
Issued Date
2008/02/10
V
uA
pF
Revised Date
Revision
2010/05/10
B
Page.
7
FIG.1-TYPICAL FORWARD
FIG.2 - TYPICAL REVERSE
CHARACTERISTICS
CHARACTERISTICS
1000mA
1mA
o
Ta=125 C
100mA
Ta
=
12
5
o
C
REVERSE CURRENT
100uA
10mA
Ta =
-2
25
o
Ta =
7
100uA
C
5 oC
5 oC
1mA
1uA
o
Ta=75 C
10uA
o
Ta=25 C
1uA
o
Ta=-25 C
100nA
Ta =
10uA
0
0.1
0.2
0.3
0.4
0.5
0.6
10nA
0.7
0
FORWARD VOLTAGE,(V)
5
10
15
20
25
30
REVERSE VOLTAGE,(V)
35
FIG.4- DERATING CURVE
FIG.3-TYPICAL TERMINALS CAPACITANCE
100
f=1MHz
Io CURRENT, (%)
CAPACITANCE BETWEEN TERMINALS ,(pF)
INSTANTANEOUS FORWARD CURRENT
Rating and characteristic curves (RB521S)
10
1
0
5
10
15
20
25
30
35
REVERSE VOLTAGE,(V)
AMBIENT TEMPERATURE,(°C)
(mounting on glass epoxy PCBs)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 3
DS-221662
Issued Date
2008/02/10
Revised Date
Revision
2010/05/10
B
Page.
7
Formosa MS
Small Signal Schottky Diode
RB521S
Pinning information
Pin
Pin1
Pin2
Simplified outline
cathode
anode
1
Symbol
2
1
2
Marking
Type number
Marking code
RB521S
C
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
PACKAGE
A
B
C
SOD-523FL
0.032 (0.80)
0.024 (0.60)
0.044 (1.10)
Document ID
Page 4
DS-221662
Issued Date
2008/02/10
Revised Date
Revision
2010/05/10
B
Page.
7
Formosa MS
Small Signal Schottky Diode
RB521S
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Symbol
Tolerance
Carrier width
Carrier length
Carrier depth
Sprocket hole
A
B
C
d
0.1
0.1
0.1
0.1
0.90
1.94
0.76
1.50
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
D
D1
D2
E
F
P
P0
P1
T
W
W1
2.0
min
0.2
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
178.00
50.00
13.00
1.75
3.50
2.00
4.00
2.00
0.23
8.00
9.50
Item
SOD-523FL
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 5
DS-221662
Issued Date
2008/02/10
Revised Date
Revision
2010/05/10
B
Page.
7
Formosa MS
Small Signal Schottky Diode
RB521S
Reel packing
PACKAGE
SOD-523FL
REEL SIZE
REEL
(pcs)
COMPONENT
SPACING
(m/m)
7"
3,000
4.0
BOX
(pcs)
INNER
BOX
(m/m)
30,000 183*183*123
REEL
DIA,
(m/m)
CARTON
SIZE
(m/m)
CARTON
(pcs)
APPROX.
GROSS WEIGHT
(kg)
178
382*262*387
240,000
9.5
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
150 oC
200 oC
60~120sec
Tsmax to T L
-Ramp-upRate
<3 oC/sec
Time maintained above:
-Temperature(T L )
-Time(t L )
217 oC
60~260sec
255 oC-0/+5 oC
Peak Temperature(T P )
Time within 5 oC of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 oC/sec
Time 25 oC to Peak Temperature
<6minutes
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 6
DS-221662
Issued Date
2008/02/10
Revised Date
Revision
2010/05/10
B
Page.
7
Formosa MS
Small Signal Schottky Diode
RB521S
High reliability test capabilities
Item Test
Conditions
Reference
O
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
immerse body into solder 1/16"±1/32"
MIL-STD-750D
METHOD-2031
2. Solderability
at 245±5 OC for 5 sec.
MIL-STD-202F
METHOD-208
3. High Temperature Reverse Bias
V R=80% rate at T J=125 OC for 168 hrs.
MIL-STD-750D
METHOD-1038
4. Forward Operation Life
Rated average rectifier current at T A=25 OC for 500hrs.
MIL-STD-750D
METHOD-1027
T A = 25 OC, I F = I O
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
5. Intermittent Operation Life
6. Pressure Cooker
JESD22-A102
15P SIG at T A=121 OC for 4 hrs.
7. Temperature Cycling
-55 OC to +125 OC dwelled for 30 min.
and transferred for 5min. total 10 cycles.
8. Thermal Shock
0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles.
MIL-STD-750D
METHOD-1056
9. Forward Surge
60Hz for 1cycle
MIL-STD-750D
METHOD-4066-2
10. Humidity
at T A=85 OC, RH=85% for 1000hrs.
MIL-STD-750D
METHOD-1021
11. High Temperature Storage Life
at 175 OC for 1000 hrs.
MIL-STD-750D
METHOD-1031
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TEL:886-2-22696661
FAX:886-2-22696141
MIL-STD-750D
METHOD-1051
Document ID
Page 7
DS-221662
Issued Date
2008/02/10
Revised Date
Revision
2010/05/10
B
Page.
7