SHENZHENFREESCALE SUD50P04-08

SUD50P04-08
P-Channel 40-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
- 40
RDS(on) (Ω)
ID (A)
0.0081 at VGS = - 10 V
- 50d
0.0117 at VGS = - 4.5 V
- 48d
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFET
• 100 % Rg and UIS Tested
• Compliant to RoHS Directive 2002/95/EC
Qg (Typ.)
60
APPLICATIONS
• Power Switch
• Load Switch in High Current Applications
• DC/DC Converters
S
TO-252
G
Drain Connected to Tab
G
D
S
D
Top View
P-Channel MOSFET
Ordering Information: SUD50P04-08-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
Symbol
Limit
Drain-Source Voltage
Parameter
VDS
- 40
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 150 °C)
TC = 25 °C
TC = 70 °C
Pulsed Drain Current
Avalanche Current
a
L = 0.1 mH
Single Avalanche Energy
TC = 25 °C
Maximum Power Dissipationa
TA = 25 °C
Operating Junction and Storage Temperature Range
c
ID
V
- 50d
- 50d
IDM
- 100
IAS
- 46
EAS
106
PD
Unit
73.5
A
mJ
b
2.5
W
TJ, Tstg
- 55 to 150
°C
Symbol
Limit
Unit
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambient (PCB Mount)
c
Junction-to-Case (Drain)
RthJA
50
RthJC
1.7
Notes:
a. Duty cycle ≤ 1 %.
b. See SOA curve for voltage derating.
c. When Mounted on 1" square PCB (FR-4 material).
d. Package limited.
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°C/W
SUD50P04-08
P-Channel 40-V (D-S) MOSFET
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
VDS
VDS = 0 V, ID = - 250 µA
- 40
VGS(th)
VDS = VGS, ID = - 250 µA
-1
IGSS
VDS = 0 V, VGS = ± 20 V
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-State Resistancea
Forward Transconductancea
IDSS
- 2.5
± 250
VDS = - 40 V, VGS = 0 V
-1
VDS = - 40 V, VGS = 0 V, TJ = 125 °C
- 50
VDS = - 40 V, VGS = 0 V, TJ = 150 °C
- 250
VDS ≤ - 10 V, VGS = - 10 V
ID(on)
RDS(on)
gfs
- 50
V
nA
µA
A
VGS = - 10 V, ID = - 22 A
0.0067
0.0081
VGS = - 4.5 V, ID = - 19 A
0.0097
0.0117
VDS = - 15 V, ID = - 22 A
45
Ω
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Chargec
Qg
Gate-Source Chargec
Qgs
Gate-Drain Chargec
Qgd
Turn-On Delay Timec
Rise Timec
VDS = - 20 V, VGS = - 10 V, ID = - 20 A
VDS = - 20 V, VGS = - 4.5 V, ID = - 20 A
Fall Timec
td(off)
106
159
60
90
22
f = 1 MHz
VDD = - 20 V, RL = 2 Ω
ID ≅ - 10 A, VGEN = - 10 V, Rg = 1 Ω
tf
Drain-Source Body Diode Ratings and Characteristics TC = 25 °C
0.4
1.8
3.6
15
23
12
18
70
105
18
27
- 50
Pulsed Current
ISM
- 100
Forward Voltagea
VSD
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
IF = - 10 A, VGS = 0 V
- 0.8
IF = - 10 A, dI/dt = 100 A/µs
33
trr
IRM(REC)
Qrr
Ω
ns
b
IS
Continuous Current
nC
27
td(on)
tr
c
pF
570
500
Rg
Gate Resistance
Turn-Off Delay Time
5380
VGS = 0 V, VDS = - 20 V, f = 1 MHz
A
- 1.5
V
35
53
ns
-2
-3
A
50
nC
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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SUD50P04-08
P-Channel 40-V (D-S) MOSFET
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
100
0.015
VGS = 10 V thru 5 V
I D - Drain Current (A)
R DS(on) - On-Resistance (Ω)
VGS = 4 V
80
60
40
20
0.012
VGS = 4.5 V
0.009
VGS = 10 V
0.006
VGS = 3 V
0
0.0
0.003
0.5
1.0
1.5
2.0
2.5
0
20
40
VDS - Drain-to-Source Voltage (V)
80
100
ID - Drain Current (A)
Output Characteristics
On-Resistance vs. Drain Current
10
0.030
8
0.024
R DS(on) - On-Resistance (Ω)
I D - Drain Current (A)
60
6
4
TC = 25 °C
0.018
TJ = 150 °C
0.012
TJ = 25 °C
0.006
2
TC = 125 °C
TC = - 55 °C
0
0
1
2
3
0.000
2
4
VGS - Gate-to-Source Voltage (V)
8
10
On-Resistance vs. Gate-to-Source Voltage
10
100
ID = 20 A
VGS - Gate-to-Source Voltage (V)
TC = - 55 °C
g fs - Transconductance (S)
6
VGS - Gate-to-Source Voltage (V)
Transfer Characteristics
75
TC = 25 °C
TC = 125 °C
50
25
8
VDS = 20 V
6
VDS = 10 V
VDS = 32 V
4
2
0
0
0
3/8
4
10
20
30
40
50
0
30
60
90
ID - Drain Current (A)
Qg - Total Gate Charge (nC)
Transconductance
Gate Charge
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120
SUD50P04-08
P-Channel 40-V (D-S) MOSFET
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
100
- 1.0
10
ID = 250 µA
VGS(th) (V)
I S - Source Current (A)
- 1.3
TJ = 150 °C
TJ = 25 °C
- 1.6
- 1.9
1
- 2.2
0.1
0.0
0.3
0.6
0.9
- 2.5
- 50
1.2
0
25
50
75
VSD - Source-to-Drain Voltage (V)
TJ - Temperature (°C)
Source-Drain Diode Forward Voltage
Threshold Voltage
8000
100
125
150
100
125
150
VDS - Drain-to-Source Voltage (V)
- 43
6000
C - Capacitance (pF)
- 25
Ciss
4000
2000
Coss
ID = 250 µA
- 45
- 47
- 49
Crss
0
0
10
20
30
- 51
- 50
40
- 25
0
25
50
75
VDS - Drain-to-Source Voltage (V)
TJ - Junction Temperature (°C)
Capacitance
Drain Source Breakdown vs. Junction Temperature
80
2.0
ID = 20 A
60
I D - Drain Current (A)
VGS = 10 V
(Normalized)
R DS(on) - On-Resistance
1.7
1.4
VGS = 4.5 V
1.1
Package Limited
40
20
0.8
0.5
- 50
4/8
0
- 25
0
25
50
75
100
125
150
0
25
50
75
100
TJ - Junction Temperature (°C)
TC - Case Temperature (°C)
On-Resistance vs. Junction Temperature
Current Derating
125
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150
SUD50P04-08
P-Channel 40-V (D-S) MOSFET
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
100
1000
Limited by RDS(on)*
100
I D - Drain Current (A)
I DAV (A)
100 µA
TJ = 25 °C
TJ = 150 °C
10
10
1
0.1
1
10-5
10-4
10-3
10-2
1 ms
10 ms, 100 ms
1 s, 10 s, DC
TC = 25 °C
Single Pulse
0.01
0.1
10-1
Time (s)
BVDSS
Limited
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Single Pulse Avalanche Current Capability vs. Time
Safe Operating Area
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
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100
SUD50P04-08
P-Channel 40-V (D-S) MOSFET
TO-252AA CASE OUTLINE
E
A
MILLIMETERS
C1
e
b1
D1
e1
E1
L
gage plane height (0.5 mm)
L1
b
L3
H
D
L2
b2
C
A2
A1
INCHES
DIM.
MIN.
MAX.
MIN.
MAX.
A
2.21
2.38
0.087
0.094
A1
0.89
1.14
0.035
0.045
A2
0.030
0.127
0.001
0.005
b
0.71
0.88
0.028
0.035
b1
0.76
1.14
0.030
0.045
b2
5.23
5.44
0.206
0.214
C
0.46
0.58
0.018
0.023
C1
0.46
0.58
0.018
0.023
D
5.97
6.22
0.235
0.245
D1
4.10
4.45
0.161
0.175
E
6.48
6.73
0.255
0.265
E1
4.49
5.50
0.177
0.217
e
e1
2.28 BSC
4.57 BSC
0.090 BSC
0.180 BSC
H
9.65
10.41
0.380
L
1.40
1.78
0.055
0.070
L1
0.64
1.02
0.025
0.040
L2
0.89
1.27
0.035
0.050
L3
1.15
1.52
0.040
0.060
ECN: T11-0110-Rev. L, 18-Apr-11
DWG: 5347
Note
• Dimension L3 is for reference only.
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0.410
SUD50P04-08
P-Channel 40-V (D-S) MOSFET
RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)
0.224
0.243
0.087
(2.202)
0.090
(2.286)
(10.668)
0.420
(6.180)
(5.690)
0.180
0.055
(4.572)
(1.397)
Recommended Minimum Pads
Dimensions in Inches/(mm)
Return to Index
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SUD50P04-08
P-Channel 40-V (D-S) MOSFET
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freestyle Intertechnology, Inc. hereby certi fies that all its products that are id entified as RoHS-Compliant fulfill the
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