Data Sheet

ZXMP3A17E6
30V P-CHANNEL ENHANCEMENT MODE MOSFET
Features and Benefits
V(BR)DSS
Max RDS(ON)
-30V
70m @ VGS = -10V







Max ID
TA = +25C
(Note 6)
-4A
Description and Applications
Low On-Resistance
Fast Switching Speed
Low Threshold
Low Gate Drive
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
This new generation of TRENCH MOSFETs from Zetex utilizes a
unique structure that combines the benefits of low on-resistance with
fast switching speed. This makes them ideal for high efficiency, low
voltage, power management applications.
Mechanical Data








DC - DC Converters
Power Management Functions
Disconnect Switches
Motor Control
Case: SOT26
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208 e3
Weight: 0.016 grams (Approximate)

D
SOT26
D 1
6
D
D 2
5
D
G 3
4
S
G
S
Pin-Out (Top View)
Top View
Equivalent Circuit
Ordering Information (Note 4)
Part Number
ZXMP3A17E6TA
ZXMP3A17E6TC
Notes:
Marking
317
317
Reel Size (inch)
7
13
Tape Width (mm)
8
8
Quantity Per Reel
3000
10,000
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
317
Date Code Key
Year
Code
Month
Code
2015
C
Jan
1
2016
D
Feb
2
ZXMP3A17E6
Datasheet Number: DS33578 Rev. 3 - 2
Mar
3
YM
NEW PRODUCT
Product Summary
317 = Product Type Marking Code
YM = Date Code Marking
Y or Y = Year (ex: C = 2015)
M or M = Month (ex: 9 = September)
2017
E
Apr
4
2018
F
May
5
Jun
6
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2019
G
Jul
7
2020
H
Aug
8
Sep
9
2021
I
Oct
O
2022
J
Nov
N
Dec
D
March 2015
© Diodes Incorporated
ZXMP3A17E6
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGS
Drain-Source Voltage
Gate-Source Voltage
NEW PRODUCT
Continuous Drain Current
VGS = -10V
TA= +25C (Note 6)
TA= +70C (Note 6)
TA= +25C (Note 5)
ID
Pulsed Drain Current (Note 7)
Continuous Source Current (Body Diode) (Note 6)
Pulsed Source Current (Body Diode) (Note 7)
IDM
IS
ISM
Value
-30
20
-4.0
-3.2
-3.2
-14.4
-2.5
-14.4
Unit
V
V
Value
1.1
8.8
1.7
13.6
113
Unit
W
mW/C
W
mW/C
A
A
A
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Power Dissipation at TA= +25C (Note 5)
Linear derating factor
Power Dissipation at TA= +25C (Note 6)
Linear Derating Factor
Junction to Ambient (Note 5)
Symbol
PD
PD
RJA
RJA
TJ, TSTG
Junction to Ambient (Note 6)
Operating and Storage Temperature Range
73
-55 to +150
C/W
C/W
C
Notes: 5. For a device surface mounted on 25mm x 25mm FR-4 PCB with high coverage of single sided 1oz copper, in still air conditions.
6. For a device surface mounted on FR-4 PCB measured at t≦5 secs.
7. Repetitive rating 25mm x 25mm FR-4 PCB, D = 0.05, pulse width 10µs - pulse width limited by maximum junction temperature. Refer to Transient Thermal
Impedance graph.
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage
Gate-Source Threshold Voltage
Symbol
Min
Typ
Max
Unit
V(BR)DSS
IDSS
IGSS
VGS(TH)
-30
-1.0
-
V
A
nA
V
Static Drain-Source On-State Resistance (Note 8)
RDS(ON)
-
-
gfs
VSD
-
6.4
-0.85
-0.5
100
0.070
0.110
-1.2
Ciss
Coss
Crss
-
630
113
78
-
pF
pF
pF
VDS = -15V, VGS = 0V
f = 1MHz
Gate Charge (Notes 9 &10)
Qg
-
8.28
-
nC
VGS = -5V, VDS = -15V
ID = -3.2A
Total Gate Charge (Notes 9 &10)
Gate-Source Charge (Notes 9 &10)
Gate-Drain Charge (Notes 9 &10)
Turn-On Delay Time (Notes 9 &10)
Turn-On Rise Time (Notes 9 &10)
Turn-Off Delay Time (Notes 9 &10)
Turn-Off Fall Time (Notes 9 &10)
Reverse Recovery Time (Note 10)
Reverse Recovery Charge (Note 10)
Qg
Qgs
Qgd
-
-
15.8
1.84
2.8
1.74
2.87
29.2
8.72
19.5
16.3
-
nC
nC
nC
ns
ns
ns
ns
ns
nC
Forward Transconductance (Notes 8 &10)
Diode Forward Voltage (Note 8)
DYNAMIC CHARACTERISTICS
Input Capacitance (Note 10)
Output Capacitance (Note 10)
Reverse Transfer Capacitance (Note 10)
tD(ON)
tR
tD(OFF)
tF
tRR
QRR
Ω
S
V
Test Condition
ID = -250A, VGS = 0V
VDS = -30V, VGS = 0V
VGS = 20V, VDS = 0V
ID = -250A, VDS = VGS
VGS = -10V, ID =-3.2A
VGS = -4.5V, ID =-2.5A
VDS = -15V, ID =-3.2A
TJ= +25°C , IS = -2.5A, VGS = 0V
VGS = -10V, VDS = -15V
ID = -3.2A
VDD = -15V, VGS = -10V
ID = -1A, RG = 6.0
TJ= +25°C, IF=-1.7A,
di/dt= 100A/μs
Notes: 8. Measured under pulsed conditions. Width=300μs. Duty cycle ≤ 2%
9. Switching characteristics are independent of operating junction temperature.
10. For design aid only, not subject to production testing.
ZXMP3A17E6
Datasheet Number: DS33578 Rev. 3 - 2
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NEW PRODUCT
ZXMP3A17E6
ZXMP3A17E6
Datasheet Number: DS33578 Rev. 3 - 2
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ZXMP3A17E6
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Datasheet Number: DS33578 Rev. 3 - 2
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ZXMP3A17E6
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Datasheet Number: DS33578 Rev. 3 - 2
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Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
NEW PRODUCT
A
B C
H
K
M
J
L
D
SOT26
Dim Min Max Typ
A
0.35 0.50 0.38
B
1.50 1.70 1.60
C
2.70 3.00 2.80
D

 0.95
H
2.90 3.10 3.00
J
0.013 0.10 0.05
K
1.00 1.30 1.10
L
0.35 0.55 0.40
M
0.10 0.20 0.15
0°
8° 

All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
C2
Z
C2
Dimensions Value (in mm)
Z
3.20
G
1.60
X
0.55
Y
0.80
C1
2.40
C2
0.95
C1
G
Y
X
ZXMP3A17E6
Datasheet Number: DS33578 Rev. 3 - 2
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IMPORTANT NOTICE
NEW PRODUCT
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
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Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
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ZXMP3A17E6
Datasheet Number: DS33578 Rev. 3 - 2
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March 2015
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