FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 240 PIN PLASTIC BGA-240P-M03 240-ball plastic FBGA Ball pitch 0.500 mm Package width package length 10.00 mm 10.00 mm Lead shape Soldering ball Sealing method Plastic mold Ball size 0.30 mm Mounting height 1.35 mm Max Weight 0.22 g (BGA-240P-M03) 240-ball plastic FBGA (BGA-240P-M03) 9.00(.354)REF 10.00±0.10(.394±.004) 0.20(.008) S B B 0.50(.020) TYP 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A 10.00±0.10 (.394±.004) 9.00(.354) REF 0.50(.020) TYP (INDEX AREA) WV U T R P N M L K J H G F E D C B A 0.20(.008) S A INDEX 240-ø0.30±0.10 (240-ø.012±.004) ø0.05(.002) M S A B S 0.10(.004) S C 0.25±0.10 (.010±.004) (Stand off) 2004-2010 FUJITSU SEMICONDUCTOR LIMITED B240003S-c-1-4 1.15±0.20 (.045±.008) (Seated height) Dimensions in mm (inches). Note: The values in parentheses are reference values. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU SEMICONDUCTOR sales representatives before ordering. FUJITSU SEMICONDUCTOR is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. 0909