AOT262L/AOB262L 60V N-Channel MOSFET General Description Product Summary VDS • Trench Power MV MOSFET technology • Low RDS(ON) • Low Gate Charge • Optimized for fast-switching applications Applications ID (at VGS=10V) 60V 140A RDS(ON) (at VGS=10V) < 3.0mΩ (< 2.8mΩ∗) RDS(ON) (at VGS = 6V) < 3.2mΩ (< 3.0mΩ∗) 100% UIS Tested 100% Rg Tested • Synchronus Rectification in DC/DC and AC/DC Converters • Industrial and Motor Drive applications TO-263 D2PAK TO-220 Top View Bottom View Top View D Bottom View D D D D G G D S S Orderable Part Number AOT262L AOB262L D Form Tube Tape & Reel Absolute Maximum Ratings TA=25°C unless otherwise noted Parameter Symbol Drain-Source Voltage VDS Continuous Drain Current G VGS TC=25°C Pulsed Drain Current C Continuous Drain Current Units V ±20 V A 500 20 IDSM TA=70°C Maximum 60 110 IDM TA=25°C Minimum Order Quantity 1000 800 140 ID TC=100°C S S G Package Type TO-220 TO-263 Gate-Source Voltage G S G A 16 Avalanche Current C IAS, IAR 115 A Avalanche energy L=0.1mH C EAS, EAR 661 mJ VSPIKE 72 V dv/dt 8 333 V/ns VDS Spike 10µs Peak diode recovery dv/dt TC=25°C Power Dissipation B TC=100°C Power Dissipation A TA=70°C PD TA=25°C Thermal Characteristics Parameter Maximum Junction-to-Ambient A Maximum Junction-to-Ambient A D Maximum Junction-to-Case * Surface mount package TO263 Rev.1.0 : August 2014 2.1 PDSM Junction and Storage Temperature Range Steady-State Steady-State RθJA RθJC W 1.3 TJ, TSTG Symbol t ≤ 10s W 167 -55 to 175 Typ 12 48 0.35 www.aosmd.com °C Max 15 60 0.45 Units °C/W °C/W °C/W Page 1 of 6 Electrical Characteristics (TJ=25°C unless otherwise noted) Symbol Parameter STATIC PARAMETERS Drain-Source Breakdown Voltage BVDSS IDSS Zero Gate Voltage Drain Current Conditions Min ID=250µA, VGS=0V Typ 60 1 TJ=55°C µA 5 IGSS Gate-Body leakage current VDS=0V, VGS= ±20V VGS(th) Gate Threshold Voltage VDS=VGS ID=250µA 2.2 ID(ON) On state drain current VGS=10V, VDS=5V 500 VGS=10V, ID=20A TJ=125°C 100 nA 2.7 3.2 V 2.2 3.0 A 3.6 VGS=6V, ID=20A TO220 2.5 3.2 VGS=10V, ID=20A TO263 2.0 2.8 2.3 80 3.0 Forward Transconductance VGS=6V, ID=20A TO263 VDS=5V, ID=20A VSD Diode Forward Voltage IS=1A,VGS=0V 0.65 IS Maximum Body-Diode Continuous Current G RDS(ON) gFS Static Drain-Source On-Resistance DYNAMIC PARAMETERS Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance Rg Gate resistance Gate Source Charge mΩ S 1 V 140 A 6500 8140 9800 pF VGS=0V, VDS=30V, f=1MHz 830 1040 1350 pF 25 32 55 pF VGS=0V, VDS=0V, f=1MHz 0.5 1 1.5 Ω 75 95 115 nC SWITCHING PARAMETERS Qg(10V) Total Gate Charge Qgs Units V VDS=60V, VGS=0V TO220 Max VGS=10V, VDS=30V, ID=20A 30 nC Qgd Gate Drain Charge 5 nC tD(on) Turn-On DelayTime 27 ns tr Turn-On Rise Time 22 ns tD(off) Turn-Off DelayTime tf Turn-Off Fall Time trr Body Diode Reverse Recovery Time IF=20A, dI/dt=500A/µs 21 30 39 Qrr Body Diode Reverse Recovery Charge IF=20A, dI/dt=500A/µs 130 185 240 VGS=10V, VDS=30V, RL=1.5Ω, RGEN=3Ω 47 ns 8 ns ns nC A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application depends on the user's specific board design, and the maximum temperature of 175°C may be used if the PCB allows it. B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low frequency and duty cycles to keep initial TJ =25°C. D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of TJ(MAX)=175°C. The SOA curve provides a single pulse rating. G. The maximum current rating is package limited. H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Rev.1.0 : August 2014 www.aosmd.com Page 2 of 6 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 100 100 4.5V 80 VDS=5V 80 6V 10V 60 ID(A) ID (A) 60 40 40 4V 125°C 25°C 20 20 VGS=3.5V 0 0 0 1 2 3 4 1 5 3 4 5 6 VGS(Volts) Figure 2: Transfer Characteristics (Note E) VDS (Volts) Fig 1: On-Region Characteristics (Note E) 6 2.2 Normalized On-Resistance RDS(ON) (mΩ) 2 4 VGS=6V 2 VGS=10V 2 VGS=10V ID=20A 1.8 1.6 1.4 VGS=6V ID=20A 1.2 17 5 2 10 1 0.8 0 0 5 0 10 15 20 25 30 ID (A) Figure 3: On-Resistance vs. Drain Current and Gate Voltage (Note E) 25 50 75 100 125 150 175 200 0 Temperature (°C) Figure 4: On-Resistance vs. Junction 18Temperature (Note E) 1.0E+02 8 ID=20A 1.0E+01 40 1.0E+00 125°C IS (A) RDS(ON) (mΩ) 6 4 125°C 1.0E-01 1.0E-02 25°C 1.0E-03 2 1.0E-04 25°C 1.0E-05 0.0 0 2 4 6 8 VGS (Volts) Figure 5: On-Resistance vs. Gate-Source Voltage (Note E) Rev.1.0 : August 2014 0.2 0.4 0.6 0.8 1.0 1.2 10 www.aosmd.com VSD (Volts) Figure 6: Body-Diode Characteristics (Note E) Page 3 of 6 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 10 10000 VDS=30V ID=20A 8000 Capacitance (pF) VGS (Volts) 8 6 4 Ciss 6000 4000 2 2000 0 0 Coss Crss 0 10 20 30 40 50 60 70 80 Qg (nC) Figure 7: Gate-Charge Characteristics 90 100 0 10 20 30 40 50 VDS (Volts) Figure 8: Capacitance Characteristics 600 1000.0 10µs RDS(ON) limited 100.0 TJ(Max)=175°C TC=25°C 10µs 100µs 500 1ms 10ms 10.0 Power (W) ID (Amps) 60 DC 1.0 TJ(Max)=175°C TC=25°C 300 0.1 0.0 0.01 0.1 17 5 2 10 400 1 10 100 1000 200 0.001 0.01 0.1 1 10 0 Pulse Width (s) 18 Figure 10: Single Pulse Power Rating Junction-to-Case VDS (Volts) Figure 9: Maximum Forward Biased Safe Operating Area (Note F) (Note F) ZθJC Normalized Transient Thermal Resistance 10 In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse D=Ton/T TJ,PK=TC+PDM.ZθJC.RθJC 40 RθJC=0.45°C/W 1 PD 0.1 Ton Single Pulse 0.01 0.00001 0.0001 T 0.001 0.01 0.1 1 10 Pulse Width (s) Figure 11: Normalized Maximum Transient Thermal Impedance (Note F) Rev.1.0 : August 2014 www.aosmd.com Page 4 of 6 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 400 TA=25°C 100 Power Dissipation (W) IAR (A) Peak Avalanche Current 1000 TA=100°C TA=150°C TA=125°C 10 300 200 100 0 1 10 100 1000 0 Time in avalanche, tA (µs) Figure 12: Single Pulse Avalanche capability (Note C) 25 50 75 100 125 150 175 TCASE (°C) Figure 13: Power De-rating (Note F) 1000 150 TA=25°C Power (W) Current rating ID(A) 120 90 60 100 17 5 2 10 10 30 1 0.001 0 0 25 50 75 100 125 150 0.1 10 175 TCASE (°C) Figure 14: Current De-rating (Note F) 1000 0 18 Pulse Width (s) Figure 15: Single Pulse Power Rating Junction-toAmbient (Note H) ZθJA Normalized Transient Thermal Resistance 10 D=Ton/T TJ,PK=TA+PDM.ZθJA.RθJA 1 In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse RθJA=60°C/W 40 0.1 PD 0.01 Ton Single Pulse 0.001 0.01 0.1 1 T 10 100 1000 Pulse Width (s) Figure 16: Normalized Maximum Transient Thermal Impedance (Note H) Rev.1.0 : August 2014 www.aosmd.com Page 5 of 6 Gate Charge Test Circuit & Waveform Vgs Qg 10V + + Vds VDC - Qgs Qgd VDC - DUT Vgs Ig Charge Resistive Switching Test Circuit & Waveforms RL Vds Vds 90% + Vdd DUT Vgs VDC - Rg 10% Vgs Vgs t d(on) tr t d(off) t on tf toff Unclamped Inductive Switching (UIS) Test Circuit & Waveforms L 2 E AR = 1/2 LIAR Vds BVDSS Vds Id + Vdd Vgs Vgs I AR VDC - Rg Id DUT Vgs Vgs Diode Recovery Test Circuit & Waveforms Q rr = - Idt Vds + DUT Vds - Isd Vgs Ig Rev.1.0 : August 2014 Vgs L Isd + Vdd t rr dI/dt I RM Vdd VDC - IF Vds www.aosmd.com Page 6 of 6