SG-BGA-6197 Ironwood Electronics

GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
45.225mm
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
A
1
Top View
45.225mm
2
Socket base: Black anodized Aluminum.
Thickness = 7.5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 4.0mm.
4
Recommended torque = 31 in lbs./
496 in oz.
4
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
5
9
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
3
Assembled
9.98mm +
IC thickness
2
8
6
Elastomer Guide: Cirlex or equivalent.
Thickness = 0.725mm.
7
Ball Guide: Kapton polyimide.
8
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 12.7mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10
Insulation Plate: FR4/G10, 1.59mm thick.
11
Backing Plate: Black anodized Aluminum.
Thickness = 6.35mm.
7
Side View
(Section AA)
10
6
11
Customer's
BGA IC
5
Customer's Target PCB
Scale: -
SG-BGA-6197 Drawing
Status: Released
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Drawing: J.Glab
Date: 10/27/06
File: SG-BGA-6197 Dwg
Modified: 7/21/09, AE
Rev: B
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 4
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
Recommended PCB Layout
Top View
1.25mm±0.13mm (x4)
1mm typ.
2.74mm*
1.25mm±0.13mm (x4)
1.99mm
2.54mm
Orientation Mark
2.36mm
Ø 0.85mm±0.025mm (x2)
Non plated alignment hole
Note: Full BGA
pattern shown.
Please adjust pattern
according to individual
requirements.
45.225mm±0.125mm(x4)
Socket size
Ø 0.635mm PAD
5.08mm
Ø 1.61mm±0.05mm (x8)
Non plated mounting hole
21.363mm(x8)
47.725mm sqr.
Backing plate size
Target PCB Recommendations
Total thickness: 2.4mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
NOTE: Steel backing plate may be required based on end user's application
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
Scale: 2:1
SG-BGA-6197 Drawing
Status: Released
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Drawing: J. Glab
Date:
File: SG-BGA-6197 Dwg
Modified: 7/21/09, AE
Rev: B
PAGE 2 of 4
Compatible BGA Spec
X
D
Y
3 Øb
Ø0.15 X Y
Ø0.08
E
e
Bottom View
5
0.20
Top View
Z
A1
A
Z
4
Array: 39x39
0.20
Side View
Z
1
Dimensions are in millimeters.
2
Interpret dimensions and tolerances
per ASME Y14.5M-1994.
3
Dimension b is measured at the
maximum solder ball diameter, parallel
to datum plane Z.
4
Datum Z (seating plane) is defined by
the spherical crowns of the solder balls.
5
Parallelism measurement shall exclude
any effect of mark on top surface of
package.
DIM
MIN
MAX
3.5
A
A1
0.6
0.3
b
0.70
D
40.0 BSC
E
40.0 BSC
e
1.0 BSC
Array: 39x39
Scale: 2:1
SG-BGA-6197 Drawing
Status: Released
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Drawing: J. Glab
Date: 10/27/06
File: SG-BGA-6197 Dwg
Modified: 7/21/09, AE
Rev: B
PAGE 3 of 4
2.5mm typ
1.27mm (x4)
2.5mm typ
21.3625mm±0.025mm (x8)
47.725mm
5mm
Ø 1.61mm±0.05mm (x8)
Top View
8.03mm
Note: Backing plate holes are tapped to accept 0-80 screws.
10mm Sqr.
22mm (x4)
47.725mm
Side View
1.59mm
Insulation Plate
6.35mm
Backing Plate
Description: Insulation Plate and Backing Plate
SG-BGA-6197 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Scale: 2:1
Rev: B
Drawing: J. Glab
Date: 10/27/06
File: SG-BGA-6197 Dwg
Modified: 7/21/09, AE
All dimensions are in mm.
All tolerences are +/- 0.125mm.
(Unless stated otherwise)
PAGE 4 of 4