SG-BGA-8000 Ironwood Electronics

GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
Top View
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
36.225mm
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
A
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 6.5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
5
Elastomer: 20 micron dia gold plated brass
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.5mm.
6
Elastomer Guide: Cirlex or equivalent.
Thickness = 0.475mm.
7
Ball Guide: Kapton polyimide.
8
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 15.875mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10
Insulation Plate: FR4/G10, Thickness = 1.59mm.
11
Backing Plate: Black anodized Aluminum.
Thickness = 6.35mm.
36.225mm
Recommended torque = 18 in lbs.
4
9
1
3
Assembled
8.25mm +
IC thickness
8
7
2
Side View
(Section AA)
10
6
11
SG-BGA-8000 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Customer's
BGA IC
5
Status: Released
Customer's Target PCB
Scale: -
Rev: C
Drawing: J. Glab
Date: 3/16/07
File: SG-BGA-8000 Dwg
Modified: 7/22/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications are
subject to change without notice.
PAGE 1 of 4
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
Recommended PCB Layout
Top View
Orientation Mark
1.25mm±0.13mm(x4)
1.25mm±0.13mm(x4)
2.61mm*
1mm typ.
2.36mm
2.54mm
Ø 0.85mm±0.025mm(x2)
Non plated alignment hole
36.225mm±0.125mm (x4)
Socket size
Ø 0.51mmxPAD
5.08mm
2.5mm±0.13mm
2.5mm±0.13mm
Ø 1.75mm±0.05mm(x8)
Non plated mounting hole
16.8625mm (x8)
38.725mm±0.125mm (x4)
Backing plate size
Target PCB Recommendations
Total thickness: 2.4mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
NOTE: Steel backing plate may be required based on end user's application
SG-BGA-8000 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
Scale: 2:1
Rev: C
Drawing: J. Glab
Date: 3/16/07
File: SG-BGA-8000 Dwg
Modified: 7/22/09, AE
PAGE 2 of 4
Compatible BGA Spec
D
X
DETAIL
Y
e
E
3
Øb
Ø0.25 Z X Y
Ø0.10
0.20
Dimensions are in millimeters.
2.
Interpret dimensions and tolerances per ASME
Y14.5M-1994.
3
Dimension b is measured at the maximum
solder ball diameter, parallel to datum plane Z.
4
Datum Z (seating plane) is defined by the
spherical crowns of the solder balls.
5
Parallelism measurement shall exclude any
effect of mark on top surface of package.
0.25 Z
A
A1
DIM
1.
5
DETAIL
Z
BOTTOM VIEW
SIDE VIEW
TOP VIEW
4
0.25 Z
MIN
MAX
3.42
A
A1
0.3
b
0.7
D
31.00 BSC
E
31.00 BSC
e
1.0 BSC
Array 30x30
SG-BGA-8000 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev: C
Drawing: J. Glab
Date: 3/16/07
File: SG-BGA-8000 Dwg
Modified: 7/22/09, AE
PAGE 3 of 4
2.5mm
1.27mm (x4)
2.5mm
16.863mm±0.025mm (x8)
Top View
38.725mm
Ø 1.61mm±0.05mm (x8)
Note: Backing plate holes are tapped to accept 0-80 screws.
10mm Sqr.
17mm (x4)
38.725mm
1.59mm
Insulation Plate
Side View
6.35mm
Backing Plate
Description: Insulation Plate and Backing Plate
Scale: -
SG-BGA-8000 Drawing
Status: Released
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Drawing: J. Glab
Date: 3/16/07
File: SG-BGA-8000 Dwg
Modified: 7/22/09, AE
Rev: C
PAGE 4 of 4