SG-BGA-6052 - Ironwood Electronics

GHz BGA Socket - Direct mount, solderless
Features
Top View
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
26.225mm
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
A
26.225mm
Side View
(Section AA)
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Compression screw: Black anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
5
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
6
Elastomer Guide: Non-clad FR4.
Thickness = 0.725mm.
7
Ball Guide: Kapton polyimide.
8
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 9.525mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10
Insulation Plate: FR4/G10, 1.59mm thick.
11
Backing Plate: Anodized Aluminum 6.35mm thick.
Recommended torque = 5 - 7 in lbs.
4
1
3
Assembled
8.25mm +
IC thickness
9
2
8
7
10
6
Customer's
BGA IC
SG-BGA-6052 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Suite 400, Burnsville MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
5
11
Customer's Target PCB
Status: Released
Scale: -
Rev: D
Drawing: H. Hansen
Date: 8/13/02
File: SG-BGA-6052 Dwg.mcd
Modified: 7/8/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 4
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
Recommended PCB Layout
Top View
1.25mm±0.13mm(x4)
2.74mm*
Orientation Mark
1mm typ.
1.25mm±0.13mm(x4)
2.36mm
2.54mm
Ø 0.85mm±0.025mm (x2)
Non-plated alignment hole
26.225mm±0.125mm(x4)
Socket size
5.08mm
Ø 0.51mm PAD
Note: Full BGA pattern shown.
Please adjust pattern according
to individual requirements.
Ø 1.61mm±0.05mm (x4)
Non-plated mounting hole
19mm(x4)
23.725mm(x4)
28.725mm sq. backing plate
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
NOTE: Steel backing plate may be required based on end user's application
SG-BGA-6052 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Suite 400, Burnsville MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
Status: Released
Scale: 2:1
Rev: D
Drawing: H. Hansen
Date: 8/13/02
File: SG-BGA-6052 Dwg.mcd
Modified: 7/8/09, AE
PAGE 2 of 4
Compatible BGA Spec
SIDE VIEW
(Reference Only)
TOP VIEW
(Reference Only)
Y
X
5
DETAIL
DETAIL
D
0.25 Z
A
Z
A1
0.15 Z
4
E
0.20
BOTTOM VIEW
(Reference Only)
Dimensions are in millimeters.
2.
Interpret dimensions and tolerances per ASME
Y14.5M-1994.
3
Dimension b is measured at the maximum
solder ball diameter, parallel to datum plane Z.
4
Datum Z (seating plane) is defined by the
spherical crowns of the solder balls.
5
Parallelism measurement shall exclude any
effect of mark on top surface of package.
e
3
DIM
1.
MIN
MAX
1.74
A
A1
0.55
0.45
b
0.63
D
21.00 BSC
E
21.00 BSC
e
1.0 BSC
Øb
Array 20x20
Ø0.25 Z X Y
Ø0.10
Scale: -
SG-BGA-6052 Drawing
Status: Released
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Suite 400, Burnsville MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Drawing: H. Hansen
Date: 8/13/02
File: SG-BGA-6052 Dwg.mcd
Modified: 7/8/09, AE
Rev: D
PAGE 3 of 4
28.73mm
2.5mm
1.27mm (x4)
2.5mm
Top View
28.73mm
23.725mm±0.025mm
3mm
6.5mm
6mm sqr.
Note: Backing plate holes are tapped to accept 0-80 screws.
14.94mm
23.725mm±0.025mm
1.59mm
Insulation Plate
Side View
6.35mm
Backing Plate
Description: Backing Plate with Insulation Plate
Scale: -
SG-BGA-6052 Drawing
Status: Released
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Suite 400, Burnsville MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Drawing: H. Hansen
Date: 8/13/02
File: SG-BGA-6052 Dwg.mcd
Modified: 7/8/09, AE
Rev: D
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 4 of 4