GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 36.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 1 2 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 36.225mm 4 Recommended torque = 14 in lbs./ 224 in oz. 5 4 1 9 3 Assembled 8.25mm + IC thickness 2 Side View (Section AA) 10 6 11 SG-BGA-6110 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Customer's BGA IC Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Cirlex or equivalent. Thickness = 0.725 mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 12.7mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Insulation Plate: FR4/G10, Thickness = 1.59mm. 11 Backing Plate: Black anodized Aluminum. Thickness = 6.35mm. 8 7 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 5 Status: Released Customer's Target PCB Scale: - Rev: C Drawing: H. Hansen Date: 4/8/04 File: SG-BGA-6110 Dwg Modified: 7/17/09, AE All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. Orientation Mark 1.25mm±0.13mm(x4) 1.25mm±0.13mm(x4) 3.27mm* Note: Maximum BGA pattern shown. Please adjust pattern according to individual requirements. 1.27mm typ. 2.54mm 2.89mm Ø 0.85mm±0.025mm(x2) Non plated alignment hole 36.225mm±0.125mm (x4) Socket size Ø 0.63mm (x423) pad 5.08mm Ø 1.61mm±0.05mm(x8) Non plated mounting hole 2.5mm±0.13mm 2.5mm±0.13mm 16.8625mm (x8) 38.725mm±0.125mm (x4) Backing plate size Target PCB Recommendations Total thickness: 2.4mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application SG-BGA-6110 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Scale: 2:1 Rev: C Drawing: H. Hansen Date: 4/8/04 File: SG-BGA-6110 Dwg Modified: 7/17/09, AE PAGE 2 of 4 Compatible BGA Spec D X DETAIL Y e E 3 Øb Ø0.25 Z X Y Ø0.10 0.20 BOTTOM VIEW TOP VIEW SIDE VIEW DETAIL 5 1. Dimensions are in millimeters. 0.20 Z 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. A A1 Z 4 0.2 Z 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. DIM MIN MAX 2.65 A A1 0.70 0.50 b 0.90 D 31.00 BSC E 31.00 BSC e 1.27 BSC Array 23x23 SG-BGA-6110 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: C Drawing: H. Hansen Date: 4/8/04 File: SG-BGA-6110 Dwg Modified: 7/17/09, AE PAGE 3 of 4 2.5mm 1.27mm (x4) 2.5mm 16.863mm±0.025mm (x8) 38.725mm 5mm Ø 1.61mm±0.05mm (x8) 5.53mm Note: Backing plate holes are tapped to accept 0-80 screws. Top View 10mm Sqr. 17mm (x4) 38.725mm 1.59mm Insulation Plate Side View 6.35mm Backing Plate Description: Insulation Plate and Backing Plate SG-BGA-6110 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: C Drawing: H. Hansen Date: 4/8/04 File: SG-BGA-6110 Dwg Modified: 7/17/09, AE PAGE 4 of 4