PAGE 1 of 4 - Ironwood Electronics

GHz BGA Socket - Direct mount, solderless
Top View
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
36.225mm
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
A
1
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
36.225mm
4
Recommended torque = 14 in lbs./
224 in oz.
5
4
1
9
3
Assembled
8.25mm +
IC thickness
2
Side View
(Section AA)
10
6
11
SG-BGA-6110 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Customer's
BGA IC
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
6
Elastomer Guide: Cirlex or equivalent.
Thickness = 0.725 mm.
7
Ball Guide: Kapton polyimide.
8
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 12.7mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10
Insulation Plate: FR4/G10, Thickness = 1.59mm.
11
Backing Plate: Black anodized Aluminum.
Thickness = 6.35mm.
8
7
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
5
Status: Released
Customer's Target PCB
Scale: -
Rev: C
Drawing: H. Hansen
Date: 4/8/04
File: SG-BGA-6110 Dwg
Modified: 7/17/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 4
Recommended PCB Layout
Top View
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
Orientation Mark
1.25mm±0.13mm(x4)
1.25mm±0.13mm(x4)
3.27mm*
Note: Maximum BGA pattern shown.
Please adjust pattern according
to individual requirements.
1.27mm typ.
2.54mm
2.89mm
Ø 0.85mm±0.025mm(x2)
Non plated alignment hole
36.225mm±0.125mm (x4)
Socket size
Ø 0.63mm (x423) pad
5.08mm
Ø 1.61mm±0.05mm(x8)
Non plated mounting hole
2.5mm±0.13mm
2.5mm±0.13mm
16.8625mm (x8)
38.725mm±0.125mm (x4)
Backing plate size
Target PCB Recommendations
Total thickness: 2.4mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
NOTE: Steel backing plate may be required based on end user's application
SG-BGA-6110 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
Scale: 2:1
Rev: C
Drawing: H. Hansen
Date: 4/8/04
File: SG-BGA-6110 Dwg
Modified: 7/17/09, AE
PAGE 2 of 4
Compatible BGA Spec
D
X
DETAIL
Y
e
E
3
Øb
Ø0.25 Z X Y
Ø0.10
0.20
BOTTOM VIEW
TOP VIEW
SIDE VIEW
DETAIL
5
1.
Dimensions are in millimeters.
0.20 Z
2.
Interpret dimensions and tolerances per ASME
Y14.5M-1994.
A
A1
Z
4
0.2 Z
3
Dimension b is measured at the maximum
solder ball diameter, parallel to datum plane Z.
4
Datum Z (seating plane) is defined by the
spherical crowns of the solder balls.
5
Parallelism measurement shall exclude any
effect of mark on top surface of package.
DIM
MIN
MAX
2.65
A
A1
0.70
0.50
b
0.90
D
31.00 BSC
E
31.00 BSC
e
1.27 BSC
Array 23x23
SG-BGA-6110 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev: C
Drawing: H. Hansen
Date: 4/8/04
File: SG-BGA-6110 Dwg
Modified: 7/17/09, AE
PAGE 3 of 4
2.5mm
1.27mm (x4)
2.5mm
16.863mm±0.025mm (x8)
38.725mm
5mm
Ø 1.61mm±0.05mm (x8)
5.53mm
Note: Backing plate holes are tapped to accept 0-80 screws.
Top View
10mm Sqr.
17mm (x4)
38.725mm
1.59mm
Insulation Plate
Side View
6.35mm
Backing Plate
Description: Insulation Plate and Backing Plate
SG-BGA-6110 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev: C
Drawing: H. Hansen
Date: 4/8/04
File: SG-BGA-6110 Dwg
Modified: 7/17/09, AE
PAGE 4 of 4