GHz MLF Socket - Direct mount, solderless Top View Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly IC guide prevents over compression of elastomer 12.225mm Easily removable swivel socket lid A A Side View (Section AA) 12.225mm Recommended torque = 0.375 in. lbs. (6 in. oz.) 4 1 1 Socket Li d: Bla ck a nodized Alu mi num. Thickn ess = 2.5mm. 2 Socket ba se : Black a nodized Alumin um. Thickn ess = 3mm. 3 Compression Plate: B lack ano dize d A luminum. Thickn ess = 1.5mm. 4 Compression screw: Clear an odized Aluminu m. Thickn ess = 5mm, Hex socke t = 3mm. 5 Ela stomer: 2 0 micron dia go ld plated brass filaments ar ranged symmetrically in a silicone rub ber (63.5 degre e a ngle). Thickn ess = 0.5mm. 6 Ela stomer Guid e: Cirlex Thickn ess = 0.475mm. 7 IC (MLF) G uide: To rlon 8 Socket ba se screw: Socket hea d cap , Allo y stee l with bla ck o xid e finish, 0- 80 fin e thre ad , 9.525mm long. 9 Socket lid screw: Shou lder screw, 1 8-8 SS, 0 -80 fine thread . 9 3 Assembled 6.95mm + IC thickness 2 8 7 10 11 6 10 5 Customer's MLF SG-MLF-7021 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Ste 400 Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com 11 Socket ba se nu t: 18-8 Stainle ss steel, 0-80 fine th read. Nylo n washer: 1.73mm ID; 4.78mm O D 0.64mm thickness. Customer's Target PCB Status: Released Scale: - Rev: E Drawing: J. Glab Date: 2/19/07 File: SG-MLF-7021 Dwg.mcd Modified: 11/11/14, DH All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 3 Recommended PCB Layout Top View *Note: MLF pattern is not symmetrical with respect to the mounting holes. It is offset 0.25mm to the right of center. Orientation Mark 4.034mm* 1.25mm±0.125mm (x4) Ø 1.61mm±0.05mm(x4) Non plated mounting hole 2mm 1.25mm±0.125mm (x4) Ø 0.85mm±0.025mm (x2) Non plated alignment hole 3.863mm 0.4mm typ. 12.225mm±0.125mm Socket Body Size 2.23mm 3mm 0.45 x 0.23mm pad (x 12) 1.7mm 2.6025mm 1.2 mm x 1.9 mm thermal /GND pad 9.725mm (x4) 12.225mm±0.125mm Socket Body Size Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask MLF12E **** To effectively conduct heat away from the package a thermal pad is recommended with vias spaced 1.0 to 1.2 mm pitch and a diameter of 0.3 to 0.33 mm. Ideally 1 via for every 3 leads has been shown to work well. NOTE: Steel backing plate may be required based on end user's application All dimensions are in mm. Recommended PCB Layout Tolerances: ±0.025mm unless stated otherwise. SG-MLF-7021 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Ste 400 Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: 3:1 Rev: E Drawing: J. Glab Date: 2/19/07 File: SG-MLF-7021 Dwg.mcd Modified: 11/11/14, DH PAGE 2 of 3 Compatible QFN IC Drawing 0.55mm 1.2mm 2.5mm 0.2mm 2.5mm 1.9mm 0.2mm 0.35mm Top View SG-MLF-7021 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Ste 400 Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Side View Status: Released Bottom View Scale: 15:1 Rev:E Drawing: J. Glab Date: 2/19/07 File: SG-MLF-7021 Dwg.mcd Modified: 11/11/14, DH PAGE 3 of 3