SG-MLF-7021 Ironwood Electronics

GHz MLF Socket - Direct mount, solderless
Top View
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
IC guide prevents over compression of elastomer
12.225mm
Easily removable swivel socket lid
A
A
Side View
(Section AA)
12.225mm
Recommended torque = 0.375 in. lbs.
(6 in. oz.)
4
1
1
Socket Li d: Bla ck a nodized Alu mi num.
Thickn ess = 2.5mm.
2
Socket ba se : Black a nodized Alumin um.
Thickn ess = 3mm.
3
Compression Plate: B lack ano dize d A luminum.
Thickn ess = 1.5mm.
4
Compression screw: Clear an odized Aluminu m.
Thickn ess = 5mm, Hex socke t = 3mm.
5
Ela stomer: 2 0 micron dia go ld plated brass
filaments ar ranged symmetrically in a silicone
rub ber (63.5 degre e a ngle).
Thickn ess = 0.5mm.
6
Ela stomer Guid e: Cirlex
Thickn ess = 0.475mm.
7
IC (MLF) G uide: To rlon
8
Socket ba se screw: Socket hea d cap , Allo y stee l with
bla ck o xid e finish, 0- 80 fin e thre ad , 9.525mm long.
9
Socket lid screw: Shou lder screw, 1 8-8 SS, 0 -80 fine
thread .
9
3
Assembled
6.95mm +
IC thickness
2
8
7
10
11
6
10
5
Customer's
MLF
SG-MLF-7021 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Ste 400 Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
11
Socket ba se nu t: 18-8 Stainle ss steel, 0-80 fine th read.
Nylo n washer: 1.73mm ID; 4.78mm O D
0.64mm thickness.
Customer's Target PCB
Status: Released
Scale: -
Rev: E
Drawing: J. Glab
Date: 2/19/07
File: SG-MLF-7021 Dwg.mcd
Modified: 11/11/14, DH
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 3
Recommended PCB Layout
Top View
*Note: MLF pattern is not symmetrical with
respect to the mounting holes. It is offset
0.25mm to the right of center.
Orientation Mark
4.034mm*
1.25mm±0.125mm (x4)
Ø 1.61mm±0.05mm(x4)
Non plated mounting hole
2mm
1.25mm±0.125mm (x4)
Ø 0.85mm±0.025mm (x2)
Non plated alignment hole
3.863mm
0.4mm typ.
12.225mm±0.125mm
Socket Body Size
2.23mm
3mm
0.45 x 0.23mm pad (x 12)
1.7mm
2.6025mm
1.2 mm x 1.9 mm thermal /GND pad
9.725mm (x4)
12.225mm±0.125mm
Socket Body Size
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
MLF12E
**** To effectively conduct heat away from the package a
thermal pad is recommended with vias spaced
1.0 to 1.2 mm pitch and a diameter of 0.3 to 0.33 mm.
Ideally 1 via for every 3 leads has been shown to work well.
NOTE: Steel backing plate may be required based on end user's application
All dimensions are in mm.
Recommended PCB Layout Tolerances: ±0.025mm unless stated otherwise.
SG-MLF-7021 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Ste 400 Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Scale: 3:1
Rev: E
Drawing: J. Glab
Date: 2/19/07
File: SG-MLF-7021 Dwg.mcd
Modified: 11/11/14, DH
PAGE 2 of 3
Compatible QFN IC Drawing
0.55mm
1.2mm
2.5mm
0.2mm
2.5mm
1.9mm
0.2mm
0.35mm
Top View
SG-MLF-7021 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Ste 400 Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Side View
Status: Released
Bottom View
Scale: 15:1
Rev:E
Drawing: J. Glab
Date: 2/19/07
File: SG-MLF-7021 Dwg.mcd
Modified: 11/11/14, DH
PAGE 3 of 3