GHz MLF Socket - Direct mount, solderless Top View Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly IC guide prevents over compression of elastomer 12.225mm Easily removable swivel socket lid A A Side View (Section AA) 12.225mm Recommended torque = 1.0 in. lb. (16 in. oz.) 4 1 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 3mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 1.5mm. 4 Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 3mm. 5 Elastomer: 20 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.5mm. 6 Elastomer Guide: Cirlex Thickness = 0.475mm. 7 IC (MLF) Guide: Torlon 8 Socket base screw: Socket head cap, Alloy steel with black oxide finish, 0-80 fine thread , 9.525mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 9 3 Assembled 6.95mm + IC thickness 2 8 7 10 11 6 10 5 Customer's MLF SG-MLF-7005 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com 11 Socket base nut: 18-8 Stainless steel, 0-80 fine thread. Nylon washer: 1.73mm ID; 4.78mm OD 0.64mm thickness. Customer's Target PCB Status: Released Scale: - Rev: J Drawing: H. Hansen Date: 10/22/02 File: SG-MLF-7005 Dwg.mcd Modified: 05/12/14, DH All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 3 *Note: MLF pattern is not symmetrical with respect to the mounting holes. It is offset 0.25mm to the right of center. Recommended PCB Layout Top View Orientation Mark C* 1.25mm±0.125mm (x4) 1.25mm±0.125mm (x4) B Z2 max Socket Body Size +0.025mm (x2) - 0.025mm Non plated alignment hole e typ. Ø 0.85mm 2mm A2 max YxX pad (x N) 3mm +0.05mm (x4) - 0.05mm Non plated mounting hole Ø 1.61mm A1 max Z1 max 9.725mm (x4) 12.225mm±0.125mm (x4) **** To effectively conduct heat away from the package a thermal pad is recommended with vias spaced 1.0 to 1.2 mm pitch and a diameter of 0.3 to 0.33 mm. Ideally 1 via for every 3 leads has been shown to work well. Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application SG-MLF-7005 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: 3:1 Rev: J Drawing: H. Hansen Date: 10/22/02 File: SG-MLF-7005 Dwg.mcd Modified: 05/12/14, DH PAGE 2 of 3 Package Code MLF36A MLF40A MLF28B C 2.97 2.72 2.98 B 1.68 1.68 1.68 Z1 max A1 max Z2 max A2 max 6.36 4.28 6.36 4.28 6.36 4.78 6.36 4.78 6.36 4.27 6.36 4.27 MLF20C MLF48G 3.3 2.813 1.68 1.763 6.36 6.2 3.62 4.6 6.36 6.2 MLF32D 2.663 1.72 6.29 4.9 6.29 e 0.5 0.5 0.65 X 0.28 0.28 0.37 Y 0.94 0.69 0.95 N 36 40 28 Thermal Pad Recommendations 4.08 x 4.08 4.58 x 4.58 3.08 x 3.08 3.62 4.6 0.8 0.4 0.42 0.2 1.06 0.6 20 48 3.84 x 3.84 4.1 x 4.1 4.9 0.65 0.35 0.6 32 4.3 x 4.3 D min 5.85 5.85 5.85 5.85 5.85 5.85 D max 6.15 6.15 6.15 6.15 6.15 6.15 E min 5.85 5.85 5.85 5.85 5.85 5.85 E max 6.15 6.15 6.15 6.15 6.15 6.15 b min 0.18 0.18 0.23 0.28 0.15 0.25 Recommended PCB Layout Tolerances: ±0.025mm unless stated otherwise. All dimensions are in mm. D Package Code MLF36A MLF40A MLF28B MLF20C MLF48G MLF32D D2 L D2 e 0.5 0.5 0.65 0.8 0.4 0.65 b max 0.3 0.3 0.35 0.4 0.25 0.35 L min 0.5 0.3 0.5 0.5 0.3 0.35 L max 0.75 0.5 0.75 0.75 0.5 0.45 D2 4.18 4.68 4.17 3.94 4.1 4.3 N 36 40 28 20 48 32 b E e L D SG-MLF-7005 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: 3:1 Rev: j Drawing: H. Hansen Date: 10/22/02 File: SG-MLF-7005 Dwg.mcd Modified:05/12/14, DH PAGE 3 of 3