GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 50.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 50.225mm Recommended torque = 40 in lbs./ 640 in oz. 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 6.5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Ultem. Thickness = 0.725mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, Alloy steel with black oxide finish, 0-80 fine thread , 15.815mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Insulation Plate: FR4/G10, Thickness = 1.59mm. 11 Backing Plate: Black anodized Aluminum. Thickness = 6.35mm. 4 1 9 3 Assembled 10.11mm + IC thickness 2 8 7 Side View (Section AA) 10 6 11 SG-BGA-6296 Drawing © 2010 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Customer's BGA IC 5 Customer's Target PCB Status: Released Scale: - Rev: A Drawing: Vinayak R Date: 1/14/09 File: SG-BGA-6296 Dwg Modified: All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. 1.25mm±0.13mm (x4) Orientation Mark *2.7375mm 1mm typ. 1.25mm±0.13mm (x4) 2.54mm 2.3625mm Ø 0.85mm±0.025mm (x2) Non plated alignment hole Ø 0.5mm (1936 xPAD) 50.225mm±0.125mm (x4) Socket Size Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. 5.08mm Ø 1.71mm±0.1mm (x8) Non plated mounting hole 2.5mm±0.13mm 2.5mm±0.13mm Target PCB Recommendations Total thickness: 2.4mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask 23.8625mm±0.025mm (x8) 52.725mm±0.125mm (x4) Backing plate size NOTE: Steel backing plate may be required based on end user's application SG-BGA-6296 Drawing © 2010 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Status: Released Scale: -2:1 Rev: A Drawing: Vinayak R Date: 1/14/09 File: SG-BGA-6296 Dwg Modified: PAGE 2 of 4 Compatible BGA Spec X D Y DETAIL e E 3 Øb Ø0.25 Z X Y Ø0.10 Z 0.20 5 TOPDETAIL VIEW BOTTOM VIEW SIDE VIEW 0.25 Z 1 Dimensions are in millimeters. 2 Interpret dimensions and tolerances per ASME Y14.5M-1994. A 3 A1 Z 4 SG-BGA-6296 Drawing © 2010 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com 0.2 Z Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. Status: Released Scale: - DIM MIN MAX A 2.80 3.60 A1 0.4 0.6 b 0.50 0.70 D 45.00 BSC E 45.00 BSC e 1.00 BSC Array: 44x44 Rev: A Drawing: Vinayak R Date: 1/14/09 File: SG-BGA-6296 Dwg Modified: PAGE 3 of 4 2.5mm 1.27mm (x4) 2.5mm Top View 23.8625mm±0.05mm 52.725mm Ø 1.61mm±0.05mm (x8) Drill thru Note: Backing plate holes are tapped to accept 0-80 screws. 10mm Sqr. 31.1mm (x4) 52.725mm Side View 1.59mm Insulation Plate 6.35mm Backing Plate Description: Insulation Plate and Backing Plate SG-BGA-6296 Drawing © 2010 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - 1:0.6 Rev: A Drawing: Vinayak R Date: 1/14/09 File: SG-BGA-6296 Dwg Modified: All dimensions are in mm. All tolerences are +/- 0.125mm. (Unless stated otherwise) PAGE 4 of 4