GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer 17.225mm Easily removable swivel socket lid A A 17.225mm Side View (Section AA) 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Non-clad FR4. Thickness = 0.725mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, Alloy steel with black oxide finish, 0-80 fine thread , 9.525mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Socket base nut: 18-8 Stainless steel, 0-80 fine thread. 11 Nylon washer: 1.73mm ID; 4.78mm OD 0.64mm thickness. Recommended torque = 1 in lbs. 4 1 9 3 Assembled 8.25mm + IC thickness 2 8 7 6 10 5 Customer's BGA IC SG-BGA-6001 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com 11 Customer's Target PCB Status: Released Scale: - Rev: F Drawing: Ila Pal Date: 8/14/01 File: SG-BGA-6001 Dwg.mcd Modified: 6/12/09, AE All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 3 *Note: BGA pattern is not symmetrical with respect to the mounting holes. Recommended PCB Layout Top View Orientation Mark 1.25mm±0.125mm(x4) 0.8mm typ. 1.25mm±0.125mm(x4) Socket Body Size 2.538mm* 2.163mm 2.54mm Ø 0.85mm±0.025mm (x2) Alignment Hole Ø 0.36mmPAD 5.08mm Ø 1.61mm±0.05mm(x4) Mounting Hole 9.95mm 14.725mm(x4) 17.225mm±0.125mm (x4) Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application SG-BGA-6001 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Scale: 3:1 Rev: F Drawing: Ila Pal Date: 8/14/01 File: SG-BGA-6001 Dwg.mcd Modified: 6/12/09, AE PAGE 2 of 3 Compatible BGA Spec DETAIL X 5 0.20 Z DETAIL D Y A Z A1 0.15 Z 4 E 0.20 TOP VIEW SIDE VIEW DIM MIN MAX 2.5 A e 3 Øb Ø0.25 Z X Y Ø0.10 BOTTOM VIEW SG-BGA-6001 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com A1 1 Dimensions are in millimeters. 2 Interpret dimensions and tolerances per ASME Y14.5M-1994. 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. Status: Released Scale: - 0.34 0.2 b 0.50 D 12.00 BSC E 12.00 BSC e 0.80 BSC Array 14x14 Rev: F Drawing: Ila Pal Date: 8/14/01 File: SG-BGA-6001 Dwg.mcd Modified: 6/12/09, AE PAGE 3 of 3