GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 40.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 6.5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 40.225mm Side View (Section AA) Recommended torque = 24 in lbs. 4 1 5 9 3 Assembled 8.25mm + IC thickness Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Cirlex or equivalent. Thickness = 0.75mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 9.525mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Insulation Plate: FR4/G10, 1.59mm thick. 11 Backing Plate: Black anodized Aluminum. Thickness = 6.35mm. 2 8 7 10 6 11 SG-BGA-6046 Drawing © 2002 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Customer's BGA IC 5 Status: Released Customer's Target PCB Scale: - Rev: F Drawing: H. Hansen Date: 4/17/02 File: SG-BGA-6046 Dwg.mcd Modified: 5/19/09 All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View Note: BGA pattern is not symmetrical with respect to the mounting holes. 1.25mm±0.13mm typ. Orientation Mark 2.74mm 33mm 1mm typ. 1.25mm±0.13mm typ. 2.36mm 2.54mm Ø 0.85mm±0.025mm (x2) Non plated alignment hole 40.225mm±0.125mm typ. (socket body) 33mm Ø 0.51mm PAD 5.08mm 2.5mm±0.13mm Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. 2.5mm±0.13mm 18.863mm(x8) Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask 42.725mm±0.125mm (x4) (Backing Plate size) NOTE: Steel backing plate may be required based on end user's application SG-BGA-6046 Drawing © 2002 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Ø 1.61mm±0.05mm (x8) Non plated mounting hole Status: Released Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Scale: - Rev: F Drawing: H. Hansen Date: 4/17/02 File: SG-BGA-6046 Dwg.mcd Modified: 5/19/09 PAGE 2 of 4 Compatible BGA Spec DETAIL Y D X e E 3 Øb Ø0.25 Z X Y Ø0.10 0.20 TOP VIEW SIDE VIEW BOTTOM VIEW 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 5 DETAIL 0.20 Z 3 A A1 Z 4 DIM Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. 0.2 Z MIN MAX A 3.4 A1 0.4 0.6 b 0.5 0.7 D 35.0 BSC E 35.0 BSC e 1.00 BSC Array 34x34 SG-BGA-6046 Drawing © 2002 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Scale: - Rev: F Drawing: H. Hansen Date: 4/17/02 File: SG-BGA-6046 Dwg.mcd Modified: 5/19/09 PAGE 3 of 4 2.5mm 2.5mm Top View 1.27mm (x4) 9.34mm(x4) 18.863mm±0.025mm(x8) 42.725mm Ø 1.61mm±0.05mm (x8) Note: Backing plate holes are tapped to accept 0-80 screws. 10mm Sqr. 20mm (x4) 42.725mm Side View 1.59mm Insulation Plate Backing Plate 6.35mm Description: Insulation Plate and Backing Plate SG-BGA-6046 Drawing © 2002 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Scale: - Rev: F Drawing: H. Hansen Date: 4/17/02 File: SG-BGA-6046 Dwg.mcd Modified: 5/19/09 PAGE 4 of 4