GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 40.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 40.225mm 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Recommended torque = 9 in lbs./ 144 in oz. 5 4 1 9 3 Assembled 8.25mm + IC thickness 2 8 Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Cirlex or equivalent. Thickness = 0.75mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 12.7mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Insulation Plate: FR4/G10, Thickness = 1.59mm. 11 Backing Plate: Black anodized Aluminum. Thickness = 6.35mm. 7 Side View (Section AA) 10 6 11 SG-BGA-6038 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Customer's BGA IC 5 Customer's Target PCB Status: Released Scale: - Rev: E Drawing: H. Hansen Date: 3/11/02 File: SG-BGA-6038 Dwg Modified: 6/15/09, AE All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 3 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. 1.25mm±0.13mm(x4) Orientation Mark 31.75mm 1.25mm±0.13mm(x4) 3.36mm* 1.27mm typ. 2.54mm 2.99mm Ø 0.85mm±0.025mm (x2) Non plated alignment hole 40.225mm±0.125mm (x4) Socket size Ø 0.635mmxPAD 5.08mm 2.5mm±0.13mm Ø 1.61mm±0.05mm (x8) Non plated mounting hole 2.5mm±0.13mm 18.863mm (x8) 42.725mm±0.125mm (x4) Backing plate size Target PCB Recommendations Total thickness: 2.4mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application SG-BGA-6038 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Scale: 2:1 Rev: E Drawing: H. Hansen Date: 3/11/02 File: SG-BGA-6038 Dwg Modified: 6/15/09, AE PAGE 2 of 3 Compatible BGA Spec X D Y 11.25mm (x8) DETAIL e E 3 Øb Ø0.25 Z X Y Ø0.10 Z 0.20 5 DETAIL BOTTOM VIEW SIDE VIEW TOP VIEW 0.25 Z 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3 A A1 Z 4 DIM Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. 0.2 Z MIN MAX 1.7 A A1 0.5 0.7 b 0.9 D 35.0 BSC E 35.0 BSC e 1.27 BSC Array 26x26 SG-BGA-6038 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: E Drawing: H. Hansen Date: 3/11/02 File: SG-BGA-6038 Dwg Modified: 6/15/09, AE PAGE 3 of 4 2.5mm 2.5mm 1.27mm (x4) Top View 18.863mm±0.025mm (x8) 42.725mm 5mm Ø 1.61mm±0.05mm (x8) 7.03mm Note: Backing plate holes are tapped to accept 0-80 screws. 10mm Sqr. 20mm (x4) 42.725mm Side View 1.59mm Insulation Plate Backing Plate 6.35mm Description: Insulation Plate and Backing Plate SG-BGA-6038 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: E Drawing: H. Hansen Date: 3/11/02 File: SG-BGA-6038 Dwg Modified: 6/15/09, AE All dimensions are in mm. All tolerences are +/- 0.125mm. (Unless stated otherwise) PAGE 4 of 4