GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer Easily removable swivel socket lid 15.225mm A 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Cirlex Thickness = 0.725mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 9.525mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. A Top View 15.225mm Recommended torque = 1 in lbs. 4 1 9 3 Assembled 8.25mm + IC thickness 2 8 12 7 10 Side View (Section AA) 11 11 10 6 Customer's BGA IC SG-BGA-6079 Drawing © 2003 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Socket base nut: 18-8 Stainless steel, 0-80 fine thread. Nylon washer: 1.73mm ID; 4.78mm OD 0.64mm thickness. 5 12 Customer's Target PCB Status: Released Scale: - Rev: D Drawing: Heidi Hansen Date: 3/31/03 File: SG-BGA-6079 Dwg.mcd Modified: 03/31/14, DH IC Guide: Torlon. All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 3 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. Orientation Mark Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. 0.8mm typ. 3.1375mm 2.3875mm 2.7625mm 2.54mm Ø 0.85mm±0.025mm(x2) Non plated alignment hole 15.225mm±0.125mm sqr. Socket size Ø 0.43mm PAD 5.08mm Ø 1.61mm±0.05mm(x4) Non plated mounting hole 1.25mm±0.13mm 1.25mm±0.13mm 12.725mm±0.125mm (x4) Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. SG-BGA-6079 Drawing © 2003 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Scale: 4:1 Rev:D Drawing: Heidi Hansen Date: 3/31/03 File: SG-BGA-6079 Dwg.mcd Modified: 03/31/14, DH PAGE 2 of 3 Compatible BGA Spec. X Y D Øb Ø0.15 X Y Ø0.08 E e Top View Bottom View A1 0.20 Z 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. A Z 0.10 Z Side View SG-BGA-6079 Drawing © 2003 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Array: 10x10 Status: Released Scale: - DIM MIN MAX 1.10 A A1 0.25 0.35 b 0.45 D 9.0 BSC E 9.0 BSC e 0.8 BSC Rev: D Drawing: Heidi Hansen Date: 3/31/03 File: SG-BGA-6079 Dwg.mcd Modified: 03/31/14, DH PAGE 3 of 3