LOGIC Devices Green Initiative ROHS Policy LOGIC Devices Incorporated – Green Initiative – Rev. C (4/01/13) 1 Table of Contents LOGIC Devices’ Green Initiative ....................................................................................... 3 Key Initiative Points ....................................................................................................... 3 FAQ..................................................................................................................................... 4 MSL (Moisture Sensitivity Level) for package families: ................................................... 4 Package BOM: .................................................................................................................... 4 Green Product Offering....................................................................................................... 5 Banned Substances Report on Green BGA Package .......................................................... 6 Banned Substances Report on Green QFP Packages .......................................................... 7 Pb-Free Solder Reflow Parameters ..................................................................................... 8 LOGIC Devices Incorporated – Green Initiative – Rev. C (4/01/13) 2 LOGIC Devices’ Green Initiative The electronics industry is continuing to embrace environmental initiatives to reduce the level of certain materials contained in electronic components and systems. LOGIC has adopted standards for hazardous materials use that comply with European Union directives (RoHS and WEEE) and the corporate initiatives of our Japanese customers. LOGIC has committed to the introduction of Pb-free and Green packages for our products. Our strategy is to introduce Pb-free, Green packages that are fully compatible with our customers existing assembly processes as well as Pb-free assembly processes, thereby allowing our customers to transition to Pb-free assembly according to their own requirements. LOGIC also continues to work with our supply chain to ensure that products are manufactured and delivered with materials that are not only robust but also provide forward compliance to environmental initiatives. Implementing these solutions will allow us to continue to meet the needs of our global customers as well as fulfilling our responsibilities to the global community as a whole. Key Initiative Points Qualified packages to their current JEDEC moisture level classification at 260°C reflow. LOGIC Devices’ Lead-free products are full Green, which is a step above RoHS Standard (non-Green) and Green products will be offered, providing flexibility to those customers not yet ready for conversion All Lead-free orders will be filled with Green products RoHS Definition (Lead-free + Below) Lead(Pb)<1000ppm Mercury(Hg) <1000 ppm Hexavalent Chromium(Cr+6) <1000 ppm Cadmium(Cd) <100ppm Polybrominated biphenyl (PBB) <1000 ppm Polybrominated diphenyl ether (PBDE) <1000 ppm LOGIC Devices Incorporated – Green Initiative – Rev. C (4/01/13) 3 FAQ Do Green products have different part numbers? Yes, LOGIC Devices’ Green products have a "G" suffix after package code on the standard part number. All Green device packages will have “G” suffix on the marked product number. Example: - Standard part number: LF3320QC12 - Green part number: LF3320QC12G Does your process have whisker mitigation control? Yes, our packaging supplier’s flow includes an annealing process. Are LOGIC Devices Green parts ROHS compliant? Yes, all LOGIC Devices Green devices are fully ROHS compliant. What qualifications have been done? LOGIC Devices Green packages comply with the most current JEDEC JSTD-020 standard for peak reflow temperature (260°C for small packages, 250 C for medium size packages, and 245°C for large size packages. Size is defined in JEDEC J-STD-020). Reliability tests include Temperature Cycle, Autoclave and Temperature/Humidity under the standard test conditions. LOGIC Devices relies on the qualification process completed at our package supplier and on their certificate of compliance. Data for these tests are available upon request. Although LOGIC Devices parts are MSL 3 when shipped, we suggest that Pb-free devices are baked prior to reflow to ensure that no moisture-induced cracking or “popcorn effect” occurs. MSL (Moisture Sensitivity Level) for package families: Package Family MSL (standard) MSL (Green) PQFP 3 3 BGA 3 3 Package BOM: Package Mold Compound Die Epoxy Substrate Lead Finish PQFP Sumitomo EME-G770J Ablebond 2288A -- 100% Sn BGA Sumitomo EME-G770J Ablebond 2100A BT Resin Sn-4%Ag-0.5%Cu LOGIC Devices Incorporated – Green Initiative – Rev. C (4/01/13) 4 Green Product Offering PART # L2330QC25G LF2242JC25G LF2242QC25G LF2250QC25G LF2272QC25G LF3304QC10G LF3304QC12G LF3304QC15G LF3310QC12G LF3311QC9G LF3320QC12G LF3320QC15G LF3330QC12G LF3347QC12G LF3347QC15G LF43168JC15G LF43168QC15G LF48410JC25G LMA2010JC25G LMU217JC25G L9D2xxxMxxSBG5G L9D364M64SBG2G L9D3xxxM32DBG2G L9D3256MxxSBG2G L9D3xxxM32SBG1G COMPLIANCE RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant LOGIC Devices Incorporated – Green Initiative – Rev. C (4/01/13) 5 Banned Substances Report on Green BGA Package Item Component Mold Compound Cd EME-G700A Cr+6 Hg Pb PBB PBDE Epoxy Cd Ablebond 2100A Cr+6 Hg Pb PBB PBDE Soluble Lead (Pb) Soluble Antimony (Sb) Soluble Arsenic (As) Soluble Barium (Ba) Soluble Cadmium (Cd) Soluble Chromium (Cr) Soluble Mercury (Hg) Soluble Selenium (Se) • • • • MDL 2 2 2 2 0.0005% 0.0005% 2 2 2 2 0.0005% 0.0005% 5 5 2.5 10 5 5 5 5 ppm N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. <5 <5 <2.5 <10 <5 <5 <5 <5 N.D.: Not Detected (<MDL) MDL: Method Detection Limit Taken from SGS test reports All measurements in PPM unless otherwise noted LOGIC Devices Incorporated – Green Initiative – Rev. C (4/01/13) 6 Banned Substances Report on Green QFP Packages Item Component Mold Compound Cd EME-G700A Cr+6 Hg Pb PBB PBDE Epoxy Cd Ablebond 2288A Cr+6 Hg Pb PBB PBDE Soluble Lead (Pb) Soluble Antimony (Sb) Soluble Arsenic (As) Soluble Barium (Ba) Soluble Cadmium (Cd) Soluble Chromium (Cr) Soluble Mercury (Hg) Soluble Selenium (Se) • • • • MDL 2 2 2 2 0.0005% 0.0005% 2 2 2 2 0.0005% 0.0005% 5 5 2.5 10 5 5 5 5 ppm N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. <5 <5 <2.5 <10 <5 <5 <5 <5 N.D.: Not Detected (<MDL) MDL: Method Detection Limit Taken from SGS test reports All measurements in PPM unless otherwise noted LOGIC Devices Incorporated – Green Initiative – Rev. C (4/01/13) 7 Pb-Free Solder Reflow Parameters NEMI Recommended Convection or IR 260 oC Reflow Profile Ramp rate 217 oC to peak Preheat temperature 150 oC (+/- 25 oC) Time 50 oC to peak Temperature Temperature maintained above 217 oC Time within 5 oC of actual Peak Temperature Peak Temp range Ramp-down rate 3 oC/sec max 60 to 120 seconds max 3.5 minutes, 6 minutes max 60 to 150 seconds 10~20 seconds 260 oC (-5/+0) oC 6 oC/second max T E TIME TE Measurem ent point PEAK TEMP than 220.0 ºC Position Time higher than 0 ºC Time higher TE LOGIC Devices Incorporated – Green Initiative – Rev. C (4/01/13) 8