Document No.001-68976 Rev. *B ECN # 4749347 Cypress Semiconductor Package Qualification Report QTP# 034503 VERSION *B April 2015 All Plastic & Thermally Enhanced Quad Flatpacks Pb-Free, MSL3, 260C Reflow ASEK-Taiwan Assembly FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.001-68976 Rev. *B ECN # 4749347 PACKAGE QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 034503 Qualify All Plastic & Thermally Enhanced Quad Flatpacks, PbFree, MSL3, 260C Reflow using G700A MC, CRM1076DS epoxy and Matte Tin Plating with Annealing Process (150C, 1hr) ssembled @ASEK-Taiwan Jan 04 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Document No.001-68976 Rev. *B ECN # 4749347 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: N52 Package Outline, Type, or Name: 52-lead Plastic Quad Flatpack (PQFP) Mold Compound Name/Manufacturer: G700A Mold Compound Flammability Rating: V-O per UL94 Oxygen Rating Index: >28% None Lead Frame Material: Alloy42 Substrate Material: N/A Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Sawing Die Attach Supplier: CRM Die Attach Material: 1076DS Bond Diagram Designation 10-02869 Wire Bond Method: Thermosonic Wire Material/Size: 1.0 mil / Au Thermal Resistance Theta JA C/W: 96°C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 49-41999 Name/Location of Assembly (prime) facility: ASEK-Taiwan MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Cypress Philippines (CML-R) Fault Coverage: 100% Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No.001-68976 Rev. *B ECN # 4749347 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: NT208 Package Outline, Type, or Name: 208-lead Thermally Enhanced Quad Flatpack (EQFP) Mold Compound Name/Manufacturer: G700A Mold Compound Flammability Rating: V-O per UL94 Oxygen Rating Index: >28% None Lead Frame Material: Copper Substrate Material: N/A Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Sawing Die Attach Supplier: CRM Die Attach Material: 1076DS Wire Bond Method: Thermosonic Wire Material/Size: 1.0 mil / Au Thermal Resistance Theta JA C/W: 96°C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 49-41999 Name/Location of Assembly (prime) facility: ASEK-Taiwan MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Cypress Philippines (CML-R) Fault Coverage: 100% Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 Document No.001-68976 Rev. *B ECN # 4749347 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Temperature Operating Life Test Condition (Temp/Bias) Result P/F Dynamic Operating Condition, Vcc Max = 7V, 150C P Dynamic Operating Condition, Vcc Max = 7V, 150C P MIL-STD-883C, Method 1010, Condition C, -65C to 150C Precondition: JESD22 Moisture Sensitivity MSL 3 P Early Failure Rate High Temperature Operating Life Latent Failure Rate Temperature Cycle 192 Hrs., 30C/60%RH+3IR-Reflow, 260C+5, -0C 121C, 100%RH Precondition: JESD22 Moisture Sensitivity MSL 3 Pressure Cooker P 192 Hrs, 30C/60%RH+3IR-Reflow, 260C+5, 0C High Accelerated Saturation Test (HAST) 130C, 1.98V, 85%RH Precondition: JESD22 Moisture Sensitivity MSL 3 P 192 Hrs, 30C/60%RH+3IR-Reflow, 260C+5, 0C Acoustic Microscopy, MSL 3 J-STD-020 P Die Shear MIL-STD-883, Method 2019, Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf P External Visual MIL-PRF-38535, MIL-STD-883, METHOD 2009, P High Temperature Storage 150C, no bias P Internal Visual MIL-STD-883-2014 P Adhesion of lead finish MIL-STD-883, Method 2025 P Solderability J-STD-002, JESD22-B102 P 95% solder coverage minimum X-Ray MIL-STD-883, Method 2012 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 P Document No.001-68976 Rev. *B ECN # 4749347 Reliability Test Data QTP #: 034503 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY39200Z208 (7C39770A) 9222749 610346251 TAIWN-G COMP 15 0 CY39200Z208 (7C39770A) 9222749 610346252 TAIWN-G COMP 15 0 CY7C136 (7C136G) 2127990 610346637 TAIWN-G COMP 15 0 9222749 610346252 TAIWN-G COMP 3 0 CY7C136 (7C136G) 2127990 610346637 TAIWN-G COMP 10 0 CY39200Z208 (7C39770A) 9222749 610346251 TAIWN-G COMP 10 0 CY39200Z208 (7C39770A) 9222749 610346252 TAIWN-G COMP 10 0 CY7C136 (7C136G) 2127990 610346637 TAIWN-G COMP 15 0 CY39200Z208 (7C39770A) 9222749 610346251 TAIWN-G COMP 15 0 STRESS: ADHESION OF LEAD FINISH CY39200Z208 (7C39770A) STRESS: DIE SHEAR STRESS: EXTERNAL VISUAL STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 1.98V), PRE COND 192 HR 30C/60%RH, MSL3 CY39200Z208 (7C39770A) 9222749 610346251 TAIWN-G 128 50 0 CY39200Z208 (7C39770A) 9222749 610346252 TAIWN-G 128 50 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 150C, 7V, Vcc Max CY7C136 (7C136G) 2127990 610346637 TAIWN-G 48 999 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 7.V, Vcc Max CY7C136 (7C136G) 2127990 610346637 TAIWN-G 80 120 0 CY7C136 (7C136G) 2127990 610346637 TAIWN-G 500 120 0 CY7C136 (7C136G) 2127990 610346637 TAIWN-G COMP 5 0 CY39200Z208 (7C39770A) 9222749 610346251 TAIWN-G COMP 5 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST (121C, 100%RH), PRE COND 192 HR 30C/60%RH CY39200Z208 (7C39770A) 9222749 610346251 TAIWN-G 144 50 0 CY39200Z208 (7C39770A) 9222749 610346251 TAIWN-G 272 50 0 CY7C136 (7C136G) 2127990 610346637 TAIWN-G 168 45 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.001-68976 Rev. *B ECN # 4749347 Reliability Test Data QTP #: 034503 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: SOLDERABILITY CY7C136 (7C136G) 2127990 610346637 TAIWN-G COMP 3 0 CY39200Z208 (7C39770A) 9222749 610346251 TAIWN-G COMP 3 0 STRESS: TC COND. C -65C TO 150C, PRECONDITION 192 HRS 30C/60%RH, MSL3 CY39200Z208 (7C39770A) 9222749 610346251 TAIWN-G 300 50 0 CY39200Z208 (7C39770A) 9222749 610346251 TAIWN-G 500 50 0 CY39200Z208 (7C39770A) 9222749 610346252 TAIWN-G 300 50 0 CY39200Z208 (7C39770A) 9222749 610346252 TAIWN-G 500 50 0 CY7C136 (7C136G) 2127990 610346637 TAIWN-G 300 45 0 CY7C136 (7C136G) 2127990 610346637 TAIWN-G 500 43 0 CY7C136 (7C136G) 2127990 610346637 TAIWN-G 1000 42 0 CY7C136 (7C136G) 2127990 610346637 TAIWN-G COMP 15 0 CY39200Z208 (7C39770A) 9222749 610346251 TAIWN-G COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.001-68976 Rev. *B ECN # 4749347 Document History Page Document Title: QTP 034503:ALL PLASTIC & THERMALLY ENHANCED QUAD FLATPACKS , PB-FREE, MSL3 260C REFLOW, ASEK-TAIWAN 001-68976 Document Number: Rev. ECN Orig. of No. Change ** 3223182 NSR *A 4362805 HSTO *B 4749347 HSTO Description of Change Corrected the LF material of 52L PQFP from Copper to Alloy42. Changed the Cypress Technical Contact for Qualification Data. Used qual report spec template. Align qualification report based on the new template in the front page Deleted obsolete specs 10-04256. Deleted Cypress reference specs 25-00104, 12-00292, 25-00029, and 25-00018 and replaced it with industry standard. Update reference for Reliability Director Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8