QTP 034503:ALL PLASTIC THERMALLY ENHANCED QUAD FLATPACKS , PB-FREE, MSL3 260C REFLOW, ASEK-TAIWAN

Document No.001-68976 Rev. *B
ECN # 4749347
Cypress Semiconductor
Package Qualification Report
QTP# 034503 VERSION *B
April 2015
All Plastic & Thermally Enhanced Quad
Flatpacks
Pb-Free, MSL3, 260C Reflow
ASEK-Taiwan Assembly
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Honesto Sintos
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Don Darling
Reliability Director
Company Confidential
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Page 1 of 8
Document No.001-68976 Rev. *B
ECN # 4749347
PACKAGE QUALIFICATION HISTORY
QTP
Number
Description of Qualification Purpose
Date
034503
Qualify All Plastic & Thermally Enhanced Quad Flatpacks, PbFree, MSL3, 260C Reflow using G700A MC, CRM1076DS epoxy
and Matte Tin Plating with Annealing Process (150C, 1hr)
ssembled @ASEK-Taiwan
Jan 04
Company Confidential
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Page 2 of 8
Document No.001-68976 Rev. *B
ECN # 4749347
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
N52
Package Outline, Type, or Name:
52-lead Plastic Quad Flatpack (PQFP)
Mold Compound Name/Manufacturer:
G700A
Mold Compound Flammability Rating:
V-O per UL94
Oxygen Rating Index: >28%
None
Lead Frame Material:
Alloy42
Substrate Material:
N/A
Lead Finish, Composition / Thickness:
Pure Sn
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
Sawing
Die Attach Supplier:
CRM
Die Attach Material:
1076DS
Bond Diagram Designation
10-02869
Wire Bond Method:
Thermosonic
Wire Material/Size:
1.0 mil / Au
Thermal Resistance Theta JA C/W:
96°C/W
Package Cross Section Yes/No:
Yes
Assembly Process Flow:
49-41999
Name/Location of Assembly (prime) facility:
ASEK-Taiwan
MSL LEVEL
3
REFLOW PROFILE
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
Cypress Philippines (CML-R)
Fault Coverage:
100%
Note: Please contact a Cypress Representative for other package availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 8
Document No.001-68976 Rev. *B
ECN # 4749347
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
NT208
Package Outline, Type, or Name:
208-lead Thermally Enhanced Quad Flatpack (EQFP)
Mold Compound Name/Manufacturer:
G700A
Mold Compound Flammability Rating:
V-O per UL94
Oxygen Rating Index: >28%
None
Lead Frame Material:
Copper
Substrate Material:
N/A
Lead Finish, Composition / Thickness:
Pure Sn
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
Sawing
Die Attach Supplier:
CRM
Die Attach Material:
1076DS
Wire Bond Method:
Thermosonic
Wire Material/Size:
1.0 mil / Au
Thermal Resistance Theta JA C/W:
96°C/W
Package Cross Section Yes/No:
Yes
Assembly Process Flow:
49-41999
Name/Location of Assembly (prime) facility:
ASEK-Taiwan
MSL LEVEL
3
REFLOW PROFILE
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
Cypress Philippines (CML-R)
Fault Coverage:
100%
Company Confidential
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Page 4 of 8
Document No.001-68976 Rev. *B
ECN # 4749347
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
High Temperature Operating Life
Test Condition
(Temp/Bias)
Result
P/F
Dynamic Operating Condition, Vcc Max = 7V, 150C
P
Dynamic Operating Condition, Vcc Max = 7V, 150C
P
MIL-STD-883C, Method 1010, Condition C, -65C to 150C
Precondition: JESD22 Moisture Sensitivity MSL 3
P
Early Failure Rate
High Temperature Operating Life
Latent Failure Rate
Temperature Cycle
192 Hrs., 30C/60%RH+3IR-Reflow, 260C+5, -0C
121C, 100%RH
Precondition: JESD22 Moisture Sensitivity MSL 3
Pressure Cooker
P
192 Hrs, 30C/60%RH+3IR-Reflow, 260C+5, 0C
High Accelerated Saturation Test
(HAST)
130C, 1.98V, 85%RH
Precondition: JESD22 Moisture Sensitivity MSL 3
P
192 Hrs, 30C/60%RH+3IR-Reflow, 260C+5, 0C
Acoustic Microscopy, MSL 3
J-STD-020
P
Die Shear
MIL-STD-883, Method 2019,
Per die size:
 <3000 sq. mils = 1.2 kgf
 30001-5000 sq. mils = 1.2 kgf
 >5001 sq. mils = 1.2 kgf
P
External Visual
MIL-PRF-38535, MIL-STD-883, METHOD 2009,
P
High Temperature Storage
150C, no bias
P
Internal Visual
MIL-STD-883-2014
P
Adhesion of lead finish
MIL-STD-883, Method 2025
P
Solderability
J-STD-002, JESD22-B102
P
95% solder coverage minimum
X-Ray
MIL-STD-883, Method 2012
Company Confidential
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Page 5 of 8
P
Document No.001-68976 Rev. *B
ECN # 4749347
Reliability Test Data
QTP #: 034503
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: ACOUSTIC, MSL3
CY39200Z208 (7C39770A)
9222749
610346251
TAIWN-G
COMP
15
0
CY39200Z208 (7C39770A)
9222749
610346252
TAIWN-G
COMP
15
0
CY7C136 (7C136G)
2127990
610346637
TAIWN-G
COMP
15
0
9222749
610346252
TAIWN-G
COMP
3
0
CY7C136 (7C136G)
2127990
610346637
TAIWN-G
COMP
10
0
CY39200Z208 (7C39770A)
9222749
610346251
TAIWN-G
COMP
10
0
CY39200Z208 (7C39770A)
9222749
610346252
TAIWN-G
COMP
10
0
CY7C136 (7C136G)
2127990
610346637
TAIWN-G
COMP
15
0
CY39200Z208 (7C39770A)
9222749
610346251
TAIWN-G
COMP
15
0
STRESS: ADHESION OF LEAD FINISH
CY39200Z208 (7C39770A)
STRESS: DIE SHEAR
STRESS: EXTERNAL VISUAL
STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 1.98V), PRE COND 192 HR 30C/60%RH, MSL3
CY39200Z208 (7C39770A)
9222749
610346251
TAIWN-G
128
50
0
CY39200Z208 (7C39770A)
9222749
610346252
TAIWN-G
128
50
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 150C, 7V, Vcc Max
CY7C136 (7C136G)
2127990
610346637
TAIWN-G
48
999
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 7.V, Vcc Max
CY7C136 (7C136G)
2127990
610346637
TAIWN-G
80
120
0
CY7C136 (7C136G)
2127990
610346637
TAIWN-G
500
120
0
CY7C136 (7C136G)
2127990
610346637
TAIWN-G
COMP
5
0
CY39200Z208 (7C39770A)
9222749
610346251
TAIWN-G
COMP
5
0
STRESS: INTERNAL VISUAL
STRESS: PRESSURE COOKER TEST (121C, 100%RH), PRE COND 192 HR 30C/60%RH
CY39200Z208 (7C39770A)
9222749
610346251
TAIWN-G
144
50
0
CY39200Z208 (7C39770A)
9222749
610346251
TAIWN-G
272
50
0
CY7C136 (7C136G)
2127990
610346637
TAIWN-G
168
45
0
Company Confidential
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Page 6 of 8
Document No.001-68976 Rev. *B
ECN # 4749347
Reliability Test Data
QTP #: 034503
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: SOLDERABILITY
CY7C136 (7C136G)
2127990
610346637
TAIWN-G
COMP
3
0
CY39200Z208 (7C39770A)
9222749
610346251
TAIWN-G
COMP
3
0
STRESS: TC COND. C -65C TO 150C, PRECONDITION 192 HRS 30C/60%RH, MSL3
CY39200Z208 (7C39770A)
9222749
610346251
TAIWN-G
300
50
0
CY39200Z208 (7C39770A)
9222749
610346251
TAIWN-G
500
50
0
CY39200Z208 (7C39770A)
9222749
610346252
TAIWN-G
300
50
0
CY39200Z208 (7C39770A)
9222749
610346252
TAIWN-G
500
50
0
CY7C136 (7C136G)
2127990
610346637
TAIWN-G
300
45
0
CY7C136 (7C136G)
2127990
610346637
TAIWN-G
500
43
0
CY7C136 (7C136G)
2127990
610346637
TAIWN-G
1000
42
0
CY7C136 (7C136G)
2127990
610346637
TAIWN-G
COMP
15
0
CY39200Z208 (7C39770A)
9222749
610346251
TAIWN-G
COMP
15
0
STRESS: X-RAY
Company Confidential
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Page 7 of 8
Document No.001-68976 Rev. *B
ECN # 4749347
Document History Page
Document Title:
QTP 034503:ALL PLASTIC & THERMALLY ENHANCED QUAD FLATPACKS , PB-FREE, MSL3
260C REFLOW, ASEK-TAIWAN
001-68976
Document Number:
Rev. ECN
Orig. of
No.
Change
**
3223182 NSR
*A
4362805 HSTO
*B
4749347 HSTO
Description of Change
Corrected the LF material of 52L PQFP from Copper to Alloy42.
Changed the Cypress Technical Contact for Qualification Data.
Used qual report spec template.
Align qualification report based on the new template in the front page
Deleted obsolete specs 10-04256.
Deleted Cypress reference specs 25-00104, 12-00292, 25-00029, and
25-00018 and replaced it with industry standard.
Update reference for Reliability Director
Distribution: WEB
Posting:
None
Company Confidential
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Page 8 of 8
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