HA7-2520-2

HA-2520, HA-2522, HA-2525
Data Sheet
20MHz, High Slew Rate, Uncompensated,
High Input Impedance, Operational
Amplifiers
HA-2520, HA-2522, HA-2525 comprise a series of operational
amplifiers delivering an unsurpassed combination of
specifications for slew rate, bandwidth and settling time. These
dielectrically isolated amplifiers are controlled at closed loop
gains greater than 3 without external compensation. In addition,
these high performance components also provide low offset
current and high input impedance.
120V/µs slew rate and 200ns (0.2%) settling time of these
amplifiers make them ideal components for pulse amplification
and data acquisition designs. These devices are valuable
components for RF and video circuitry requiring up to 20MHz
gain bandwidth and 2MHz power bandwidth. For accurate signal
conditioning designs the HA-2520, HA-2522, HA-2525’s
superior dynamic specifications are complemented by 10nA
offset current, 100M input impedance and offset trim capability.
June 13, 2014
FN2894.10
Features
• High slew rate . . . . . . . . . . . . . . . . . . . . . . . . . . . 120V/µs
• Fast settling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200ns
• Full power bandwidth . . . . . . . . . . . . . . . . . . . . . . . . 2MHz
• Gain bandwidth (AV  3). . . . . . . . . . . . . . . . . . . . . 20MHz
• High input impedance . . . . . . . . . . . . . . . . . . . . . . 100M
• Low offset current. . . . . . . . . . . . . . . . . . . . . . . . . . . .10nA
• Compensation pin for unity gain capability
• Pb-free PDIP available (RoHS compliant)
Applications
• Data acquisition systems
• RF amplifiers
• Video amplifiers
• Signal generators
Ordering Information
PART
NUMBER
PART
MARKING
TEMP. RANGE
(°C)
PACKAGE
PKG.
DWG. #
HA2-2520-2
HA2- 2520-2
-55 to +125
8 Ld Metal Can
T8.C
HA7-2520-2
HA7- 2520-2
-55 to +125
8 Ld CerDIP
F8.3A
HA2-2522-2
HA2- 2522-2
-55 to +125
8 Ld Metal Can
T8.C
HA3-2525-5Z (Notes 1, 2)
HA3- 2525-5Z
8 Ld PDIP
E8.3
0 to +75
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte
tin plate - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2. Pb-Free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing
applications.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 1999, 2004-2006, 2009, 2014. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
HA-2520, HA-2522, HA-2525
Pinouts
HA-2520, HA-2525
(8 LD CERDIP, 8 LD PDIP)
TOP VIEW
BAL
1
-IN
2
+IN
3
V-
4
+
8
COMP
7
V+
6
OUT
5
BAL
HA-2520, HA-2522
(8 LD METAL CAN)
TOP VIEW
COMP
8
BAL
IN-
1
-
2
IN+
7
V+
6
+
5
3
OUT
BAL
4
V-
2
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FN2894.10
June 13, 2014
HA-2520, HA-2522, HA-2525
Absolute Maximum Ratings
Thermal Information
Supply Voltage (Between V+ and V- Terminals) . . . . . . . . . . . . 40V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15V
Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
Thermal Resistance (Typical, Notes 3, 4) JA (°C/W) JC (°C/W)
Metal Can Package . . . . . . . . . . . . . . .
165
80
PDIP Package* . . . . . . . . . . . . . . . . . .
96
N/A
CERDIP Package. . . . . . . . . . . . . . . . .
135
50
Maximum Junction Temperature (Hermetic Packages) . . . . . +175°C
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . -65°C to +150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . .seeTB493
Operating Conditions
Temperature Range
HA-2520/2522-2 . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
HA-2525-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +75°C
*Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
3. JA is measured with the component mounted on an evaluation PC board in free air.
4. For JC, the “case temp” location is taken at the package top center.
Electrical Specifications
VSUPPLY = ±15V
HA-2520-2
TEMP
MIN
(°C) (Note 16)
PARAMETER
HA-2522-2
TYP
MAX
(Note 16)
4
8
MIN
(Note 16)
HA-2525-5
TYP
MAX
(Note 16)
5
10
MIN
(Note 16) TYP
MAX
(Note 16)
UNITS
10
mV
14
mV
INPUT CHARACTERISTICS
Offset Voltage
25
Full
11
Offset Voltage Drift
Full
20
Bias Current
25
100
Full
Offset Current
14
25
200
125
400
25
10
Full
5
30
250
125
500
25
20
50
50
20
100
µV/°C
250
nA
500
nA
50
nA
100
nA
Input Resistance (Note 5)
25
50
Common Mode Range
Full
±10
25
10
Full
7.5
Common Mode Rejection Ratio
(Note 7)
Full
80
90
74
90
74
90
dB
Gain Bandwidth (Notes 5, 8)
25
10
20
10
20
10
20
MHz
Minimum Stable Gain
25
3
Output Voltage Swing (Note 6)
Full
±10
±12
±10
±12
±10
±12
V
Output Current (Note 9)
25
±10
±20
±10
±20
±10
±20
mA
Full Power Bandwidth
(Notes 9, 14)
25
1.5
2.0
1.2
2.0
1.2
2.0
MHz
100
40
100
±10
40
100
±10
M
V
TRANSFER CHARACTERISTICS
Large Signal Voltage Gain
(Notes 6, 9)
15
7.5
15
5
7.5
15
5
3
kV/V
kV/V
3
V/V
OUTPUT CHARACTERISTICS
3
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FN2894.10
June 13, 2014
HA-2520, HA-2522, HA-2525
Electrical Specifications
VSUPPLY = ±15V (Continued)
HA-2520-2
TEMP
MIN
(°C) (Note 16)
PARAMETER
HA-2522-2
TYP
MAX
(Note 16)
MIN
(Note 16)
HA-2525-5
TYP
MAX
(Note 16)
MIN
(Note 16) TYP
MAX
(Note 16)
UNITS
TRANSIENT RESPONSE (AV = +3)
Rise Time (Notes 6, 10, 11, 13)
25
25
50
25
50
25
50
ns
Overshoot (Notes 6, 10, 11, 13)
25
25
40
25
50
25
50
%
Slew Rate (Notes 6, 10, 17, 15)
25
Settling Time (Notes 6, 10, 17, 15)
25
±100
±120
±80
0.20
±120
±80
0.20
±120
V/µs
0.20
µs
POWER SUPPLY CHARACTERISTICS
Supply Current
25
Power Supply Rejection Ratio
(Note 12)
Full
4
80
90
6
4
74
90
6
4
74
90
6
mA
dB
NOTES:
5. This parameter value is based on design calculations.
6. RL = 2kΩ
7. VCM = ±10V.
8. AV > 10.
9. VO = ±10V.
10. CL = 50pF.
11. VO = ±200mV.
12. V = ±5V.
13. See “Transient Response” Test Circuits and Waveforms.
Slew Rate
14. Full Power Bandwidth guaranteed based on slew rate measurement using: FPBW = ----------------------------- .
2V PEAK
15. VOUT = ±5V.
16. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
17. See “ Slew Rate and Settling Time” Test Circuits and Waveforms.
4
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FN2894.10
June 13, 2014
HA-2520, HA-2522, HA-2525
Test Circuits and Waveforms
+1.67V
±67mV
INPUT
-1.67V
+5V
INPUT
0V
75%
OUTPUT
V
25%
-5V
SLEW
RATE
= V/t
t
OVERSHOOT
±200mV
90%
ERROR BAND
±10mV FROM
FINAL VALUE
OUTPUT
10%
0V
RISE TIME
SETTLING
TIME
NOTE: Measured on both positive and negative transitions from 0V
to +200mV and 0V to -200mV at the output.
FIGURE 1. SLEW RATE AND SETTLING TIME
FIGURE 2. TRANSIENT RESPONSE
1F
V+
INPUT
7
3 +
0.001µF
2
667.2Ω
OUTPUT
6
4
1µF
100pF
IN
1667Ω
+
V-
OUT
2001Ω
5pF
1333Ω
0.001µF
D
50pF
2N4416
G
4999.9Ω
S
SETTLING TIME
TEST POINT
667Ω
2kΩ
CR1
CR2
NOTES:
18. AV = -3.
19. Feedback and summing resistor ratios should be 0.1% matched.
20. Clipping diodes CR1 and CR2 are optional. HP5082-2810
recommended.
FIGURE 4. SETTLING TIME TEST CIRCUIT
FIGURE 3. SLEW RATE AND TRANSIENT RESPONSE
V+
20kΩ
IN
BAL.
V-
OUT
COMP
CC
NOTE: Tested offset adjustment range is |VOS + 1mV| minimum referred to output. Typical ranges are ±20mV with RT = 20k
FIGURE 5. SUGGESTED VOS ADJUSTMENT AND COMPENSATION HOOK-UP
5
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FN2894.10
June 13, 2014
HA-2520, HA-2522, HA-2525
Schematic Diagram
OFFSETPIN 1
BAL 1
200
R2AA
Q30
R11
R13
R10
440
1.8k
R2A
440
R12
1.8k
R2B
Q3B
Q3A
Q16
Q28
V+
200
R2BB
R21
Q29
COMP
OFFSET+
BAL 2
C1
1pF
R16
R9
Q4B
Q4A
Q27
Q15
Q23
Q12A
Q8
D138
R15
+INPUT
Q1A
Q2B
Q2A
Q17
R1A
Q1B
Q11B
R17
50
OUTPUT
Q12B
R18
30
Q7
R1B
Q24
D13A
Q18
Q31
Q26
Q6
Q19
Q20
Q21A
Q22
R6A
Q5B
Q5A
Q21B
Q25
Q11A
Q9
Q10
D14
R3A
R6B
R3B
R19
R10
V-
-INPUT
Typical Application
Inverting Unity Gain Circuit
10
5
GAIN
0
-5
-45
PHASE
-10
-90
-15
-135
10k
IN
-180
10k
+
2k
500pF
0
PHASE SHIFT (°)
15
GAIN (dB)
Figure 6 shows a Compensation Circuit for an inverting unity
gain amplifier. The circuit was tested for functionality with
supply voltages from ±4V to ±15V, and the performance as
tested was: Slew Rate  120V/µs; Bandwidth  10MHz; and
Settling Time (0.1%)  500ns. Figure 7 illustrates the amplifier’s
frequency response, and it is important to note that capacitance
at pin 8 must be minimized for maximum bandwidth.
OUT
HA-2520
5k
10k
100k
1M
10M
FIGURE 7. FREQUENCY RESPONSE FOR INVERTING UNITY
GAIN CIRCUIT
FIGURE 6. INVERTING UNITY GAIN CIRCUIT
6
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FN2894.10
June 13, 2014
HA-2520, HA-2522, HA-2525
VS = 15V, TA = +25°C, Unless Otherwise Specified
6
-40
5
-50
-60
4
BIAS CURRENT (nA)
OFFSET VOLTAGE (mV)
Typical Performance Curves
3
2
1
0
-1
-70
-80
-90
-100
-110
-120
-130
-140
-2
-150
-3
-60
-40
-20
0
20
40
60
80
100
120
-160
-60
-40
-20
0
TEMPERATURE (°C)
FIGURE 8. OFFSET VOLTAGE vs TEMPERATURE
(6 TYPICAL UNITS FROM 3 LOTS)
20
AVOL (kV/ V)
OFFSET BIAS CURRENT (nA)
30
10
0
-10
-20
-40
-20
0
20
40
60
80
100
120
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
-60
-40
-20
TEMPERATURE (°C)
14
OUTPUT VOLTAGE SWING (±V)
OUTPUT CURRENT (±mA)
30
20
10
0
-10
-20
-30
8
10
12
14
SUPPLY VOLTAGE (V)
FIGURE 12. OUTPUT CURRENT vs SUPPLY VOLTAGE
7
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100
120
0
20
40
60
80
100
120
RL = 2k
12
40
6
80
FIGURE 11. OPEN LOOP GAIN vs TEMPERATURE
(6 TYPICAL UNITS FROM 3 LOTS)
50
4
60
TEMPERATURE (°C)
FIGURE 10. OFFSET CURRENT vs TEMPERATURE
(5 TYPICAL UNITS FROM 3 LOTS)
-40
40
FIGURE 9. BIAS CURRENT vs TEMPERATURE
(6 TYPICAL UNITS FROM 3 LOTS)
40
-30
-60
20
TEMPERATURE (°C)
10
8
6
4
2
0
-2
-4
-6
-8
-10
-12
4
6
8
10
12
14
SUPPLY VOLTAGE (V)
FIGURE 13. OUTPUT VOLTAGE SWING vs SUPPLY VOLTAGE
FN2894.10
June 13, 2014
HA-2520, HA-2522, HA-2525
100
+25°C
80
-55°C
40
20 PHASE AT AV = 100
0
0
-45
-90
OPEN LOOP PHASE
4
6
8
10
12
SUPPLY VOLTAGE (±V)
14
100
1k
FIGURE 14. SUPPLY CURRENT vs SUPPLY VOLTAGE
80
0pF
10pF
30pF
50pF
60
40
20
100pF
300pF
0
-20
100
1k
10k
100k
1M
10M
10k
50
INPUT NOISE CURRENT
10
100
5
50
INPUT NOISE VOLTAGE
10
1
5
0.5
1
1
10
100
1k
FREQUENCY (Hz)
1.2
NORMALIZED TO ±15V DATA
15
VSUPPLY = 10V
10
5
0
10k
RL = 2k
1.1
20
100k
1M
10M
FREQUENCY (Hz)
FIGURE 18. OUTPUT VOLTAGE SWING vs FREQUENCY
8
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0.1
100k
10k
FIGURE 17. INPUT NOISE CHARACTERISTICS
VSUPPLY = 20V
VSUPPLY = 15V
-180
100M
100
FREQUENCY (Hz)
25
10M
500
100M
30
100k
1M
FREQUENCY (Hz)
1000
FIGURE 16. OPEN LOOP FREQUENCY RESPONSE FOR
VARIOUS VALUES OF CAPACITORS FROM COMP
PIN TO GROUND
35
-135
FIGURE 15. FREQUENCY RESPONSE
INPUT NOISE VOLTAGE (nV/Hz)
100
OUTPUT VOLTAGE SWING (VP-P)
OPEN LOOP GAIN
60 GAIN AT A = 100
V
PHASE ANGLE (DEGREES)
+125°C
INPUT NOISE CURRENT (pA/√Hz)
5.4
5.2
5.0
4.8
4.6
4.4
4.2
4.0
3.8
3.6
3.4
3.2
3.0
2.8
2.6
2.4
VS = 15V, TA = +25°C, Unless Otherwise Specified (Continued)
GAIN (dB)
SUPPLY CURRENT (mA)
Typical Performance Curves
CL = 50pF
1.0
BANDWIDTH
0.9
NEGATIVE
SLEW RATE
0.8
0.7
POSITIVE
SLEW RATE
0.6
0.5
0.4
5
7
9
11
13
15
17
19 20
SUPPLY VOLTAGE (V)
FIGURE 19. NORMALIZED AC PARAMETERS vs SUPPLY
VOLTAGE
FN2894.10
June 13, 2014
HA-2520, HA-2522, HA-2525
TRANSISTOR COUNT:
40
Die Characteristics
SUBSTRATE POTENTIAL:
Unbiased
PROCESS:
Bipolar Dielectric Isolation
Metallization Mask Layout
HA-2520, HA-2522, HA-2525
9
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COMP
V+
OUT
BAL
-IN
+IN
BAL
V-
FN2894.10
June 13, 2014
HA-2520, HA-2522, HA-2525
Metal Can Packages (Can)
T8.C MIL-STD-1835 MACY1-X8 (A1)
REFERENCE PLANE
A
8 LEAD METAL CAN PACKAGE
e1
L
L2
L1
INCHES
SYMBOL
ØD2
A
A
k1
Øe
ØD ØD1
2
N
1

Øb1
Øb
F

k
C
L
BASE AND
SEATING PLANE
Q
BASE METAL
Øb1
LEAD FINISH
Øb2
SECTION A-A
NOTES:
1. (All leads) Øb applies between L1 and L2. Øb1 applies between
L2 and 0.500 from the reference plane. Diameter is uncontrolled
in L1 and beyond 0.500 from the reference plane.
2. Measured from maximum diameter of the product.
3. a is the basic spacing from the centerline of the tab to terminal 1
and b is the basic spacing of each lead or lead position (N -1
places) from a, looking at the bottom of the package.
MIN
MILLIMETERS
MAX
MIN
MAX
NOTES
A
0.165
0.185
4.19
4.70
-
Øb
0.016
0.019
0.41
0.48
1
Øb1
0.016
0.021
0.41
0.53
1
Øb2
0.016
0.024
0.41
0.61
-
ØD
0.335
0.375
8.51
9.40
-
ØD1
0.305
0.335
7.75
8.51
-
ØD2
0.110
0.160
2.79
4.06
-
e
e1
0.200 BSC
5.08 BSC
0.100 BSC
-
2.54 BSC
-
F
-
0.040
-
1.02
-
k
0.027
0.034
0.69
0.86
-
k1
0.027
0.045
0.69
1.14
2
12.70
19.05
1
1.27
1
L
0.500
0.750
L1
-
0.050
L2
0.250
-
6.35
-
1
Q
0.010
0.045
0.25
1.14
-
-
a
45° BSC
45° BSC
3
b
45° BSC
45° BSC
3
N
8
8
4
Rev. 0 5/18/94
4. N is the maximum number of terminal positions.
5. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
6. Controlling dimension: INCH.
10
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FN2894.10
June 13, 2014
HA-2520, HA-2522, HA-2525
Ceramic Dual-In-Line Frit Seal Packages (CERDIP)
F8.3A MIL-STD-1835 GDIP1-T8 (D-4, CONFIGURATION A)
LEAD FINISH
c1
8 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE
-D-
-A-
BASE
METAL
(c)
E
M
-Bbbb S
C A-B S
Q
-C-
SEATING
PLANE
S1
b2
b
ccc M
C A-B S
eA/2
-
0.200
-
5.08
-
0.026
0.36
0.66
2
b1
0.014
0.023
0.36
0.58
3
b2
0.045
0.065
1.14
1.65
-
b3
0.023
0.045
0.58
1.14
4
c
0.008
0.018
0.20
0.46
2
c1
0.008
0.015
0.20
0.38
3
D
-
0.405
-
10.29
5
E
0.220
0.310
5.59
7.87
5
c
aaa M C A - B S D S
D S
NOTES
0.014
eA
e
MAX
b

A A
MIN
A
A
L
MILLIMETERS
MAX
M
(b)
D
BASE
PLANE
MIN
b1
SECTION A-A
D S
INCHES
SYMBOL
NOTES:
1. Index area: A notch or a pin one identification mark shall be
located adjacent to pin one and shall be located within the
shaded area shown. The manufacturer’s identification shall not
be used as a pin one identification mark.
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
-
eA/2
0.150 BSC
3.81 BSC
-
L
0.125
0.200
3.18
5.08
-
Q
0.015
0.060
0.38
1.52
6
S1
0.005
-
0.13
-
7
105°
90°
105°
-
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.

90°
aaa
-
0.015
-
0.38
-
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness.
bbb
-
0.030
-
0.76
-
ccc
-
0.010
-
0.25
-
M
-
0.0015
-
0.038
2, 3
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
5. This dimension allows for off-center lid, meniscus, and glass
overrun.
N
8
8
8
Rev. 0 4/94
6. Dimension Q shall be measured from the seating plane to the
base plane.
7. Measure dimension S1 at all four corners.
8. N is the maximum number of terminal positions.
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
10. Controlling dimension: INCH
11
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June 13, 2014
HA-2520, HA-2522, HA-2525
Dual-In-Line Plastic Packages (PDIP)
E8.3 (JEDEC MS-001-BA ISSUE D)
N
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX
AREA
1 2 3
INCHES
N/2
-B-
-AD
E
BASE
PLANE
-C-
SEATING
PLANE
A2
A
L
D1
e
B1
D1
A1
eC
B
0.010 (0.25) M
C A B S
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
C
L
B1
0.045
0.070
1.15
1.77
8, 10
eA
C
0.008
0.014
0.204
C
D
0.355
0.400
9.01
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between
English and Metric dimensions, the inch dimensions control.
5
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
eA
0.300 BSC
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
eB
-
L
0.115
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
0.355
10.16
N
2.54 BSC
7.62 BSC
0.430
-
0.150
2.93
8
5. D, D1, and E1 dimensions do not include mold flash or
protrusions. Mold flash or protrusions shall not exceed 0.010
inch (0.25mm).
6. E and eA are measured with the leads constrained to be
perpendicular to datum -C- .
8
6
10.92
7
3.81
4
9
Rev. 0 12/93
7. eB and eC are measured at the lead tips with the leads
unconstrained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
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in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
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12
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FN2894.10
June 13, 2014