Plastic Packages for Integrated Circuits TQFN (Thin Quad Flat No-Lead) Package Family MDP0051 A D N (N-1) (N-2) B 1 2 3 MILLIMETERS PIN #1 I.D. MARK E (N/2) 2X 0.075 C 2X 0.075 C TOP VIEW N LEADS TQFN (THIN QUAD FLAT NO-LEAD) PACKAGE FAMILY (COMPLIANT TO JEDEC MO-220) 0.10 M C A B (N-2) (N-1) N b L SYMBOL TQFN 28 TQFN 32 TOLERANCE NOTES A 0.75 0.75 ±0.05 - A1 0.02 0.02 +0.03/-0.02 - b 0.325 0.25 ±0.02 - c 0.20 0.20 Reference - D 6.00 5.00 Basic - D2 4.70 3.10 Reference 8 E 6.00 5.00 Basic - E2 4.70 3.10 Reference 8 e 0.65 0.50 Basic - L 0.40 0.40 ±0.05 - N 28 32 Reference 4 ND 7 8 Reference 6 NE 7 8 Reference 5 Rev 1 2/07 PIN #1 I.D. 3 1 2 3 NOTES: 1. Dimensioning and tolerancing per ASME Y14.5M-1994. 2. Tiebar view shown is a non-functional feature. 3. Bottom-side pin #1 I.D. is a diepad chamfer as shown. 4. N is the total number of terminals on the device. (E2) 5. NE is the number of terminals on the “E” side of the package (or Y-direction). (N/2) NE 5 7 (D2) 6. ND is the number of terminals on the “D” side of the package (or X-direction). ND = (N/2)-NE. 7. Inward end of terminal may be square or circular in shape with radius (b/2) as shown. 8. If two values are listed, multiple exposed pad options are available. Refer to device-specific datasheet. BOTTOM VIEW 9. Package outline drawing is generic. 0.10 C e C SEATING PLANE 0.08 C N LEADS & EXPOSED PAD SEE DETAIL "X" SIDE VIEW (c) C 2 A (L) A1 DETAIL X 1 N LEADS