Plastic Packages for Integrated Circuits Package Outline Drawing M8.15D 8 LEAD NARROW BODY SMALL OUTLINE EXPOSED PAD PLASTIC PACKAGE Rev 1, 3/11 8 INDEX 6.20 (0.244) 5.84 (0.230) AREA DETAIL "A" 1.27 (0.050) 0.41 (0.016) 3.99 (0.157) 3.81 (0.150) 1 2 0.50 (0.02) x 45° 0.25 (0.01) 3 TOP VIEW 8° 0° 0.25 (0.010) 0.19 (0.008) SEATING PLANE SIDE VIEW “B” 1.72 (0.067) 1.52 (0.059) 2.25 (0.089) -C- 0.25 (0.010) 0.10 (0.004) 1.27 (0.050) 0.46 (0.019) 0.36 (0.014) 1 2 SIDE VIEW “A 3 1 2 4 3 1.95 (0.077) 8 3.25 (0.128) 4.98 (0.196) 4.80 (0.189) 7 0.60 (0.023) 1.27 (0.050) 6 5 5.45 (0.214) 2.50 (0.099) 2.00 (0.078) 8 TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for reference only. 2. Dimensioning and tolerancing per ASME-Y14.5M-1994. 3. Unless otherwise specified, tolerance: Decimal ± 0.05. 4. Dimension does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. 5. The Pin 1 identifier may be either a mold or a mark feature. 6. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 3.50 (0.137) 3.00 (0.118) BOTTOM VIEW 1