Plastic Packages for Integrated Circuits Thin, Fine Pitch, Plastic Ball Grid Array Package (TFBGA) V81.5x5 D A1 CORNER B A 81 BALL THIN, FINE PITCH, PLASTIC BALL GRID ARRAY PACKAGE (TFBGA) SYMBOL MIN NOMINAL MAX NOTES A 0.75 0.91 1.07 - A1 0.15 0.21 0.27 - A2 0.60 0.70 0.80 - b 0.25 0.30 0.35 - D/E 4.90 5.00 5.10 - E D1/E1 TOP VIEW 4.0 BSC - N 81 3 e 0.5 BSC - MD/ME 9x9 6 Rev. 0 11/07 D1 NOTES: 1 2 3 4 5 6 7 8 9 A1 CORNER 1. Dimensions are in millimeters. 2. Dimensioning and tolerancing conform to ASME Y 14.5M-1994. J H G F E D C B A 3. āNā is the total number of balls. 4. Primary datum C and seating plane are defined by the spherical crowns of the contact balls. e E1 5. Pin āA1ā is marked on the top and bottom sides adjacent to A1. 6. "MD" and "ME" are the number of balls in the matrix in the D and E directions respectively. b e 0.15 0.05 M C A B M C BOTTOM VIEW 0.10 A C A2 A1 SEATING PLANE SIDE VIEW 1 C 0.08 C