EL4340EVAL1 User Guide

EL4340EVAL1 Evaluation Board User’s Guide
®
Application Note
March 28, 2005
AN1182.0
Introduction
High Frequency Layout Considerations
The EL4340EVAL1 evaluation board contains all the circuitry
needed to characterize critical performance parameters of
the EL4340 triple 2:1 MUX-amplifier, over a variety of
applications.
At frequencies of 500MHz and higher, circuit board layout
may limit performance. The following layout guidelines are
implemented on the evaluation board;
The EL4340 contains 3 separate 2 input multiplexers, each
followed by a unity gain buffer controlled by a common set of
logic inputs (Figure 1, Table 1). Control features include a
high speed (20ns) HIZ output control for individual selection
of MUX amps that share a common video output line. A
control logic latch (LE) enables multiple devices to share a
common input control logic bus. The ENABLE control can be
used to save power by powering the device down.
The evaluation board circuit and layout is optimized for
either 50Ω or 75Ω terminations, and implements a basic
R-G-B video 2 input MUX-amp. The board is supplied with
75Ω input signal terminations and a 75Ω back-termination
resistor on each of the 3 outputs, making it suitable for
driving video cable. The user has the option of replacing the
75Ω resistors with 50Ω resistors for other applications. The
control lines contain 50Ω resistors to match the 50Ω output
impedance of high speed pulse generators. Control line
termination resistors are recommended for rise and fall times
under 10ns to minimize unwanted transients. If DC is used
for the control logic, the resistors may be removed; or the
applied DC voltage can reduced to 2.5V to reduce the
dissipation in the termination resistor.
The layout contains component options to include an output
series resistor (RS) followed by a parallel resistor (RL)
capacitor (CL) network to ground. This option allows the user
to select several different output configurations. Examples
are shown in Figures 2A, 2B, and 2C. The evaluation board
is supplied with the 75Ω back termination resistors shown in
Figure 2C.
Amplifier Performance and Output
Configurations
• No series connected vias are used in signal I/O lines, as
they can add unwanted inductance,
• Signal trace lengths are minimized to reduce transmission
line effects and the need for strip-line tuning of the signal
traces.
• High frequency decoupling caps are places as close to the
device power supply pin as possible - without series vias
between the capacitor and the device pin.
Power Sequencing
Proper power supply sequencing is -V first, then +V. In
addition, the +V and -V supply pin voltage rate-of-rise must
be limited to ±1V/µs or less. The evaluation board contains
parallel-connected low VON Shottky diodes on each supply
terminal to minimize the risk of latch up due to incorrect
sequencing. In addition, extra 10µF decoupling capacitors
are added to each supply to aid in reducing the applied
voltage rate-of-rise.
Reference Documents
1. EL4340 Data Sheet, FN7421.0
S0
EN0
DL Q
C
DECODE
EN1
DL Q
C
IN0(A,B,C)
IN1(A,B,C)
OUT
AMPLIFIER BIAS
LE
The EL4340 output amplifiers are designed for maximum
gain-bandwidth performance when loaded with ~500Ω (RL)
in parallel with ~5pF (CL) to ground, directly at the output pin
(Figure 2A). They are ideally suited for driving high
impedance high speed selectable-gain buffers when gain
compensation is needed. In these applications, output trace
capacitance to 5pF actually optimizes AC performance. For
trace capacitance below 5pF, an additional capacitor
between the output pin to ground may be added to achieve
the 5pF optimum. GBW decreases slightly at the lower
output load impedances typical of back-terminated cable
driving applications.
1
• Signal I/O lines are the same lengths and widths to match
propagation delay and trace parasitics,
HIZ
ENABLE
A logic high on LE will latch the last S0 state.
This logic state is preserved when cycling HIZ
or ENABLE functions.
FIGURE 1. EL4340 FUNCTIONAL BLOCK DIAGRAM (1 OF 3
CHANNELS)
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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Application Note 1182
TABLE 1. LOGIC TABLE
EL4340
VIN
50Ω
OR
75Ω
S0
HIZ
ENABLE
LENABLE
OUTA,B,C
0
0
0
0
IN0A,B,C
1
0
0
0
IN1A,B,C
-
1
0
-
Hi Z
-
-
1
-
Power down
-
0
0
1
Last S0 selection
TEST
EQUIPMENT
EL4340
RS, 0Ω
RS
VIN
*Cb2
~3pF
*Cb1
~0.5pF
50Ω
OR
75Ω
CL
1.5pF
RL
500Ω
* Cb1, Cb2 are approximate PCB trace capacitances.
475Ω
RL
50Ω
OR
75Ω
50Ω
OR
75Ω
* Cb1 is approximate PCB trace capacitance.
FIGURE 2A. TEST CIRCUIT WITH OPTIMAL OUTPUT LOAD
FIGURE 2B. TEST CIRCUIT FOR 50Ω OR 75Ω TERMINATIONS
EL4340
RS
VIN
50Ω
OR
75Ω
^Cb1
~0.5pF
Cb1
~0.5pF
50Ω OR 75Ω
TEST
EQUIPMENT
50Ω
OR
75Ω
* Cb1 is approximate PCB trace capacitance.
FIGURE 2C. BACK-TERMINATED TEST CIRCUIT FOR CABLE APPLICATION
EL4340EVAL1 Top View
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AN1182.0
March 28, 2005
Application Note 1182
EL4340EVAL1 Schematic Diagram
U1
1
IN0A
NIC 24
JLEBAR
R9
75Ω
2 GND A
23
3
IN0B
R8
75Ω
22
4 NIC
21
5 GND B
20
LEBAR
JENABLE
R1 - 50Ω
ENABLE
JHIZ
R14 - 50Ω
HIZ
R12 - 50Ω
OUTA
R15 - 75Ω
6
IN0C
R7
75Ω
V+ 19
7 NIC
OUTB
18
R16 - 75Ω
8
IN1A
OUTC
17
R2
75Ω
9 NIC
V- 16
10
IN1B
R10
75Ω
R22
R21
R20
C11
NIC 15
11 GND C
14
12
IN1C
C10
C9
R17 - 75Ω
SO
D1
R19
50Ω
NIC 13
R11
75Ω
C7
C2
C1
C3
10µF 0.1µF 10nF 1nF
+
C6
10µF
D2
GND.
V-
C5
0.1µF
JSO
C4
10nF
C8
1nF
V+
EL4340EVAL1 Components Parts List
DEVICE #
DESCRIPTION
COMMENTS
C7, C8
CAP, SMD, 0603, 1000pF, 25V, 10%, X7R
Power Supply Decoupling
C1, C4
CAP, SMD, 0603, 0.01µF, 25V, 10%, X7R
Power Supply Decoupling
C2, C5
CAP, SMD, 0603, 0.1µF, 25V, 10%, X7R
Power Supply Decoupling
C3, C6
CAP, SMD, 0805, 10µF, 6.3V, 10%, X5R
Power Supply Decoupling
D1, D2
Diode-Shottky, 2 Pin, 45V, 7.5A
MBR0550T (Motorola) Reverse Polarity Protection
Resistor, SMD, 0603, 75Ω, 1/10W, 1%,
Signal Input/output Termination
Resistor, SMD, 0603, 49.9Ω, 1/16W, 1%,
Logic Input Termination
C9, C10, C11
Resistor, SMD, 0603
Optional, not populated
R20, R21, R22
Resistor, SMD, 0603
Optional, not populated
R2, R7-R11, R15-R17
R1, R12, R14, R19
U1
EL4340IU -500MHz Multiplexing Amplifier, 24P, QSOP Device Under Test
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verify that the Application Note or Technical Brief is current before proceeding.
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March 28, 2005