® RoHS and Pb-Free Component Material Decloration material breakdown is for the KOA P/N MHL1ECTTPxxxy KOA SPEER ELECTRONICS, INC. Product Information Breakdown of all Materials KOA Part Number: RoHS/Pb-Free Compliant Part Number: Part Description: Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Materials SiO2 Al2O3 B2O3 KO2 Ag Ni Sn MHL1ECTTPxxxy MHL1ECTTPxxxy 0402, multilayer inductor 0.745 Now Available Now Available RoHS Banned Substances Lead & Lead Compounds Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight (All materials in the part) PPM Where Used CAS # 194900 Ferrite Body 7440-21-3 210300 Ferrite Body 12036-10-1 140800 Ferrite Body 1303-86-2 5200 Ferrite Body 12030-88-5 329700 internal term. & electro 7440-22-4 53500 Middle termination 7440-02-0 7440-31-5 65600 outer termination PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 % Weight Reportable Substances Brominated Flame Retardants (Other than 0 PBB or PBDE) Selenium & Selenium Compounds 0 Antimony & Antimony Compounds 0 Arsenic & Arsenic Compounds 0 Beryllium & Beryllium Compounds 0 Bizmuth & Bizmuth Compounds 0 Copper & Copper Compounds 0.52 Gold & Gold Compounds 0 Magnesium 0 Nickel & Nickel Compounds 21.03 Palladium & Palladium Compounds 0 Phthalates 0 Silver & Silver Compounds 32.97 % Weight 19.49 21.03 14.08 0.52 32.97 5.35 6.56 0 0 0 0 0 0 0 0 0 0 Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable PPM 0 0 0 0 0 0 5200 0 0 210300 0 0 329700 Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536. Dated: 31-Aug-05 Signed: Michael E Griffith 260 5 3 1 Sn 5µm Ni 1~2µm Yes minimum ® RoHS and Pb-Free Component Material Decloration material breakdown is for the KOA P/N MHL1JCTTDxxxy KOA SPEER ELECTRONICS, INC. Product Information Breakdown of all Materials KOA Part Number: RoHS/Pb-Free Compliant Part Number: Part Description: Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Materials SiO2 Al2O3 B2O3 KO2 Ag Ni Sn MHL1JCTTDxxxy MHL1JCTTDxxxy 0603, multilayer inductor 2.52 Now Available Now Available RoHS Banned Substances Lead & Lead Compounds Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight (All materials in the part) PPM Where Used CAS # 261900 Ferrite Body 7440-21-3 282700 Ferrite Body 12036-10-1 189300 Ferrite Body 1303-86-2 7000 Ferrite Body 12030-88-5 180900 internal term. & electro 7440-22-4 35200 Middle termination 7440-02-0 7440-31-5 43000 outer termination PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 % Weight Reportable Substances Brominated Flame Retardants (Other than 0 PBB or PBDE) Selenium & Selenium Compounds 0 Antimony & Antimony Compounds 0 Arsenic & Arsenic Compounds 0 Beryllium & Beryllium Compounds 0 Bizmuth & Bizmuth Compounds 0 Copper & Copper Compounds 0.7 Gold & Gold Compounds 0 Magnesium 0 Nickel & Nickel Compounds 28.27 Palladium & Palladium Compounds 0 Phthalates 0 Silver & Silver Compounds 18.09 % Weight 26.19 28.27 18.93 0.7 18.09 3.52 4.3 0 0 0 0 0 0 0 0 0 0 Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable PPM 0 0 0 0 0 0 7000 0 0 282700 0 0 180900 Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536. Dated: 31-Aug-05 Signed: Michael E Griffith 260 5 3 1 Sn 5µm Ni 1~2µm Yes minimum