® RoHS and Pb-Free Component Material Declaration material breakdown is for the KOA P/N RK73B1FTTCxxxJ KOA SPEER ELECTRONICS, INC. Product Information Breakdown of all Materials RK73B1FTTCxxxJ RK73B1FTTCxxxJ 01005, 5% SMD KOA Part Number: RoHS Compliant Part Number: Part Description: 0.03 Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available RoHS Banned Substances Lead & Lead Compounds* Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight 1.782 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 % Weight Reportable Substances Brominated Flame Retardants (Other than 0 Selenium & Selenium Compounds 0 Antimony & Antimony Compounds 0 Arsenic & Arsenic Compounds 0 Beryllium & Beryllium Compounds 0 Bizmuth & Bizmuth Compounds 0 Copper & Copper Compounds 0.231 Gold & Gold Compounds 0 Magnesium 0.575 Nickel & Nickel Compounds 9.188 Palladium & Palladium Compounds 0.099 Phthalates 0 Silver & Silver Compounds 3.638 PPM 17820 0 0 PPM 0 0 0 0 0 0 2310 0 5750 91880 990 0 36380 Materials Al203 Si02 Mg0 Ag Pd Pbo B203 Si02 Ni Cr Ru02 Pbo B203 Si02 Pbo B203 Si02 Epoxy Resin Si02 Cu0 Cr203 Mn02 Ni Sn Others Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536. Dated: 25-Jul-05 Signed: Michael E Griffith * Pb is in glass material for each location. Exempt per RoHS directive Annex 5 % Weight 68.97 2.155 0.575 3.638 0.099 0.08 0.04 0.08 0.338 0.338 0.992 1.006 0.292 0.569 0.696 0.277 0.419 1.547 0.184 0.231 0.472 0.079 8.85 6.926 1.147 260 10 3 1 Sn 3µm Ni 3µm Yes (All materials in the part) PPM Where Used 689700 substrate 21550 substrate 5750 substrate 36380 inner electrode top 990 inner electrode top 800 inner electrode top 400 inner electrode top 800 inner electrode top 3380 inner electrode side 3380 inner electrode side 9920 Resistive Film 10060 Resistive Film 2920 Resistive Film 5690 Resistive Film 6960 inner protective coat 2770 inner protective coat 4190 inner protective coat 15470 Outer protective coat 1840 Outer protective coat 2310 Outer protective coat 4720 Outer protective coat 790 Outer protective coat 88500 Middle termination 69260 outer termination 11470 others (all locations) minimum minimum CAS # 12036-10-1 7440-21-3 1313-13-9 7440-22-4 7440-05-3 1309-60-0 1303-86-2 7631-86-9 7440-02-0 7440-47-3 12036-10-1 1309-60-0 1303-86-2 7631-86-9 1309-60-0 1303-86-2 7631-86-9 129915-35-1 7631-86-9 1317-38-0 1308-38-9 1313-13-9 7440-02-0 7440-31-5 --- ® Component Material Declaration material breakdown is for the KOA P/N RK73B1HTTBxxxJ KOA SPEER ELECTRONICS, INC. Product Information Breakdown of all Materials KOA Part Number: RoHS Compliant Part Number: Part Description: RK73B1HTTBxxxJ RK73B1HTTBxxxJ 0201, 5% SMD 0.14 Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: RoHS Banned Substances Lead & Lead Compounds* Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Now Available Now Available % Weight PPM 0.958 0 9577.986 0 0 0 0 0 Materials Al203 Si02 Mg0 Ag Pd Pbo B203 Si02 Ag Pbo B203 Si02 Polybrominated Biphenyls (PBB) 0 0 Ni Cr Ru02 Polybrominated Diphenylethers (PBDE) 0 0 Pbo % Weight 79.731 2.492 0.664 2.522 0.069 0.055 0.028 0.055 (All materials in the part) PPM Where Used 797312.9 substrate 24916.0 substrate 6644.3 substrate 25217.4 inner electrode top 689.0 inner electrode top 551.2 inner electrode top 275.6 inner electrode top 551.2 inner electrode top CAS # 12036-10-1 7440-21-3 1313-13-9 7440-22-4 7440-05-3 1309-60-0 1303-86-2 7631-86-9 1.045 10448.6 inner electrode bottom 7440-22-4 0.034 0.023 340.7 227.1 inner electrode bottom inner electrode bottom 1309-60-0 1303-86-2 0.023 0.025 0.025 227.1 252.9 252.9 inner electrode bottom inner electrode side inner electrode side 7631-86-9 7440-02-0 7440-47-3 0.401 4007.1 Resistive Film 12036-10-1 0.407 0.118 0.230 0.462 0.184 0.278 0.843 0.100 4066.1 1178.6 2298.2 4620.0 1838.6 2781.4 8428.6 1000.0 Resistive Film Resistive Film Resistive Film inner protective coat inner protective coat inner protective coat Outer protective coat Outer protective coat 1309-60-0 1303-86-2 7631-86-9 1309-60-0 1303-86-2 7631-86-9 129915-35-1 7631-86-9 Radioactive Substances 0 0 B203 Si02 Pbo B203 Si02 Epoxy Resin Si02 Cu0 0.126 1257.1 Outer protective coat 1317-38-0 Short Chain Chlorinated Paraffins 0 0 Cr203 0.257 2571.4 Outer protective coat 1308-38-9 Tributyl Tin (TBT) and Triphenyl Tin (TPT) 0 0 Mn02 0.043 428.6 Outer protective coat 1313-13-9 Tributyl Tin Oxide (TBTO) 0 0 Ni 5.057 50571.4 Middle termination 7440-02-0 Ethylene Glycol Ethers 0 0 Sn 4.397 43970.0 outer termination 7440-31-5 Others 0.308 3080.0 others (all locations) Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes % Weight 0 0 0 0 0 Reportable Substances Brominated Flame Retardants (Other than PPM 0 0 0 0 0 % Weight 0 PPM 0 Selenium & Selenium Compounds Antimony & Antimony Compounds 0 0 0 0 Arsenic & Arsenic Compounds 0 0 Beryllium & Beryllium Compounds 0 0 Process Data Bizmuth & Bizmuth Compounds 0 0 Peak Reflow (Deg. C) 260 0.126 1257.143 Time at Peak Temp. (s) 10 0 0 0.664 Nickel & Nickel Compounds Palladium & Palladium Compounds 0 0 3.567 35665.97 Copper & Copper Compounds Gold & Gold Compounds Magnesium Phthalates Silver & Silver Compounds Number of Reflows 3 6644.274 MSL 1 5.082 50824.29 Plating Material 0.069 689 Plating Thickness Underplate Material 10-Jan-06 3µm Backward Process Compatable Yes Signed: Michael E Griffith * Pb in in glass material for each location. Exempt per RoHS directive Annex 5 minimum Ni Underplate Thickness Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536. Dated: Sn 3µm minimum --- ® RoHS and Pb-Free Component Material Declaration material breakdown is for the KOA P/N RK73B1ETTPxxxJ KOA SPEER ELECTRONICS, INC. Product Information Breakdown of all Materials KOA Part Number: RoHS Compliant Part Number: Part Description: RK73B1ETTPxxxJ RK73B1ETTPxxxJ 0402, 5% SMD Part Weight (mg): 0.68 RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available RoHS Banned Substances Lead & Lead Compounds* Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight 0.735 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 % Weight Reportable Substances Brominated Flame Retardants (Other than 0 Selenium & Selenium Compounds 0 Antimony & Antimony Compounds 0 Arsenic & Arsenic Compounds 0 Beryllium & Beryllium Compounds 0 Bizmuth & Bizmuth Compounds 0 Copper & Copper Compounds 0.12 Gold & Gold Compounds 0 Magnesium 0.041 Nickel & Nickel Compounds 2.939 Palladium & Palladium Compounds 0.044 Phthalates 0 Silver & Silver Compounds 2.72 PPM 7350 0 0 PPM 0 0 0 0 0 0 1200 0 410 29390 440 0 27200 Materials Al203 Si02 Mg0 Ag Pd Pbo B203 Si02 Ag Pbo B203 Si02 Ni Cr Ru02 Pbo B203 Si02 Pbo B203 Si02 Epoxy Resin Si02 Cu0 Cr203 Mn02 Epoxy Resin Si02 Ti02 Ni Sn Others Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536. Dated: 10-Jan-06 Signed: Michael E Griffith * Pb is in glass material for each location. Exempt per RoHS directive Annex 5 % Weight 84.91 2.65 0.71 1.62 0.044 0.035 0.018 0.035 1.1 0.034 0.022 0.022 0.015 0.015 0.31 0.31 0.09 0.178 0.356 0.142 0.214 0.806 0.096 0.12 0.246 0.041 0.115 0.017 0.034 2.924 2.482 0.289 260 10 3 1 Sn 3µm Ni 3µm Yes (All materials in the part) PPM Where Used 849100 substrate 26500 substrate 7100 substrate 16200 inner electrode top 440 inner electrode top 350 inner electrode top 180 inner electrode top 350 inner electrode top 11000 inner electrode bottom 340 inner electrode bottom 220 inner electrode bottom 220 inner electrode bottom 150 inner electrode side 150 inner electrode side 3100 Resistive Film 3100 Resistive Film 900 Resistive Film 1780 Resistive Film 3560 inner protective coat 1420 inner protective coat 2140 inner protective coat 8060 Outer protective coat 960 Outer protective coat 1200 Outer protective coat 2460 Outer protective coat 410 Outer protective coat 1150 marking 170 marking 340 marking 29240 Middle termination 24820 outer termination 2890 others (all locations) minimum minimum CAS # 12036-10-1 7440-21-3 1313-13-9 7440-22-4 7440-05-3 1309-60-0 1303-86-2 7631-86-9 7440-22-4 1309-60-0 1303-86-2 7631-86-9 7440-02-0 7440-47-3 12036-10-1 1309-60-0 1303-86-2 7631-86-9 1309-60-0 1303-86-2 7631-86-9 129915-35-1 7631-86-9 1317-38-0 1308-38-9 1313-13-9 129915-35-1 7631-86-9 13463-67-7 7440-02-0 7440-31-5 --- ® RoHS and Pb-Free Component Material Declaration material breakdown is for the KOA P/N RK73B1JTTDxxxJ KOA SPEER ELECTRONICS, INC. Product Information Breakdown of all Materials KOA Part Number: RoHS Compliant Part Number: Part Description: RK73B1JTTDxxxJ RK73B1JTTDxxxJ 0603, 5% SMD 2.14 Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available RoHS Banned Substances Lead & Lead Compounds* Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight 0.735 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 % Weight Reportable Substances Brominated Flame Retardants (Other than 0 Selenium & Selenium Compounds 0 Antimony & Antimony Compounds 0 Arsenic & Arsenic Compounds 0 Beryllium & Beryllium Compounds 0 Bizmuth & Bizmuth Compounds 0 Copper & Copper Compounds 0.12 Gold & Gold Compounds 0 Magnesium 0.71 Nickel & Nickel Compounds 2.939 Palladium & Palladium Compounds 0.044 Phthalates 0 Silver & Silver Compounds 2.72 PPM 7350 0 0 PPM 0 0 0 0 0 0 1200 0 7100 29390 440 0 27200 Materials Al203 Si02 Mg0 Ag Pd Pbo B203 Si02 Ag Pbo B203 Si02 Ni Cr Ru02 Pbo B203 Si02 Pbo B203 Si02 Epoxy Resin Si02 Cu0 Cr203 Mn02 Epoxy Resin Si02 Ti02 Ni Sn Others Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536. Dated: 25-Jul-05 Signed: Michael E Griffith * Pb is in glass material for each location. Exempt per RoHS directive Annex 5 % Weight 84.91 2.65 0.71 1.62 0.044 0.035 0.018 0.035 1.1 0.034 0.022 0.022 0.015 0.015 0.31 0.31 0.09 0.178 0.356 0.142 0.214 0.806 0.096 0.12 0.246 0.041 0.115 0.017 0.034 2.924 2.482 0.289 260 10 3 1 Sn 3µm Ni 3µm Yes (All materials in the part) PPM Where Used 849100 substrate 26500 substrate 7100 substrate 16200 inner electrode top 440 inner electrode top 350 inner electrode top 180 inner electrode top 350 inner electrode top 11000 inner electrode bottom 340 inner electrode bottom 220 inner electrode bottom 220 inner electrode bottom 150 inner electrode side 150 inner electrode side 3100 Resistive Film 3100 Resistive Film 900 Resistive Film 1780 Resistive Film 3560 inner protective coat 1420 inner protective coat 2140 inner protective coat 8060 Outer protective coat 960 Outer protective coat 1200 Outer protective coat 2460 Outer protective coat 410 Outer protective coat 1150 marking 170 marking 340 marking 29240 Middle termination 24820 outer termination 2890 others (all locations) minimum minimum CAS # 12036-10-1 7440-21-3 1313-13-9 7440-22-4 7440-05-3 1309-60-0 1303-86-2 7631-86-9 7440-22-4 1309-60-0 1303-86-2 7631-86-9 7440-02-0 7440-47-3 12036-10-1 1309-60-0 1303-86-2 7631-86-9 1309-60-0 1303-86-2 7631-86-9 129915-35-1 7631-86-9 1317-38-0 1308-38-9 1313-13-9 129915-35-1 7631-86-9 13463-67-7 7440-02-0 7440-31-5 --- ® RoHS and Pb-Free Component Material Declaration material breakdown is for the KOA P/N RK73B2ATTDxxxJ KOA SPEER ELECTRONICS, INC. Product Information Breakdown of all Materials RK73B2ATTDxxxJ RK73B2ATTDxxxJ 0805, 5% SMD KOA Part Number: RoHS Compliant Part Number: Part Description: 4.54 Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available RoHS Banned Substances Lead & Lead Compounds* Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight 0.735 0 0 PPM 7350 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 % Weight Reportable Substances Brominated Flame Retardants (Other than 0 PBB or PBDE) Selenium & Selenium Compounds 0 Antimony & Antimony Compounds 0 Arsenic & Arsenic Compounds 0 Beryllium & Beryllium Compounds 0 Bizmuth & Bizmuth Compounds 0 Copper & Copper Compounds 0.12 Gold & Gold Compounds 0 Magnesium 0.71 Nickel & Nickel Compounds 2.939 Palladium & Palladium Compounds 0.044 Phthalates 0 Silver & Silver Compounds 2.72 PPM 0 0 0 0 0 0 1200 0 7100 29390 440 0 27200 Materials Al203 Si02 Mg0 Ag Pd Pbo B203 Si02 Ag Pbo B203 Si02 Ni Cr Ru02 Pbo B203 Si02 Pbo B203 Si02 Epoxy Resin Si02 Cu0 Cr203 Mn02 Epoxy Resin Si02 Ti02 Ni Sn Others Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536. Dated: 10-Jan-06 Signed: Michael E Griffith * Pb is in glass material for each location. Exempt per RoHS directive Annex 5 % Weight 84.91 2.65 0.71 1.62 0.044 0.035 0.018 0.035 1.1 0.034 0.022 0.022 0.015 0.015 0.31 0.31 0.09 0.178 0.356 0.142 0.214 0.806 0.096 0.12 0.246 0.041 0.115 0.017 0.034 2.924 2.482 0.289 260 10 3 1 Sn 3µm Ni 3µm Yes (All materials in the part) PPM Where Used 849100 substrate 26500 substrate 7100 substrate 16200 inner electrode top 440 inner electrode top 350 inner electrode top 180 inner electrode top 350 inner electrode top 11000 inner electrode bottom 340 inner electrode bottom 220 inner electrode bottom 220 inner electrode bottom 150 inner electrode side 150 inner electrode side 3100 Resistive Film 3100 Resistive Film 900 Resistive Film 1780 Resistive Film 3560 inner protective coat 1420 inner protective coat 2140 inner protective coat 8060 Outer protective coat 960 Outer protective coat 1200 Outer protective coat 2460 Outer protective coat 410 Outer protective coat 1150 marking 170 marking 340 marking 29240 Middle termination 24820 outer termination 2890 others (all locations) minimum minimum CAS # 12036-10-1 7440-21-3 1313-13-9 7440-22-4 7440-05-3 1309-60-0 1303-86-2 7631-86-9 7440-22-4 1309-60-0 1303-86-2 7631-86-9 7440-02-0 7440-47-3 12036-10-1 1309-60-0 1303-86-2 7631-86-9 1309-60-0 1303-86-2 7631-86-9 129915-35-1 7631-86-9 1317-38-0 1308-38-9 1313-13-9 129915-35-1 7631-86-9 13463-67-7 7440-02-0 7440-31-5 --- ® RoHS and Pb-Free Component Material Declaration material breakdown is for the KOA P/N RK73B2BTTDxxxJ KOA SPEER ELECTRONICS, INC. Product Information Breakdown of all Materials KOA Part Number: RoHS Compliant Part Number: Part Description: RK73B2BTTDxxxJ RK73B2BTTDxxxJ 1206, 5% SMD Part Weight (mg): 9.14 RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available RoHS Banned Substances Lead & Lead Compounds* Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight 0.735 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 % Weight Reportable Substances Brominated Flame Retardants (Other than 0 Selenium & Selenium Compounds 0 Antimony & Antimony Compounds 0 Arsenic & Arsenic Compounds 0 Beryllium & Beryllium Compounds 0 Bizmuth & Bizmuth Compounds 0 Copper & Copper Compounds 0.12 Gold & Gold Compounds 0 Magnesium 0.71 Nickel & Nickel Compounds 2.939 Palladium & Palladium Compounds 0.044 Phthalates 0 Silver & Silver Compounds 2.72 PPM 7350 0 0 PPM 0 0 0 0 0 0 1200 0 7100 29390 440 0 27200 Materials Al203 Si02 Mg0 Ag Pd Pbo B203 Si02 Ag Pbo B203 Si02 Ni Cr Ru02 Pbo B203 Si02 Pbo B203 Si02 Epoxy Resin Si02 Cu0 Cr203 Mn02 Epoxy Resin Si02 Ti02 Ni Sn Others Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536. Dated: 10-Jan-06 Michael E Griffith Signed: * Pb is in glass material for each location. Exempt per RoHS directive Annex 5 % Weight 84.91 2.65 0.71 1.62 0.044 0.035 0.018 0.035 1.1 0.034 0.022 0.022 0.015 0.015 0.31 0.31 0.09 0.178 0.356 0.142 0.214 0.806 0.096 0.12 0.246 0.041 0.115 0.017 0.034 2.924 2.482 0.289 260 10 3 1 Sn 3µm Ni 3µm Yes (All materials in the part) PPM Where Used 849100 substrate 26500 substrate 7100 substrate 16200 inner electrode top 440 inner electrode top 350 inner electrode top 180 inner electrode top 350 inner electrode top 11000 inner electrode bottom 340 inner electrode bottom 220 inner electrode bottom 220 inner electrode bottom 150 inner electrode side 150 inner electrode side 3100 Resistive Film 3100 Resistive Film 900 Resistive Film 1780 Resistive Film 3560 inner protective coat 1420 inner protective coat 2140 inner protective coat 8060 Outer protective coat 960 Outer protective coat 1200 Outer protective coat 2460 Outer protective coat 410 Outer protective coat 1150 marking 170 marking 340 marking 29240 Middle termination 24820 outer termination 2890 others (all locations) minimum minimum CAS # 12036-10-1 7440-21-3 1313-13-9 7440-22-4 7440-05-3 1309-60-0 1303-86-2 7631-86-9 7440-22-4 1309-60-0 1303-86-2 7631-86-9 7440-02-0 7440-47-3 12036-10-1 1309-60-0 1303-86-2 7631-86-9 1309-60-0 1303-86-2 7631-86-9 129915-35-1 7631-86-9 1317-38-0 1308-38-9 1313-13-9 129915-35-1 7631-86-9 13463-67-7 7440-02-0 7440-31-5 --- ® RoHS and Pb-Free Component Material Declaration material breakdown is for the KOA P/N RK73B2ETTDxxxJ KOA SPEER ELECTRONICS, INC. Product Information Breakdown of all Materials KOA Part Number: RoHS Compliant Part Number: Part Description: RK73B2ETTDxxxJ RK73B2ETTDxxxJ 1210, 5% SMD 15.5 Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available RoHS Banned Substances Lead & Lead Compounds* Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight 0.735 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 % Weight Reportable Substances Brominated Flame Retardants (Other than 0 Selenium & Selenium Compounds 0 Antimony & Antimony Compounds 0 Arsenic & Arsenic Compounds 0 Beryllium & Beryllium Compounds 0 Bizmuth & Bizmuth Compounds 0 Copper & Copper Compounds 0.12 Gold & Gold Compounds 0 Magnesium 0.71 Nickel & Nickel Compounds 2.939 Palladium & Palladium Compounds 0.044 Phthalates 0 Silver & Silver Compounds 2.72 PPM 7350 0 0 PPM 0 0 0 0 0 0 1200 0 7100 29390 440 0 27200 Materials Al203 Si02 Mg0 Ag Pd Pbo B203 Si02 Ag Pbo B203 Si02 Ni Cr Ru02 Pbo B203 Si02 Pbo B203 Si02 Epoxy Resin Si02 Cu0 Cr203 Mn02 Epoxy Resin Si02 Ti02 Ni Sn Others Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536. Dated: 10-Jan-06 Signed: Michael E Griffith * Pb in in glass material for each location. Exempt per RoHS directive Annex 5 % Weight 84.91 2.65 0.71 1.62 0.044 0.035 0.018 0.035 1.1 0.034 0.022 0.022 0.015 0.015 0.31 0.31 0.09 0.178 0.356 0.142 0.214 0.806 0.096 0.12 0.246 0.041 0.115 0.017 0.034 2.924 2.482 0.289 260 10 3 1 Sn 3µm Ni 3µm Yes (All materials in the part) PPM Where Used 849100 substrate 26500 substrate 7100 substrate 16200 inner electrode top 440 inner electrode top 350 inner electrode top 180 inner electrode top 350 inner electrode top 11000 inner electrode bottom 340 inner electrode bottom 220 inner electrode bottom 220 inner electrode bottom 150 inner electrode side 150 inner electrode side 3100 Resistive Film 3100 Resistive Film 900 Resistive Film 1780 Resistive Film 3560 inner protective coat 1420 inner protective coat 2140 inner protective coat 8060 Outer protective coat 960 Outer protective coat 1200 Outer protective coat 2460 Outer protective coat 410 Outer protective coat 1150 marking 170 marking 340 marking 29240 Middle termination 24820 outer termination 2890 others (all locations) minimum minimum CAS # 12036-10-1 7440-21-3 1313-13-9 7440-22-4 7440-05-3 1309-60-0 1303-86-2 7631-86-9 7440-22-4 1309-60-0 1303-86-2 7631-86-9 7440-02-0 7440-47-3 12036-10-1 1309-60-0 1303-86-2 7631-86-9 1309-60-0 1303-86-2 7631-86-9 129915-35-1 7631-86-9 1317-38-0 1308-38-9 1313-13-9 129915-35-1 7631-86-9 13463-67-7 7440-02-0 7440-31-5 --- ® RoHS and Pb-Free Component Material Declaration material breakdown is for the KOA P/N RK73B2HTTExxxJ KOA SPEER ELECTRONICS, INC. Product Information Breakdown of all Materials KOA Part Number: RoHS Compliant Part Number: Part Description: RK73B2HTTExxxJ RK73B2HTTExxxJ 2010, 5% SMD 24.3 Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available RoHS Banned Substances Lead & Lead Compounds* Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight 0.735 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 % Weight Reportable Substances Brominated Flame Retardants (Other than 0 Selenium & Selenium Compounds 0 Antimony & Antimony Compounds 0 Arsenic & Arsenic Compounds 0 Beryllium & Beryllium Compounds 0 Bizmuth & Bizmuth Compounds 0 Copper & Copper Compounds 0.12 Gold & Gold Compounds 0 Magnesium 0.71 Nickel & Nickel Compounds 2.939 Palladium & Palladium Compounds 0.044 Phthalates 0 Silver & Silver Compounds 2.72 PPM 7350 0 0 PPM 0 0 0 0 0 0 1200 0 7100 29390 440 0 27200 Materials Al203 Si02 Mg0 Ag Pd Pbo B203 Si02 Ag Pbo B203 Si02 Ni Cr Ru02 Pbo B203 Si02 Pbo B203 Si02 Epoxy Resin Si02 Cu0 Cr203 Mn02 Epoxy Resin Si02 Ti02 Ni Sn Others Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536. Dated: 10-Jan-06 Signed: Michael E Griffith * Pb in in glass material for each location. Exempt per RoHS directive Annex 5 % Weight 84.91 2.65 0.71 1.62 0.044 0.035 0.018 0.035 1.1 0.034 0.022 0.022 0.015 0.015 0.31 0.31 0.09 0.178 0.356 0.142 0.214 0.806 0.096 0.12 0.246 0.041 0.115 0.017 0.034 2.924 2.482 0.289 260 10 3 1 Sn 3µm Ni 3µm Yes (All materials in the part) PPM Where Used 849100 substrate 26500 substrate 7100 substrate 16200 inner electrode top 440 inner electrode top 350 inner electrode top 180 inner electrode top 350 inner electrode top 11000 inner electrode bottom 340 inner electrode bottom 220 inner electrode bottom 220 inner electrode bottom 150 inner electrode side 150 inner electrode side 3100 Resistive Film 3100 Resistive Film 900 Resistive Film 1780 Resistive Film 3560 inner protective coat 1420 inner protective coat 2140 inner protective coat 8060 Outer protective coat 960 Outer protective coat 1200 Outer protective coat 2460 Outer protective coat 410 Outer protective coat 1150 marking 170 marking 340 marking 29240 Middle termination 24820 outer termination 2890 others (all locations) minimum minimum CAS # 12036-10-1 7440-21-3 1313-13-9 7440-22-4 7440-05-3 1309-60-0 1303-86-2 7631-86-9 7440-22-4 1309-60-0 1303-86-2 7631-86-9 7440-02-0 7440-47-3 12036-10-1 1309-60-0 1303-86-2 7631-86-9 1309-60-0 1303-86-2 7631-86-9 129915-35-1 7631-86-9 1317-38-0 1308-38-9 1313-13-9 129915-35-1 7631-86-9 13463-67-7 7440-02-0 7440-31-5 --- ® RoHS and Pb-Free Component Material Declaration material breakdown is for the KOA P/N RK73B3ATTExxxJ KOA SPEER ELECTRONICS, INC. Product Information Breakdown of all Materials KOA Part Number: RoHS Compliant Part Number: Part Description: RK73B3ATTExxxJ RK73B3ATTExxxJ 2512, 5% SMD 37.1 Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available RoHS Banned Substances Lead & Lead Compounds* Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight 0.735 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 % Weight Reportable Substances Brominated Flame Retardants (Other than 0 Selenium & Selenium Compounds 0 Antimony & Antimony Compounds 0 Arsenic & Arsenic Compounds 0 Beryllium & Beryllium Compounds 0 Bizmuth & Bizmuth Compounds 0 Copper & Copper Compounds 0.12 Gold & Gold Compounds 0 Magnesium 0.71 Nickel & Nickel Compounds 2.939 Palladium & Palladium Compounds 0.044 Phthalates 0 Silver & Silver Compounds 2.72 PPM 7350 0 0 PPM 0 0 0 0 0 0 1200 0 7100 29390 440 0 27200 Materials Al203 Si02 Mg0 Ag Pd Pbo B203 Si02 Ag Pbo B203 Si02 Ni Cr Ru02 Pbo B203 Si02 Pbo B203 Si02 Epoxy Resin Si02 Cu0 Cr203 Mn02 Epoxy Resin Si02 Ti02 Ni Sn Others Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536. Dated: 10-Jan-06 Signed: Michael E Griffith * Pb in in glass material for each location. Exempt per RoHS directive Annex 5 % Weight 84.91 2.65 0.71 1.62 0.044 0.035 0.018 0.035 1.1 0.034 0.022 0.022 0.015 0.015 0.31 0.31 0.09 0.178 0.356 0.142 0.214 0.806 0.096 0.12 0.246 0.041 0.115 0.017 0.034 2.924 2.482 0.289 260 10 3 1 Sn 3µm Ni 3µm Yes (All materials in the part) PPM Where Used 849100 substrate 26500 substrate 7100 substrate 16200 inner electrode top 440 inner electrode top 350 inner electrode top 180 inner electrode top 350 inner electrode top 11000 inner electrode bottom 340 inner electrode bottom 220 inner electrode bottom 220 inner electrode bottom 150 inner electrode side 150 inner electrode side 3100 Resistive Film 3100 Resistive Film 900 Resistive Film 1780 Resistive Film 3560 inner protective coat 1420 inner protective coat 2140 inner protective coat 8060 Outer protective coat 960 Outer protective coat 1200 Outer protective coat 2460 Outer protective coat 410 Outer protective coat 1150 marking 170 marking 340 marking 29240 Middle termination 24820 outer termination 2890 others (all locations) minimum minimum CAS # 12036-10-1 7440-21-3 1313-13-9 7440-22-4 7440-05-3 1309-60-0 1303-86-2 7631-86-9 7440-22-4 1309-60-0 1303-86-2 7631-86-9 7440-02-0 7440-47-3 12036-10-1 1309-60-0 1303-86-2 7631-86-9 1309-60-0 1303-86-2 7631-86-9 129915-35-1 7631-86-9 1317-38-0 1308-38-9 1313-13-9 129915-35-1 7631-86-9 13463-67-7 7440-02-0 7440-31-5 ---