® RoHS and Pb-Free Component Material Declaration KOA SPEER ELECTRONICS, INC. Product Information KOA Part Number: RoHS/Pb-Free Compliant Part Number: Part Description: Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production RoHS Banned Substances Lead & Lead Compounds Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Breakdown of all Materials KQ0805LTExxxz KQ0805LTExxxz wirewound Inductor SMD 1008 12 Silver Palladium Nickel Tin Cooper Polyester Resin epoxy resin Polymide Pb Dimethylacetamide Now Available Now Available % Weight % Weight Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight (All materials in the part) PPM Where Used 83.38 1.69 0.07 0.52 1.26 8.9 0.09 1.04 2.6 0.15 0.3 833800 16900 700 5200 12600 89000 900 10400 26000 1500 3000 PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 Reportable Substances % Weight Brominated Flame Retardants (Other than 0 PBB or PBDE) Selenium & Selenium Compounds Materials Ceramic (Al 2O3) 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Reportable Substances (Con't) Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds 260 10 3 1 Matte Sn 3 Ni 3 Yes % Weight minimum minimum PPM 0.52 5200 0.07 700 1.69 16900 Substrate inner electrode inner electrode middle termination outer termination wire wire coating glue for top cover epoxy cover outer termination epoxy cover ® RoHS and Pb-Free Component Material Declaration KOA SPEER ELECTRONICS, INC. Product Information Breakdown of all Materials KOA Part Number: KQ1008TTE3R9K120MSRF RoHS/Pb-Free Compliant Part Number: Part Description: KQ1008TTE3R9K120MSRF wirewound Inductor SMD 1008 30 Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production RoHS Banned Substances Lead & Lead Compounds Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Now Available Now Available % Weight % Weight Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers Silver Palladium Nickel Tin Cooper Polyester Resin epoxy resin Polymide Dimethylacetamide % Weight (All materials in the part) PPM Where Used 83.38 1.69 0.07 0.52 1.41 8.9 0.09 1.04 2.6 0.3 833800 16900 700 5200 14100 89000 900 10400 26000 3000 PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 Reportable Substances % Weight Brominated Flame Retardants (Other than 0 PBB or PBDE) Selenium & Selenium Compounds Materials Ceramic (Al 2O3) 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Reportable Substances (Con't) Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds 260 10 3 1 Matte Sn 3 Ni 3 Yes % Weight minimum minimum PPM 0.52 5200 0.07 700 1.69 16900 Substrate inner electrode inner electrode middle termination outer termination wire wire coating glue for top cover epoxy cover epoxy cover ® RoHS and Pb-Free Component Material Declaration KOA SPEER ELECTRONICS, INC. Product Information KOA Part Number: RoHS/Pb-Free Compliant Part Number: Part Description: Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production RoHS Banned Substances Lead & Lead Compounds Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Breakdown of all Materials KQ0805TTExxxz KQ0805TTExxxz wirewound Inductor SMD 1008 12 Silver Palladium Nickel Tin Cooper Polyester Resin epoxy resin Polymide Dimethylacetamide Now Available Now Available % Weight % Weight Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight (All materials in the part) PPM Where Used 83.38 1.69 0.07 0.52 1.41 8.9 0.09 1.04 2.6 0.3 833800 16900 700 5200 14100 89000 900 10400 26000 3000 PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 Reportable Substances % Weight Brominated Flame Retardants (Other than 0 PBB or PBDE) Selenium & Selenium Compounds Materials Ceramic (Al 2O3) 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Reportable Substances (Con't) Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds 260 10 3 1 Matte Sn 3 Ni 3 Yes % Weight minimum minimum PPM 0.52 5200 0.07 700 1.69 16900 Substrate inner electrode inner electrode middle termination outer termination wire wire coating glue for top cover epoxy cover epoxy cover ® RoHS and Pb-Free Component Material Declaration KOA SPEER ELECTRONICS, INC. Product Information KOA Part Number: RoHS/Pb-Free Compliant Part Number: Part Description: Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production RoHS Banned Substances Lead & Lead Compounds Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Breakdown of all Materials KQ1008TTExxxz KQ1008TTExxxz wirewound Inductor SMD 1008 30 Silver Palladium Nickel Tin Cooper Polyester Resin epoxy resin Polymide Dimethylacetamide Now Available Now Available % Weight % Weight Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight (All materials in the part) PPM Where Used 83.38 1.69 0.07 0.52 1.41 8.9 0.09 1.04 2.6 0.3 833800 16900 700 5200 14100 89000 900 10400 26000 3000 PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 Reportable Substances % Weight Brominated Flame Retardants (Other than 0 PBB or PBDE) Selenium & Selenium Compounds Materials Ceramic (Al 2O3) 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Reportable Substances (Con't) Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds 260 10 3 1 Matte Sn 3 Ni 3 Yes % Weight minimum minimum PPM 0.52 5200 0.07 700 1.69 16900 Substrate inner electrode inner electrode middle termination outer termination wire wire coating glue for top cover epoxy cover epoxy cover