® Component Material Declaration material breakdown is for the KOA P/N: KL32TTExxxxy* KOA SPEER ELECTRONICS, INC. Product Information Breakdown of all Materials KL32TTExxxy* KL32TTExxxy* 1210 SMD inductor KOA Part Number: RoHS Compliant Part Number: Part Description: Part Weight (mg): 50 RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available * xxxx = value, y = tolerance RoHS Banned Substances Lead & Lead Compounds Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight 0.000006% 0 0 0 PPM 0.06 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants* Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 % Weight PPM 0.534% 5340 0 0 0 0 1.920% 39.540% 0 0 7.940% 0 0 0 0 5340 0 0 19200 395400 0 0 79400 0 0 0 * not on list of banned substances Reportable Substances Brominated Flame Retardants (Other than PBB or PBDE) Selenium & Selenium Compounds Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds Materials Manganese Oxide Nickel Oxide Red Iron Oxide Bismuth Trioxide Silicon Dioxide Copper Tin Dicyandiamide Aluminum Oxide Copper Copper Polyurethane Cadmium Compound Chrome Compound Lead Compound Tin Nickel Copper Molten Silica Cresol Novolac Epoxy Phenol Novolac Antimony Trioxide Brominated Epoxy Resin Aluminum Phenolic Compound Toluene Other components Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536. Dated: 22-Mar-06 Signed: Michael E Griffith % Weight (All materials in the part) PPM 0.72% 7.40% 12.48% 1.920% 2.200% 5.661% 1.499% 1.140% 0.060% 0.800% 5.700% 0.300% 0.00003% 0.000003% 0.000006% 2.520000% 0.540000% 33.0400% 15.30% 5.077% 2.5383% 0.540% 0.534% 0.00266% 0.00452% 0.001% 0.0225% 7200 74000 124800 19200 22000 56610 14990 11400 600 8000 57000 3000 0.3 0.03 0.06 25200 5400 330400 153000 50770 25383 5400 5340 26.6 45.2 10 225 260 10 3 1 SnCu 3µm Ni 3µm Yes minimum minimum Where Used Ferrite Core Ferrite Core Ferrite Core Ferrite Core Ferrite Core internal solder internal solder Adhesive Adhesive Adhesive Winding Wire Winding Wire Winding Wire Winding Wire Winding Wire Outer Electrode Middle Electrode Leadframe Molding material Molding material Molding material Molding material Molding material Marking Marking Marking Marking CAS # 1317-38-0 1313-99-1 1317-38-0 1304-76-3 14808-60-7 7440-50-8 7440-31-5 461-58-5 1344-28-1 7440-50-8 7440-50-8 1306-19-0 1308-38-9 1307-96-6 7440-31-5 7440-02-0 7440-50-8 60676-86-0 29690-82-2 1309-35-4 40039-93-8 1344-28-1 -