KSE Reportable Substance KL32TTExxxy

®
Component Material Declaration
material breakdown is for the KOA P/N: KL32TTExxxxy*
KOA SPEER ELECTRONICS, INC.
Product Information
Breakdown of all Materials
KL32TTExxxy*
KL32TTExxxy*
1210 SMD inductor
KOA Part Number:
RoHS Compliant Part Number:
Part Description:
Part Weight (mg):
50
RoHS/Pb-Free Compliant Samples:
RoHS/Pb-Free Compliant Production:
Now Available
Now Available
* xxxx = value, y = tolerance
RoHS Banned Substances
Lead & Lead Compounds
Mercury & Mercury Compounds
Cadmium & Cadmium Compounds
Hexavalent Chromium & Hexavalent
Chromium Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
% Weight
0.000006%
0
0
0
PPM
0.06
0
0
0
0
0
0
0
Other Banned Substances
Asbestos
Azo Colorants*
Ozone Depleting Substances
Polyclorinated Biphenyls (PCB)
Polychlorinated Naphthalenes
Radioactive Substances
Short Chain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Ethylene Glycol Ethers
% Weight
0
0
0
0
0
0
0
0
0
0
PPM
0
0
0
0
0
0
0
0
0
0
% Weight
PPM
0.534%
5340
0
0
0
0
1.920%
39.540%
0
0
7.940%
0
0
0
0
5340
0
0
19200
395400
0
0
79400
0
0
0
* not on list of banned substances
Reportable Substances
Brominated Flame Retardants (Other than
PBB or PBDE)
Selenium & Selenium Compounds
Antimony & Antimony Compounds
Arsenic & Arsenic Compounds
Beryllium & Beryllium Compounds
Bizmuth & Bizmuth Compounds
Copper & Copper Compounds
Gold & Gold Compounds
Magnesium
Nickel & Nickel Compounds
Palladium & Palladium Compounds
Phthalates
Silver & Silver Compounds
Materials
Manganese Oxide
Nickel Oxide
Red Iron Oxide
Bismuth Trioxide
Silicon Dioxide
Copper
Tin
Dicyandiamide
Aluminum Oxide
Copper
Copper
Polyurethane
Cadmium Compound
Chrome Compound
Lead Compound
Tin
Nickel
Copper
Molten Silica
Cresol Novolac Epoxy
Phenol Novolac
Antimony Trioxide
Brominated Epoxy Resin
Aluminum
Phenolic Compound
Toluene
Other components
Process Data
Peak Reflow (Deg. C)
Time at Peak Temp. (s)
Number of Reflows
MSL
Plating Material
Plating Thickness
Underplate Material
Underplate Thickness
Backward Process Compatable
Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536.
Dated:
22-Mar-06
Signed:
Michael E Griffith
% Weight
(All materials in the part)
PPM
0.72%
7.40%
12.48%
1.920%
2.200%
5.661%
1.499%
1.140%
0.060%
0.800%
5.700%
0.300%
0.00003%
0.000003%
0.000006%
2.520000%
0.540000%
33.0400%
15.30%
5.077%
2.5383%
0.540%
0.534%
0.00266%
0.00452%
0.001%
0.0225%
7200
74000
124800
19200
22000
56610
14990
11400
600
8000
57000
3000
0.3
0.03
0.06
25200
5400
330400
153000
50770
25383
5400
5340
26.6
45.2
10
225
260
10
3
1
SnCu
3µm
Ni
3µm
Yes
minimum
minimum
Where Used
Ferrite Core
Ferrite Core
Ferrite Core
Ferrite Core
Ferrite Core
internal solder
internal solder
Adhesive
Adhesive
Adhesive
Winding Wire
Winding Wire
Winding Wire
Winding Wire
Winding Wire
Outer Electrode
Middle Electrode
Leadframe
Molding material
Molding material
Molding material
Molding material
Molding material
Marking
Marking
Marking
Marking
CAS #
1317-38-0
1313-99-1
1317-38-0
1304-76-3
14808-60-7
7440-50-8
7440-31-5
461-58-5
1344-28-1
7440-50-8
7440-50-8
1306-19-0
1308-38-9
1307-96-6
7440-31-5
7440-02-0
7440-50-8
60676-86-0
29690-82-2
1309-35-4
40039-93-8
1344-28-1
-