® Component Material Declaration material breakdown is for the KOA P/N TMRzzBTTExxxy KOA SPEER ELECTRONICS, INC. Product Information Breakdown of all Materials TMRzzBTTExxxy* TMRzzBTTExxxy* 3528, Tan. Cap KOA Part Number: RoHS Compliant Part Number: Part Description: 62 Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: * zz = voltage, xxx = value, y = tolerance RoHS Banned Substances Lead & Lead Compounds Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Now Available Now Available % Weight PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Other Banned Substances % Weight PPM Asbestos 0 Azo Colorants 0 Ozone Depleting Substances 0 Polyclorinated Biphenyls (PCB) 0 Polychlorinated Naphthalenes 0 Radioactive Substances 0 Short Chain Chlorinated Paraffins 0 Tributyl Tin (TBT) and Triphenyl Tin (TPT) 0 Tributyl Tin Oxide (TBTO) 0 Ethylene Glycol Ethers 0 % Weight Reportable Substances Brominated Flame Retardants (Other than 0.65 PBB or PBDE) Selenium & Selenium Compounds 0 Antimony & Antimony Compounds 0.65 Arsenic & Arsenic Compounds 0 Beryllium & Beryllium Compounds 0 Bizmuth & Bizmuth Compounds 0 Copper & Copper Compounds 0 Gold & Gold Compounds 0 Magnesium 0 Nickel & Nickel Compounds 4.79 Palladium & Palladium Compounds 0 Phthalates 0 Silver & Silver Compounds 4.61 0 0 0 0 0 0 0 0 0 0 Materials Tantalum Manganese Oxide Carbon Silver Epoxy Resin Phenol Resin Brominated Flame Retardent Antimony Trioxide Silica Tin Iron Nickel Teflon UV ink Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable PPM 6500 0 6500 0 0 0 0 0 0 47900 0 0 46100 Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536. Dated: 25-Jul-05 Signed: Michael E Griffith % Weight 42.57 6.39 1.84 4.61 4.92 2.62 0.65 0.65 23.91 0.08 6.58 4.79 0.37 0.02 260 10 3 1 Sn 3µm Nickel 3µm Yes (All materials in the part) PPM Where Used 425700 Capacitor Element 63900 Capacitor Element 18400 Capacitor Element 46100 Capacitor Element 49200 Mold Encapsulation 26200 Mold Encapsulation 6500 Mold Encapsulation 6500 Mold Encapsulation 239100 Mold Encapsulation 800 Termination plating 65800 Terminal 47900 Terminal 3700 Supporter 200 Marking minimum minimum CAS # 7440-25-7 1313-13-9 7782-42-5 7440-22-4 29690-82-2 9003-35-4 40039-93-8 1309-64-4 60676-86-0 7440-31-5 7439-89-6 7440-02-0 9002-84-0 - ® Component Material Declaration material breakdown is for the KOA P/N TMRzzCTTExxxy KOA SPEER ELECTRONICS, INC. Product Information Breakdown of all Materials TMRzzCTTExxxy* TMRzzCTTExxxy* 6032, Tan. Cap KOA Part Number: RoHS Compliant Part Number: Part Description: 163 Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: * zz = voltage, xxx = value, y = tolerance RoHS Banned Substances Lead & Lead Compounds Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Now Available Now Available % Weight PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Other Banned Substances % Weight PPM Asbestos 0 Azo Colorants 0 Ozone Depleting Substances 0 Polyclorinated Biphenyls (PCB) 0 Polychlorinated Naphthalenes 0 Radioactive Substances 0 Short Chain Chlorinated Paraffins 0 Tributyl Tin (TBT) and Triphenyl Tin (TPT) 0 Tributyl Tin Oxide (TBTO) 0 Ethylene Glycol Ethers 0 % Weight Reportable Substances Brominated Flame Retardants (Other than 0.65 PBB or PBDE) Selenium & Selenium Compounds 0 Antimony & Antimony Compounds 0.65 Arsenic & Arsenic Compounds 0 Beryllium & Beryllium Compounds 0 Bizmuth & Bizmuth Compounds 0 Copper & Copper Compounds 0 Gold & Gold Compounds 0 Magnesium 0 Nickel & Nickel Compounds 4.79 Palladium & Palladium Compounds 0 Phthalates 0 Silver & Silver Compounds 4.61 0 0 0 0 0 0 0 0 0 0 Materials Tantalum Manganese Oxide Carbon Silver Epoxy Resin Phenol Resin Brominated Flame Retardent Antimony Trioxide Silica Tin Iron Nickel Teflon UV ink Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable PPM 6500 0 6500 0 0 0 0 0 0 47900 0 0 46100 Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536. Dated: 25-Jul-05 Signed: Michael E Griffith % Weight 42.57 6.39 1.84 4.61 4.92 2.62 0.65 0.65 23.91 0.08 6.58 4.79 0.37 0.02 260 10 3 1 Sn 3µm Nickel 3µm Yes (All materials in the part) PPM Where Used 425700 Capacitor Element 63900 Capacitor Element 18400 Capacitor Element 46100 Capacitor Element 49200 Mold Encapsulation 26200 Mold Encapsulation 6500 Mold Encapsulation 6500 Mold Encapsulation 239100 Mold Encapsulation 800 Termination plating 65800 Terminal 47900 Terminal 3700 Supporter 200 Marking minimum minimum CAS # 7440-25-7 1313-13-9 7782-42-5 7440-22-4 29690-82-2 9003-35-4 40039-93-8 1309-64-4 60676-86-0 7440-31-5 7439-89-6 7440-02-0 9002-84-0 - ® Component Material Declaration material breakdown is for the KOA P/N TMRzzETTExxxy KOA SPEER ELECTRONICS, INC. Product Information Breakdown of all Materials TMRzzETTExxxy* TMRzzETTExxxy* 7343, Tan. Cap KOA Part Number: RoHS Compliant Part Number: Part Description: 318 Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: * zz = voltage, xxx = value, y = tolerance RoHS Banned Substances Lead & Lead Compounds Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Now Available Now Available % Weight PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Other Banned Substances % Weight PPM Asbestos 0 Azo Colorants 0 Ozone Depleting Substances 0 Polyclorinated Biphenyls (PCB) 0 Polychlorinated Naphthalenes 0 Radioactive Substances 0 Short Chain Chlorinated Paraffins 0 Tributyl Tin (TBT) and Triphenyl Tin (TPT) 0 Tributyl Tin Oxide (TBTO) 0 Ethylene Glycol Ethers 0 % Weight Reportable Substances Brominated Flame Retardants (Other than 0.65 PBB or PBDE) Selenium & Selenium Compounds 0 Antimony & Antimony Compounds 0.65 Arsenic & Arsenic Compounds 0 Beryllium & Beryllium Compounds 0 Bizmuth & Bizmuth Compounds 0 Copper & Copper Compounds 0 Gold & Gold Compounds 0 Magnesium 0 Nickel & Nickel Compounds 4.79 Palladium & Palladium Compounds 0 Phthalates 0 Silver & Silver Compounds 4.61 0 0 0 0 0 0 0 0 0 0 Materials Tantalum Manganese Oxide Carbon Silver Epoxy Resin Phenol Resin Brominated Flame Retardent Antimony Trioxide Silica Tin Iron Nickel Teflon UV ink Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable PPM 6500 0 6500 0 0 0 0 0 0 47900 0 0 46100 Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536. Dated: 25-Jul-05 Signed: Michael E Griffith % Weight 42.57 6.39 1.84 4.61 4.92 2.62 0.65 0.65 23.91 0.08 6.58 4.79 0.37 0.02 260 10 3 1 Sn 3µm Nickel 3µm Yes (All materials in the part) PPM Where Used 425700 Capacitor Element 63900 Capacitor Element 18400 Capacitor Element 46100 Capacitor Element 49200 Mold Encapsulation 26200 Mold Encapsulation 6500 Mold Encapsulation 6500 Mold Encapsulation 239100 Mold Encapsulation 800 Termination plating 65800 Terminal 47900 Terminal 3700 Supporter 200 Marking minimum minimum CAS # 7440-25-7 1313-13-9 7782-42-5 7440-22-4 29690-82-2 9003-35-4 40039-93-8 1309-64-4 60676-86-0 7440-31-5 7439-89-6 7440-02-0 9002-84-0 -