KSE Reportable Substance CCP2EzzxxxTTE

®
Component Material Declaration
material breakdown is for the KOA P/N CCP2BzzxxxTTE
zz = current rating, xxx = fusing magnification
KOA SPEER ELECTRONICS, INC.
Product Information
Breakdown of all Materials
CCP2BzzxxxTTE
CCP2BzzxxxTTE
1206 fuse, SMD
KOA Part Number:
RoHS Compliant Part Number:
Part Description:
16
Part Weight (mg):
RoHS/Pb-Free Compliant Samples:
RoHS/Pb-Free Compliant Production:
Now Available
Now Available
RoHS Banned Substances
Lead & Lead Compounds*
Mercury & Mercury Compounds
Cadmium & Cadmium Compounds
Hexavalent Chromium & Hexavalent
Chromium Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
% Weight
0.0016
0
0
0
0
0
0
0
0
Other Banned Substances
Asbestos
Azo Colorants
Ozone Depleting Substances
Polyclorinated Biphenyls (PCB)
Polychlorinated Naphthalenes
Radioactive Substances
Short Chain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Ethylene Glycol Ethers
% Weight
0
0
0
0
0
0
0
0
0
0
PPM
0
0
0
0
0
0
0
0
0
0
Reportable Substances
% Weight
PPM
0.9988
9988
0
1.0248
0
0
0
39.7036
0
39.7036
0.9223
0
0
0
0
10248
0
0
0
397036
0
397036
9223
0
0
0
Brominated Flame Retardants (Other than
PBB or PBDE)
Selenium & Selenium Compounds
Antimony & Antimony Compounds
Arsenic & Arsenic Compounds
Beryllium & Beryllium Compounds
Bizmuth & Bizmuth Compounds
Copper & Copper Compounds
Gold & Gold Compounds
Magnesium
Nickel & Nickel Compounds
Palladium & Palladium Compounds
Phthalates
Silver & Silver Compounds
PPM
16
0
0
Materials
% Weight
Aluminum
0.0065
Silicon
0.0001
Cu
39.7036
Ni
0.9223
P
0.0157
Sn
1.7858
0.0016
Pb
Silicon
9.3784
Si02 (fused silica)
30.9663
Sb203 (Antimonyoxide)
1.0248
ORTHO-CRESOL, POLYMER WITH 1 10.1889
PHENOL-FORMALDEHYDE RESIN, P 4.9544
Brominated Epoxy
0.9988
2-Propenoic acid, polymer with 2
0.0248
Benzonic, acid 4
0.0053
Titanium Oxide
0.0211
0.0016
Other
Process Data
Peak Reflow (Deg. C)
Time at Peak Temp. (s)
Number of Reflows
MSL
Plating Material
Plating Thickness
Underplate Material
Underplate Thickness
Backward Process Compatable
Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536.
Dated:
23-Mar-06
Signed:
Michael E Griffith
260
10
3
1
Sn
3µm
Ni
3µm
Yes
(All materials in the part)
PPM
Where Used
65
Fuse Element
1
Fuse Element
397036 Electrode
9223
Electrode
157
Electrode
17858 Electrode
16
Electrode
93784 Buffer
309663 Molding
10248 Molding
101889 Molding
49544 Molding
9988
Molding
248
Marking
53
Marking
211
Marking
16
Marking
minimum
minimum
CAS #
7429-90-5
7440-21-3
7440-50-8
7440-02-0
7723-14-0
7440-31-5
7440-21-3
--60676-86-0
1309-64-4
29690-82-2
9003-35-4
40039-93-8
53192-18-0
21245-01-2
13463-67-7
---
®
Component Material Declaration
material breakdown is for the KOA P/N CCP2EzzxxxTTE
zz = current rating, xxx = fusing magnification
KOA SPEER ELECTRONICS, INC.
Product Information
Breakdown of all Materials
CCP2EzzxxxTTE
CCP2EzzxxxTTE
1210 fuse, SMD
KOA Part Number:
RoHS Compliant Part Number:
Part Description:
39
Part Weight (mg):
RoHS/Pb-Free Compliant Samples:
RoHS/Pb-Free Compliant Production:
Now Available
Now Available
RoHS Banned Substances
Lead & Lead Compounds*
Mercury & Mercury Compounds
Cadmium & Cadmium Compounds
Hexavalent Chromium & Hexavalent
Chromium Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
% Weight
0.0012
0
0
0
0
0
0
0
0
Other Banned Substances
Asbestos
Azo Colorants
Ozone Depleting Substances
Polyclorinated Biphenyls (PCB)
Polychlorinated Naphthalenes
Radioactive Substances
Short Chain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Ethylene Glycol Ethers
% Weight
0
0
0
0
0
0
0
0
0
0
PPM
0
0
0
0
0
0
0
0
0
0
Reportable Substances
% Weight
PPM
1.3091
13091
0
1.3432
0
0
0
30.0978
0
30.0978
0.6991
0
0
0
0
13432
0
0
0
300978
0
300978
6991
0
0
0
Brominated Flame Retardants (Other than
PBB or PBDE)
Selenium & Selenium Compounds
Antimony & Antimony Compounds
Arsenic & Arsenic Compounds
Beryllium & Beryllium Compounds
Bizmuth & Bizmuth Compounds
Copper & Copper Compounds
Gold & Gold Compounds
Magnesium
Nickel & Nickel Compounds
Palladium & Palladium Compounds
Phthalates
Silver & Silver Compounds
PPM
12
0
0
Materials
% Weight
Aluminum
0.002574
Silicon
0.000026
Cu
30.0978
Ni
0.6991
P
0.012
Sn
1.3536
0.0012
Pb
Silicon
5.4983
Si02 (fused silica)
40.5829
Sb203 (Antimonyoxide)
1.3432
ORTHO-CRESOL, POLYMER WITH 1 12.5676
PHENOL-FORMALDEHYDE RESIN, P 6.4933
Brominated Epoxy
1.3091
2-Propenoic acid, polymer with 2
0.0185
Benzonic, acid 4
0.0039
Titanium Oxide
0.0157
0.0012
Other
Process Data
Peak Reflow (Deg. C)
Time at Peak Temp. (s)
Number of Reflows
MSL
Plating Material
Plating Thickness
Underplate Material
Underplate Thickness
Backward Process Compatable
Any questions please contact KOA Speer Electronics, Inc. at 814-362-5536.
Dated:
23-Mar-06
Signed:
Michael E Griffith
260
10
3
1
Sn
3µm
Ni
3µm
Yes
(All materials in the part)
PPM
Where Used
25.74 Fuse Element
0.26
Fuse Element
300978 Electrode
6991
Electrode
120
Electrode
13536 Electrode
12
Electrode
54983 Buffer
405829 Molding
13432 Molding
125676 Molding
64933 Molding
13091 Molding
185
Marking
39
Marking
157
Marking
12
Marking
minimum
minimum
CAS #
7429-90-5
7440-21-3
7440-50-8
7440-02-0
7723-14-0
7440-31-5
7440-21-3
--60676-86-0
1309-64-4
29690-82-2
9003-35-4
40039-93-8
53192-18-0
21245-01-2
13463-67-7
---