CPC1114N 60V Normally-Closed Single-Pole 4-Pin SOP OptoMOS® Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current Max On-Resistance LED Current to Operate Rating 60 400 2 2 Units VP mArms / mADC mA Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Features • • • • • • • • Description The CPC1114N is a single-pole, normally-closed (1-Form-B) solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide 1500Vrms of input/output isolation. 1500Vrms Input/Output Isolation Small 4-Pin SOP Package High Reliability Arc-Free With No Snubbing Circuits No EMI/RFI Generation Immune to radiated EM fields Wave Solderable Tape & Reel Version Available IXYS Integrated Circuits Division’s state of the art double-molded vertical construction packaging makes the CPC1114N one of the world’s smallest relays. It offers board space savings of at least 20% over the competitor’s larger 4-pin SOP relay. Approvals Applications • Security • Passive Infrared Detectors (PIR) • Data Signalling • Sensor Circuitry • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Aerospace • Industrial Controls • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1172007 • EN/IEC 60950-1 Certified Component: Certificate B 13 12 82667 003 Ordering Information Part # CPC1114N CPC1114NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel) Pin Configuration + Control – Control 1 4 2 3 Load Load Switching Characteristics of Normally-Closed Devices Form-B IF ILOAD 90% 10% toff DS-CPC1114N-R02 www.ixysic.com ton 1 INTEGRATED CIRCUITS DIVISION CPC1114N Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Disipation Total Power Dissipation 1 Isolation Voltage, Input to Output ESD Rating, Human Body Model Operational Temperature Storage Temperature 1 Ratings 60 5 50 1 70 400 1500 8 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms kV °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 3.33 mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate (Output Open) 3 Input Control Current to Deactivate (Output Closed) Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 3 2 Conditions Symbol Min Typ Max Units IF=0mA IF=0mA, t<10ms IF=0mA, IL=400mA IF=2mA, VL=60VP IL - 1.2 - 400 1000 2 1 mArms / mADC mA 0.46 2.1 24 114 2 5 - ILPK RON ILEAK µA IF=5mA, VL=10V ton toff IF=2mA, VL=50V, f=1MHz IF=2mA, VL=1V, f=1MHz COUT - IL=120mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 0.58 0.56 1.2 - 2 1.4 10 mA mA V µA VIO=0V, f=1MHz CIO - 1 - pF ms pF Load current derates linearly from 400mA @ 25oC to 200mA @85oC. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 4mA is recommended. www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION CPC1114N PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* 25 20 15 10 5 0 1.220 1.225 1.230 LED Forward Voltage (V) 15 10 5 0.43 15 10 5 0.45 0.46 0.47 0.48 Turn-On Time (ms) 0.49 1.2 30 1.6 2.0 2.4 2.8 Turn-Off Time (ms) 3.2 3.6 Typical Blocking Voltage Distribution (N=50, IF=2mA) Device Count (N) 15 10 5 Device Count (N) 25 20 15 10 5 20 15 10 5 0 0.42 0.50 0.58 0.66 0.74 LED Current (mA) 0.82 0 1.21 0.90 Turn-Off Time (Ps) 1.5 1.4 1.3 1.2 IF=10mA IF=5mA IF=2mA 1.1 1.27 1.30 1.33 1.36 On-Resistance (:) 1.39 66 468 10 466 8 464 462 460 458 1.0 -40 -20 0 20 40 60 Temperature (ºC) 80 10 0.7 Turn-On Time (ms) 0.75 0.70 0.65 0.60 0.55 0.50 20 30 LED Current (mA) 40 0.40 0.6 0.5 IF=2mA IF=5mA IF=10mA 0.4 0.3 -20 0 20 40 60 Temperature (ºC) 80 100 2 0 10 20 30 LED Current (mA) 40 50 Typical Turn-Off Time vs. Temperature (IL=200mA) IF=2mA IF=5mA IF=10mA 8 6 4 2 0 0.1 -40 4 10 0.2 0.45 6 50 Typical Turn-On Time vs. Temperature (IL=200mA) Typical IF for Switch Operation (IL=200mA) 0.80 76 0 0 100 68 70 72 74 Blocking Voltage (VP) Typical Turn-Off Time vs. LED Forward Current Turn-On Time (ms) 1.6 IF=50mA IF=20mA 1.24 Typical Turn-On Time vs. LED Forward Current Typical LED Forward Voltage Drop vs. Temperature LED Forward Voltage (V) 0.44 Typical On-Resistance Distribution (N=50, IF=0mA, IL=400mA) 20 0 LED Current (mA) 20 0 1.235 Typical IF for Switch Operation (N=50, IL=400mA) 25 Device Count (N) 20 0 1.215 Typical Turn-Off Time (N=50, IF=5mA, IL=1000mA) 25 Device Count (N) Device Count (N) Device Count (N) 30 25 Typical Turn-On Time (N=50, IF=5mA, IL=1000mA) Turn-Off Time (ms) 35 Typical LED Forward Voltage Drop (N=50, IF=5mA) -40 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R02 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1114N PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Typical On-Resistance vs. Temperature (IF=0mA, IL=200mA) 450 1.40 Load Current (mA) 1.35 1.30 1.25 1.20 1.15 350 300 250 200 1.10 1.05 150 -40 -20 0 20 40 60 Temperature (ºC) 80 100 -40 Typical Leakage Current vs. Temperature (IF=4mA, VL=60V) 320 Blocking Voltage (VP) 280 260 240 220 200 180 -20 0 20 40 60 Temperature (ºC) 80 100 Typical Blocking Voltage vs. Temperature (IF=4mA) 80 300 Leakage (nA) 400 78 76 74 72 -20 0 20 40 60 Temperature (ºC) 80 -40 100 -0.4 -0.2 0.0 0.2 Load Voltage (V) 0.4 0.6 Output Capacitance vs. Load Voltage (IF=2mA) 200 150 100 50 0 70 -40 500 400 300 200 100 0 -100 -200 -300 -400 -500 -0.6 250 Output Capacitance (pF) On-Resistance (:) 1.45 Load Current (mA) 1.50 Typical Load Current vs. Load Voltage (IF=0mA) Maximum Load Current vs. Temperature -20 0 20 40 60 Temperature (ºC) 80 100 10s 100s 0 10 20 30 Load Voltage (V) 40 50 Energy Rating Curve 1100 Load Current (mA) 1000 900 800 700 600 500 400 300 10Ps 100Ps 1ms 10ms 100ms Time 1s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION CPC1114N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1114N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time Maximum Reflow Cycles CPC1114N 260ºC for 30 seconds 3 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. R02 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1114N Mechanical Dimensions CPC1114N 4.089 ± 0.203 (0.161 ± 0.008) Recommended PCB Land Pattern 0.200 ± 0.025 (0.008 ± 0.001) 0.60 (0.0217) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.076 (0.150 ± 0.003) 0.432 ± 0.127 (0.017 ± 0.005) 5.60 (0.2205) 1.02 ± 0.025 (0.040 ± 0.001) Pin 1 2.54 Typ (0.100 Typ) 1.30 (0.0512) 2.184 Max (0.086 Max) 2.54 (0.10) Pin to package standoff: 0.0637 ± 0.0383 (0.0025 ± 0.0015) 0.762 ± 0.102 (0.030 ± 0.004) Dimensions mm (inches) 0.381 TYP. (0.015 TYP.) CPC1114NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) P=8.00 (0.315) A0=6.50 (0.256) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1114N-R02 ©Copyright 2014, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 11/10/2014