CPC2025N

CPC2025N
400V Dual Normally-Open Single-Pole
8-Pin SOIC OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
LED Forward Current (to Activate)
Rating
400
120
30
2
Units
VP
mArms / mADC

mA
Features
•
•
•
•
•
•
•
Description
The CPC2025N is a miniature device with two
independent, normally-open (1-Form-A) solid state
relays in an 8-pin SOIC package that employs
optically coupled MOSFET technology to provide
1500Vrms of input to output isolation.
Optically coupled outputs that use the patented
OptoMOS architecture are controlled by a highly
efficient infrared LED.
1500Vrms Input/Output Isolation
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Immune to Radiated EM Fields
Wave Solderable
Tape & Reel Version Available
Small 8-Pin SOIC Package
The CPC2025N uses IXYS Integrated Circuits
Division’s state of the art, double-molded vertical
construction packaging to produce one of the world’s
smallest relays. It offers substantial board space
savings over the competitor’s larger 8-pin SOIC relay.
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Security
• Passive Infrared Detectors (PIR)
• Data Signaling
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Medical Equipment—Patient/Equipment Isolation
• Aerospace
• Industrial Controls
Approvals
• UL Recognized Component: File E76270
• CSA Approval Pending
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 13 12 82667 003
Ordering Information
Part #
CPC2025N
CPC2025NTR
Description
8-Pin SOIC (50/tube)
8-Pin SOIC (2000/reel)
Pin Configuration
1
8
+ Control
Load
7
2
– Control
Load
3
6
+ Control
Load
4
5
– Control
Load
Switching Characteristics
of Normally-Open (Form-A) Devices
Form-A
IF
90%
10%
ILOAD
ton
DS-CPC2025N-R03
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1
INTEGRATED CIRCUITS DIVISION
CPC2025N
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage (Peak)
Reverse Input Voltage
LED Forward Current
Peak (10ms)
Input Power Dissipation
Total Power Dissipation 1
Isolation Voltage, Input to Output
(60 Seconds)
ESD Rating, Human Body Model
Operational Temperature
Storage Temperature
1
Ratings
400
5
50
1
70
600
Units
VP
V
mA
A
mW
mW
1500
Vrms
8
-40 to +85
-40 to +125
kV
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Typical values are characteristic of the device at +25°C, and
are the result of engineering evaluations. They are provided for
information purposes only, and are not part of the manufacturing
testing requirements.
Derate linearly 5mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
Continuous 1
Peak
On-Resistance 2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
LED Forward Current
To Activate 3
To Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
1
2
3
2
Conditions
Symbol
Min
Typ
Max
Units
t=10ms
IL=120mA
VL=400VP
IL
ILPK
RON
ILEAK
-
20
-
120
±350
30
1
mArms / mADC
mAP

µA
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COUT
-
0.76
0.36
9
2
1
-
0.3
0.9
-
0.6
0.55
1.2
-
2
1.4
10
IF=5mA, VL=10V
IF=0mA, VL=50V, f=1MHz
IL=120mA
IF=5mA
VR=5V
IF
VF
IR
VIO=0V, f=1MHz
CIO
1
Load current derates linearly from 120mA @ 25oC to 60mA @ 85oC, and must be derated if both poles are operating simultaneously.
Measurement taken within 1 second of on-time.
For applications requiring high temperature operation (greater than 60°C) a minimum LED forward current of 4mA is recomended.
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-
ms
pF
mA
V
µA
pF
R03
INTEGRATED CIRCUITS DIVISION
CPC2025N
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
35
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
Typical Turn-On Time
(N=50, IF=5mA, IL=60mA)
20
25
20
15
10
Device Count (N)
Device Count (N)
Device Count (N)
30
25
15
10
5
5
0
0
1.21
1.22
1.23
1.24
0.60
0.65
LED Forward Voltage Drop (V)
15
0.70 0.75 0.80 0.85
Turn-On Time (ms)
Device Count (N)
Device Count (N)
Device Count (N)
20
15
10
3.5
20
10
2.0
1.5
1.0
IF=10mA
IF=5mA
IF=2mA
10
20
30
40
LED Forward Current (mA)
0.35
0.34
0.33
0.32
0
50
Typical Turn-On Time
vs. Temperature
(IL=60mA)
10
20
30
40
LED Forward Current (mA)
2.0
1.5
IF=5mA
1.0
50
Typical Turn-Off Time
vs. Temperature
(IL=60mA)
0.6
IF=2mA
0.5
0.4
IF=5mA
0.3
IF=2mA
0.2
0
0.5
-20
Typical Turn-Off Time
vs. LED Forward Current
(IL=60mA)
0.1
1.0
-40
431
0.30
0
Turn-Off Time (ms)
1.2
419
422
425
428
Blocking Voltage (VP)
0.31
0
Turn-On Time (ms)
1.3
5
0.36
2.5
1.4
10
0.37
2.5
Typical LED Forward Voltage Drop
vs. Temperature
IF=50mA
IF=20mA
15
416
0.5
1.6
20
20.5
Turn-Off Time (ms)
30
0
1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55
LED Forward Voltage (V)
LED Forward Voltage Drop (V)
18.5 19.0 19.5 20.0
On-Resistance (:)
3.0
Turn-On Time (ms)
LED Forward Current (mA)
18.0
Typical Turn-On Time
vs. LED Forward Current
(IL=60mA)
LED Forward Voltage
vs. LED Forward Current
40
0.40
0
17.5
0.9
50
0.36 0.37 0.38 0.39
Turn-Off Time (ms)
25
0
0
0.35
Typical Blocking Voltage Distribution
(N=50)
5
1.1
5
0.34
30
5
1.5
10
Typical On-Resistance Distribution
(N=50, IF=2mA, IL=120mA)
10
0.4
0.5
0.6
0.7
0.8
LED Forward Current (mA)
15
0.90
25
0.3
20
0
1.25
Typical LED Forward Current
to Activate
(N=50, IL=120mA)
Typical Turn-Off Time
(N=50, IF=5mA, IL=60mA)
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R03
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INTEGRATED CIRCUITS DIVISION
CPC2025N
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
LED Forward Current to Activate
vs. Temperature
(IL=60mA)
32
0.80
0.70
0.65
0.60
0.55
0.50
28
26
24
22
18
-20
0
20
40
60
Temperature (ºC)
80
Maximum Load Current
vs. Temperature
(IF=4mA)
140
-20
Blocking Voltage (VP)
100
80
60
40
20
0
0
20
40
60
Temperature (ºC)
80
-20
0
20
40
60
Temperature (ºC)
100
430
420
410
-1
0
1
2
3
Typical Leakage vs. Temperature
Measured Across Pins 5&6, 7&8
(VL=400V)
0.020
0.015
0.010
0.005
400
0
-40
-20
0
20
40
60
Temperature (ºC)
Load Current (A)
20
10
0
10
100
Load Voltage (V)
80
-40
100
-20
0
20
40
60
Temperature (ºC)
80
100
Energy Rating Curve
30
1
-2
0.025
440
40
0.1
-3
0.030
450
Output Capacitance
vs. Load Voltage
(IF=0mA, f=1MHz)
50
Output Capacitance (pF)
80
-50
Load Voltage (V)
390
-40
0
100
Typical Blocking Voltage
vs. Temperature
(IF=0mA)
460
120
50
-150
-40
100
Leakage (PA)
-40
100
-100
20
0.45
0.40
Load Current (mA)
Load Current (mA)
0.75
Typical Load Current
vs. Load Voltage
(IF=2mA)
150
30
On-Resistance (:)
LED Forward Current (mA)
0.85
Typical On-Resistance
vs. Temperature
(IF=20mA, IL=60mA)
1000
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10μs 100μs 1ms 10ms 100ms
1s
10s 100s
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R03
INTEGRATED CIRCUITS DIVISION
CPC2025N
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC2025N
MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
Maximum Reflow Cycles
CPC2025N
260ºC for 30 seconds
3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after soldering processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
R03
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INTEGRATED CIRCUITS DIVISION
CPC2025N
MECHANICAL DIMENSIONS
CPC2025N
1.016 ± 0.025
(0.040 ± 0.001)
9.347 ± 0.203
(0.368 ± 0.008)
Pin 1
2.184 MAX
(0.086 MAX)
PCB Land Pattern
5.60
(0.22)
1.30
(0.051)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.051
(0.150 ± 0.002)
2.540 TYP
(0.100 TYP)
0.203 ± 0.025
(0.008 ± 0.001)
0.432 ± 0.127
(0.017 ± 0.005)
2.54
(0.100)
0.55
(0.022)
Pin to Package Standoff
MIN 0.0254 (0.001)
(MAX 0.102 (0.004)
0.838 ± 0.102
(0.033 ± 0.004)
Dimensions
mm
(inches)
0.381 ± 0.051
(0.015 ± 0.002)
CPC2025NTR Tape & Reel
1.75 ± 0.10
330.2 DIA.
(13.00 DIA.)
4.00 ± 0.10
8.00 ± 0.10
2.00 ± 0.10
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
1.20
7.50 ± 0.10
Ø1.50
+0.1, -0
6.50 9.65 ± 0.10
16.00 ± 0.30
Embossed Carrier
3.50
6.55 ± 0.10
Ø1.50 MIN
Embossment
2.35 ± 0.10
NOTES:
1. All dimensions in millimeters
2. 10 sprocket hole pitch cumulative tolerance ± 0.20.
3. Carrier camber is within 1mm in 250mm.
2.85 ± 0.10
4. Tape material : Black Conductive Polystyrene Alloy.
5. All dimensions meet EIA-481-C requirements.
6. Thickness : 0.30 ± 0.05mm.
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
6
Specification: DS-CPC2025N-R03
©Copyright 2014, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
11/19/2014