CPC3909

CPC3909
INTEGRATED CIRCUITS DIVISION
Parameter
Drain-to-Source Voltage - V(BR)DSX
Rating
400
Max On-Resistance - RDS(on)
6
PRELIMINARY
Units
V

Max Power
SOT-89 Package
1.1
SOT-223 Package
2.5
Features
• 400V Drain-to-Source Voltage
• Depletion Mode Device Offers Low RDS(on)
at Cold Temperatures
• Low On-Resistance: 4.5 (Typical) @ 25°C
• Low VGS(off) Voltage
• High Input Impedance
• Low Input and Output Leakage
• Small Package Size SOT-89 and SOT-223
• PC Card (PCMCIA) Compatible
• PCB Space and Cost Savings
•
•
•
•
•
•
•
•
W
Description
The CPC3909 is an N-channel, depletion mode Field
Effect Transistor (FET) that is available in an
SOT-223 package (CPC3909Z) and an SOT-89
package (CPC3909C). Both utilize IXYS Integrated
Circuits Division’s proprietary vertical DMOS process
that realizes world class, high voltage MOSFET
performance in an economical silicon gate process.
The vertical DMOS process yields a highly reliable
device, particularly for use in difficult application
environments such as telecommunications, security,
and power supplies.
CPC3909Z and the CPC3909C have a typical
on-resistance of 4.5 and a drain-to-source voltage
of 400V. As with all MOS devices, the FET structure
prevents thermal runaway and thermally induced
secondary breakdown.
Ordering Information
Part Number
CPC3909CTR
CPC3909ZTR
Applications
LED Drive Circuits
Telecommunications
Normally On Switches
Ignition Modules
Converters
Security
Power Supplies
Regulators
Circuit Symbol
400V N-Channel
Depletion-Mode FET
Description
SOT-89: Tape and Reel (1000/Reel)
SOT-223: Tape and Reel (1000/Reel)
Package Pinout:
D
D
G
1
4
2
3
G
D
S
S
Pin Number
Name
1
GATE
2
DRAIN
3
SOURCE
4
DRAIN
DS-CPC3909-R00D
PRELIMINARY
1
INTEGRATED CIRCUITS DIVISION
CPC3909
PRELIMINARY
Absolute Maximum Ratings @ 25ºC
Parameter
Ratings
Units
Drain-to-Source Voltage (V(BR)DSX)
400
V
Gate-to-Source Voltage (VGS)
15
V
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Total Package Dissipation 1
SOT-89
1.1
SOT-223
2.5
W
Operational Temperature
-40 to +110
oC
Storage Temperature
-40 to +125
oC
1
Typical values are characteristic of the device at +25°C, and
are the result of engineering evaluations. They are provided for
information purposes only, and are not part of the manufacturing
testing requirements.
Mounted on 1"x1" FR4 board.
Electrical Characteristics @25oC (Unless Otherwise Specified)
Parameter
Gate-to-Source Off Voltage
Symbol
VGS(off)
Drain-to-Source Leakage Current
IDS(off)
Conditions
ID=1A, VDS=5V
Min
-1.4
Typ
-
Max
-3.1
Units
V
VGS= -5.5V, VDS=240V
-
-
20
nA
VGS= -5.5V, VDS=400V
-
-
1
A
Drain Current
ID
VGS= 0V, VDS=5V
300
-
-
mA
On-Resistance
RDS(on)
VGS= 0V, IDS=300mA
-
4.5
6

Gate Leakage Current
IGSS
VGS=15V
-
-
100
nA
Gate Capacitance
CISS
VDS= VGS=0V
-
-
275
pF
Thermal Resistance
Device
SOT-89 (CPC3909C)
Parameter
Junction to Case
RJC
Junction to Ambient
RJA
SOT-223 (CPC3909Z) Junction to Case
Junction to Ambient
2
Symbol
RJC
RJA
Conditions
Min
Typ
-
-
-
-
PRELIMINARY
-
-
Max
Units
50
90
14
ºC/W
55
R00D
INTEGRATED CIRCUITS DIVISION
CPC3909
PRELIMINARY
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)*
0.0
Threshold Voltage (V)
-40ºC
ID (A)
0.8
25ºC
0.6
125ºC
0.4
0.2
0.0
-2.5
-2.0
-1.5
-1.0
VGS (V)
-0.5
Threshold Voltage
(IDS=2PA)
Transconductance vs. Drain Current
(VGS=10V)
-40ºC
1.25
-1.0
-1.5
-2.0
25ºC
1.00
0.75
125ºC
0.50
-2.5
0.25
-3.0
-3.5
-50
0.0
1.50
-0.5
Gm (mS)
1.0
Instantaneous Transfer Characteristics
(VDS=10V)
-25
0
25
50
75 100
Temperature (ºC)
125
150
0.00
0.0
Forward Safe Operating Bias
SOT-223 Package
Forward Safe Operating Bias
SOT-89 Package
1
1
0.1
0.1
0.1
0.2
0.3
0.4
ID (mA)
0.5
0.6
0.7
Output Characteristics
1.0
VGS=0V
0.01
ID (A)
Current (A)
Current (A)
0.8
VGS=-0.5V
0.6
0.4
0.01
VGS=-1V
0.2
VGS=-1.5V
VGS=-2V
0.001
0.1
1
10
Voltage (V)
100
1000
0.0
0.001
0.1
1
10
Voltage (V)
100
1
2
3
4
5
VDS (V)
Power Dissipation
vs. Ambient Temperature
SOT-89 Package
Power Dissipation
vs. Ambient Temperature
SOT-223 Package
1.2
2.0
Power Dissipation (W)
Power Dissipation (W)
1000
0
1.0
0.8
0.6
0.4
0.2
0.0
1.5
1.0
0.5
0.0
0
20
40
60
80
100
Temperature (ºC)
120
140
0
20
40
60
80
100
Temperature (ºC)
120
140
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R00D
PRELIMINARY
3
INTEGRATED CIRCUITS DIVISION
CPC3909
PRELIMINARY
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)*
On-Resistance vs. Drain Current
(VGS=0V)
10
On-Resistance vs. Temperature
(IL=300mA, VGS=0V)
8
6
25ºC
4
-40ºC
2
Blocking Voltage (VP)
9
On-Resistance (:)
On Resistance (:)
520
10
125ºC
8
7
6
5
4
3
0
0.0
0.2
0.4
0.6
ID (mA)
1.0
-25
0
25
50
75 100
Temperature (ºC)
Leakage Current vs. Temperature
(VGS=5V, VDS=400V)
1.2
300
1.0
125
150
510
500
490
480
470
460
-50
-25
0
25
50
75 100
Temperature (ºC)
125
150
Capacitance vs. Drain-Source Voltage
(VGS=-3.5V)
250
Capacitance (pF)
Leakage current (PA)
0.8
2
-50
Blocking Voltage vs. Temperature
(IL=5PA)
0.8
0.6
0.4
0.2
200
CISS
150
100
COSS
CRSS
50
0
0
-50
-25
0
25
50
75 100
Temperature (ºC)
125
150
0
5
10
15
20
VDS (V)
25
30
35
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
PRELIMINARY
R00D
INTEGRATED CIRCUITS DIVISION
CPC3909
PRELIMINARY
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC3909C / CPC3909Z
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
Maximum Reflow Cycles
CPC3909C / CPC3909Z
260ºC for 30 seconds
3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or
Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be
used.
R00D
PRELIMINARY
5
INTEGRATED CIRCUITS DIVISION
CPC3909
PRELIMINARY
MECHANICAL DIMENSIONS
CPC3909Z
2.90 / 3.10
(0.114 / 0.122)
PCB Land Pattern
0.229 / 0.330
(0.009 / 0.013)
1.90
(0.075)
6.705 / 7.290
(0.264 / 0.287)
3.30 / 3.71
(0.130 / 0.146)
1.499 / 1.981
(0.059 / 0.078)
3.20
(0.126)
6.10
(0.24)
Pin 1
0.610 / 0.787
(0.024 / 0.031)
1.90
(0.075)
0.914 MIN
(0.036 MIN)
2.286
(0.090)
6.30 / 6.71
(0.248 / 0.264)
0.020 / 0.102
(0.0008 / 0.004)
0.90
(0.035)
1.549 / 1.803
(0.061 / 0.071)
2.286
(0.090)
0.864 / 1.067
(0.034 / 0.042)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
4.597
(0.181)
CPC3909C
1.626 / 1.829
(0.064 / 0.072)
1.397 / 1.600
(0.055 / 0.063)
R 0.254
(R 0.010)
PCB Land Pattern
1.90
(0.075)
3.937 / 4.242
(0.155 / 0.167)
2.45
(0.096)
1.40
(0.055)
Pin 1
0.889 / 1.194
(0.035 / 0.047)
0.356 / 0.483
(0.014 / 0.019)
0.432 / 0.559
(0.017 / 0.022)
0.356 / 0.432
(0.014 / 0.017)
0.864 / 1.016
(0.034 / 0.040)
4.394 / 4.597
(0.173 / 0.181)
1.118 / 1.270
(0.044 / 0.050)
50º
0.432 / 0.508
(0.017 / 0.020)
5.00
(0.197)
50º
1.90
(0.074)
0.60
(0.024)
TYP 3
2.845 / 2.997
(0.112 / 0.118)
1.422 / 1.575
(0.056 / 0.062)
2.921 / 3.073
(0.115 / 0.121)
6
45º
2.286 / 2.591
(0.090 / 0.102)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
PRELIMINARY
R00D
INTEGRATED CIRCUITS DIVISION
CPC3909
PRELIMINARY
MECHANICAL DIMENSIONS
CPC3909ZTR Tape & Reel
177.8 Dia
(7.00 Dia)
5.50 ± 0.05
(0.217 ± 0.002)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 ± 0.1
(0.157 ± 0.004)
1.75 ± 0.1
(0.069 ± 0.004)
W=12.08 ± 0.2
(0.476 ± 0.008)
B0=7.42 ± 0.1
(0.292 ± 0.004)
K0=1.88 ± 0.1
(0.074 ± 0.004)
Embossed
Carrier
A0=6.83 ± 0.1
(0.269 ± 0.004)
P=8.03 ± 0.1
(0.316 ± 0.004)
Dimensions
mm
(inches)
Embossment
CPC3909CTR Tape & Reel
177.8 Dia
(7.00 Dia)
5.50 ± 0.05
(0.217 ± 0.002)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
1.75 ± 0.1
(0.069 ± 0.004)
W=12.00 ± 0.3
(0.472 ± 0.012)
B0=4.60 ± 0.1
(0.181 ± 0.004)
K0=1.80 ± 0.1
(0.071 ± 0.004)
Embossed
Carrier
2.00 ± 0.05
(0.079 ± 0.002)
4.00 ± 0.1
(0.157 ± 0.004)
A0=4.80 ± 0.1
(0.189 ± 0.004)
P=8.00 ± 0.1
(0.315 ± 0.004)
Embossment
Dimensions
mm
(inches)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
7
Specification: DS-CPC3909-R00D
©Copyright 2015, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
4/10/2015