PAA140

PAA140
Dual Single-Pole, Normally Open
OptoMOS® Relays
INTEGRATED CIRCUITS DIVISION
Parameter
Load Voltage
Load Current
On-Resistance (max)
Rating
400
250
8
Units
V
mArms / mADC

Description
The PAA140 is a 400V, 250mA, 8, dual normally
open (1-Form-A) relay. This high performance
leader provides a high peak load voltage handling
capability combined with a very low on-resistance for
specialized applications.
Features
Approvals
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Small 8-Pin Package
• Machine Insertable, Wave Solderable
• Tape & Reel Versions Available
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Ordering Information
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Part #
PAA140
PAA140P
PAA140PTR
PAA140S
PAA140STR
Description
8-Lead DIP (50/tube)
8-Lead Flatpack (50/tube)
8-PLead Flatpack (1000/Reel)
8-Lead Surface Mount (50/tube)
8-Lead Surface Mount (1000/Reel)
Pin Configuration
+ Control - Switch #1
– Control - Switch #1
+ Control - Switch #2
– Control - Switch #2
1
8
2
7
3
6
4
5
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
Switching Characteristics
of Normally Open Devices
Form-A
IF
90%
10%
ILOAD
ton
Pb
DS-PAA140-R09
toff
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1
INTEGRATED CIRCUITS DIVISION
PAA140
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate linearly 6.67 mW / ºC
Ratings
400
5
50
1
150
800
3750
-40 to +85
-40 to +125
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Units
VP
V
mA
A
mW
mW
Vrms
°C
°C
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
Continuous *
Peak
On-Resistance
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance Input to Output
Conditions
Symbol
Min
Typ
Max
Units
t=10ms
IL=250mA
VL=400VP
IL
ILPK
RON
ILEAK
-
6
-
250
±500
8
1
mArms / mADC
mAP

µA
IF=5mA, VL=10V
ton
toff
-
-
3
1
ms
IL=250mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.4
0.9
-
0.7
1.2
-
5
1.4
10
mA
mA
V
µA
-
CI/O
-
3
-
pF
*NOTE: If both poles operate simultaneously, then load current must be derated so that the package power dissipation value is not exceeded.
2
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R09
INTEGRATED CIRCUITS DIVISION
PAA140
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
25
20
15
10
5
0
25
1.19
1.21
1.23
15
10
5
20
15
10
5
0
1.25
0.39
0.65
0.91
1.17
1.43
1.69
0.018 0.030 0.042 0.054 0.066 0.078 0.090
1.95
LED Forward Voltage Drop (V)
Turn-On Time (ms)
Turn-Off Time (ms)
Typical IF for Switch Operation
(N=50, IL=250mADC)
Typical IF for Switch Dropout
(N=50, IL=250mADC)
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=250mADC)
25
20
Device Count (N)
Device Count (N)
20
0
1.17
Typical Turn-Off Time
(N=50, IF=5mA, IL=250mADC)
25
Device Count (N)
Device Count (N)
Device Count (N)
30
25
Typical Turn-On Time
(N=50, IF=5mA, IL=250mADC)
15
10
5
0
35
30
20
Device Count (N)
35
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
15
10
5
2.1
2.7
3.3
3.9
4.5
20
15
10
5
0
1.5
25
0
5.1
0.9
1.5
LED Current (mA)
2.1
2.7
3.3
3.9
4.5
5.03
5.38
LED Current (mA)
5.73
6.08
6.43
6.78
7.13
On-Resistance (:)
Typical Blocking Voltage Distribution
(N=50)
35
Device Count (N)
30
25
20
15
10
5
0
430
442
454
466
478
490
502
Blocking Voltage (VP)
Typical Turn-On Time
vs. LED Forward Current
(IL=250mADC)
1.6
1.4
IF=50mA
IF=30mA
IF=20mA
IF=10mA
IF=5mA
1.2
1.0
0.8
-40
-20
0
20
40
60
Temperature (ºC)
80
100
120
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
Turn-Off Time (ms)
1.8
Turn-On Time (ms)
LED Forward Voltage Drop (V)
Typical LED Forward Voltage Drop
vs. Temperature
0
5
10
15
20
25
30
35
40
LED Forward Current (mA)
45
50
Typical Turn-Off Time
vs. LED Forward Current
(IL=250mADC)
0.050
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R09
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3
INTEGRATED CIRCUITS DIVISION
PAA140
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical Turn-On Time
vs. Temperature
(IL=250mADC)
0.07
I F = 5mA
I F = 10mA
I F = 20mA
1.5
1.0
0.5
0.05
0.04
0.03
0.02
5.0
-20
0
20
40
60
80
100
-40
6
0
20
40
60
80
-40
100
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Typical IF for Switch Operation
vs. Temperature
(IL=250mADC)
Typical IF for Switch Dropout
vs. Temperature
(IL=250mADC)
Typical Load Current vs. Load Voltage
(IF=5mA)
5.0
4.0
3.5
3.0
2.5
2.0
Load Current (mA)
LED Current (mA)
4.0
3.5
3.0
2.5
2.0
1.5
1.5
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
-1.0 -0.5
0
0.5
1.0
1.5
2.0
Temperature (ºC)
Load Voltage (V)
Maximum Load Current
vs. Temperature
Typical Blocking Voltage
vs. Temperature
Typical Leakage vs. Temperature
Measured Across Pins 5&6 or 7&8
350
300
250
I F = 20mA
I F = 10mA
I F = 5mA
200
150
Blocking Voltage (VP)
485
0.12
480
0.10
475
470
465
460
0
20
40
60
80
100
0.06
0.04
0.02
445
120
0.08
455
450
100
-20
250
200
150
100
50
0
-50
-100
-150
-200
-250
-2.0 -1.5
Temperature (ºC)
Leakage (PA)
LED Current (mA)
-20
4.5
-40
7
Temperature (ºC)
4.5
-40
8
4
0
-40
9
5
0.01
0
Load Current (mA)
On-Resistance (:)
2.0
Typical On-Resistance
vs. Temperature
(IF=5mA, IL=250mADC)
10
0.06
Turn-Off Time (ms)
Turn-On Time (ms)
2.5
Typical Turn-Off Time
vs. Temperature
(IF=5mA, IL=250mADC)
0
-40
Temperature (ºC)
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Energy Rating Curve
1.2
Load Current (A)
1.0
0.8
0.6
0.4
0.2
0
10Ps 100Ps 1ms 10ms 100ms
1s
10s
100s
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R09
INTEGRATED CIRCUITS DIVISION
PAA140
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
PAA140 / PAA140S / PAA140P
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
PAA140 / PAA140S
250ºC for 30 seconds
PAA140P
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
R09
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5
INTEGRATED CIRCUITS DIVISION
PAA140
Mechanical Dimensions
PAA140
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
PCB Hole Pattern
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
0.457 ± 0.076
(0.018 ± 0.003)
7.620 ± 0.127
(0.300 ± 0.005)
7.239 TYP.
(0.285)
4.064 TYP
(0.160)
7.620 ± 0.127
(0.300 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
PAA140S
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
PCB Land Pattern
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
0.65
(0.0255)
4.445 ± 0.127
(0.175 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
PAA140P
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
9.398 ± 0.127
(0.370 ± 0.005)
Pin 1
9.652 ± 0.381
(0.380 ± 0.015)
7.620 ± 0.254
(0.300 ± 0.010)
2.286 MAX.
(0.090 MAX.)
2.54
(0.10)
0.635 ± 0.127
(0.025 ± 0.005)
0.203 ± 0.013
(0.008 ± 0.0005)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
2.159 ± 0.025
(0.085 ± 0.001)
0.457 ± 0.076
(0.018 ± 0.003)
0.864 ± 0.120
(0.034 ± 0.004)
6
PCB Land Pattern
Dimensions
mm
(inches)
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R09
INTEGRATED CIRCUITS DIVISION
PAA140
PAA140STR Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
W=16.00
(0.63)
Bo=10.30
(0.406)
K0 =4.90
(0.193)
Ao=10.30
(0.406)
K1 =4.20
(0.165)
Embossed Carrier
Embossment
P=12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
PAA140PTR Tape & Reel
2.00
(0.079)
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Embossment
W = 16.00
(0.63)
7.50
(0.295)
Bo = 10.30
(0.406)
K0 = 2.70
(0.106)
K1 = 2.00
(0.079)
Embossed Carrier
4.00
(0.157)
Ao = 10.30
(0.406)
P = 12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
7
Specification: DS-PAA140-R09
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012