CPC1117N

CPC1117N
60V Normally-Closed Single-Pole
4-Pin SOP OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
LED Current to Operate
Rating
60
150
16
1
Units
VP
mArms / mADC

mA
Features
• Designed for use in security systems complying
with EN50130-4
• Only 1mA of LED current required to operate
• 1500Vrms Input/Output Isolation
• Small 4-Pin SOP Package
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Immune to radiated EM fields
• Wave Solderable
• Tape & Reel Version Available
Applications
• Security
• Passive Infrared Detectors (PIR)
• Data Signalling
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Aerospace
• Industrial Controls
Description
The CPC1117N is a miniature normally-closed
single-pole (1-Form-B) solid state relay in a 4-pin
SOP package that employs optically coupled
MOSFET technology to provide 1500Vrms of input/
output isolation. The efficient MOSFET switches
and photovoltaic die use IXYS Integrated Circuits
Division’s patented OptoMOS architecture. The
optically coupled output is controlled by the input's
highly efficient infrared LED.
IXYS Integrated Circuits Division’s state of the art
double-molded vertical construction packaging makes
the CPC1117N one of the world’s smallest relays. It
offers board space savings of at least 20% over the
competitor’s larger 4-pin SOP relay.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN/IEC 60950-1 Certified Component:
Certificate B 13 12 82667 003
Ordering Information
Part #
CPC1117N
CPC1117NTR
Description
4-Pin SOP (100/tube)
4-Pin SOP (2000/reel)
Pin Configuration
+ Control
– Control
1
4
2
3
Load
Load
Switching Characteristics
of Normally-Closed Devices
Form-B
IF
ILOAD
90%
10%
toff
DS-CPC1117N-R09
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ton
1
INTEGRATED CIRCUITS DIVISION
CPC1117N
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Disipation
Total Power Dissipation 1
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Ratings
60
5
50
1
70
400
1500
-40 to +85
-40 to +125
Units
VP
V
mA
A
mW
mW
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Typical values are characteristic of the device at +25°C, and
are the result of engineering evaluations. They are provided for
information purposes only, and are not part of the manufacturing
testing requirements.
Derate linearly 3.33 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
Continuous 1
Peak
On-Resistance 2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate (Output Open) 3
Input Control Current to Deactivate (Output Closed)
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
1
2
3
2
Conditions
Symbol
Min
Typ
Max
Units
IF=0mA
t=10ms
IF=0mA, IL=120mA
IF=1mA, VL=60VP
IL
ILPK
RON
ILEAK
-
5
-
150
±350
16
1
mArms / mADC
mAP

IF=0.5mA, VL=50V, f=1MHz
ton
toff
COUT
-
0.316
1.55
10
10
10
-
IL=120mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.1
0.9
-
0.16
0.14
1.2
-
1
1.4
10
mA
mA
V
µA
VIO=0V, f=1MHz
CIO
-
1
-
pF
IF=2mA, VL=10V
µA
ms
pF
Load current derates linearly from 150mA @ 25oC to 100mA @85oC.
Measurement taken within 1 second of on-time.
For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 3mA is recommended.
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INTEGRATED CIRCUITS DIVISION
CPC1117N
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)*
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
35
25
20
15
10
Device Count (N)
25
15
10
5
5
0
15
10
5
0
0
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
0.28
1.15
0.38
Device Count (N)
15
10
5
35
35
30
30
25
20
15
10
15
10
5
0.15 0.17 0.19
LED Current (mA)
0.21
0
5.0
0.23
1.4
1.3
1.2
IF=5mA
IF=2mA
IF=1mA
1.0
-40
0
20
40
60
Temperature (ºC)
80
5.4
5.5
85
5.6
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
0.35
0.34
0.33
0.32
0.31
0.30
0.29
0.28
0.27
0.26
0.25
Turn-On Time (ms)
0.20
0.15
0.10
0
20
40
60
Temperature (ºC)
80
100
115
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
3.0
20
30
LED Current (mA)
40
2.5
2.0
1.5
1.0
0
50
Typical Turn-On Time
vs. Temperature
(IL=100mA)
0.40
IF=10mA
IF=5mA
IF=2mA
IF=1mA
0.35
0.30
10
0.25
20
30
LED Current (mA)
40
50
Typical Turn-Off Time
vs. Temperature
(IL=100mA)
5
IF=1mA
IF=2mA
IF=5mA
IF=10mA
4
3
2
1
0
0.20
-20
95
100 105 110
Blocking Voltage (VP)
0.0
10
0.45
0.25
-40
90
0.5
0
100
Typical IF for Switch Operation
vs. Temperature
(IL=100mA)
0.30
LED Current (mA)
-20
5.3
Turn-Off Time (ms)
IF=50mA
IF=20mA
IF=10mA
Turn-On Time (ms)
LED Forward Voltage (V)
1.6
1.1
5.2
On-Resistance (:)
Typical LED Forward Voltage Drop
vs. Temperature
1.5
5.1
Turn-Off Time (ms)
0.13
2.05
20
0
0.11
1.45 1.60 1.75 1.90
Turn-Off Time (ms)
25
5
0
1.30
Typical Blocking Voltage Distribution
(N=50, IF=1mA)
Typical On-Resistance Distribution
(N=50, IL=150mA)
Typical IF for Switch Operation
(N=50, IL=150mA)
20
0.30
0.32
0.34
0.36
Turn-On Time (ms)
Device Count (N)
1.17
Typical Turn-Off Time
(N=50, IF=2mA, IL=100mA)
20
20
Device Count (N)
Device Count (N)
30
Device Count (N)
Typical Turn-On Time
(N=50, IF=2mA, IL=100mA)
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R09
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INTEGRATED CIRCUITS DIVISION
CPC1117N
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)*
Load Current (mA)
On-Resistance (:)
7
6
5
4
3
225
200
100
50
0
-50
-100
2
-40
-20
0
20
40
60
80
100
-0.33
0.33
0.66
1.00
110
105
100
75
50
-20
40
0.25
0.20
0.15
0.10
0.05
90
0
80
20
40
60
80
100
120
Output Capacitance vs. Load Voltage
(IF=0.5mA)
35
30
25
20
15
10
5
-40
100
0
Temperature (ºC)
0.30
95
20
40
60
Temperature (ºC)
100
-40
Output Capacitance (pF)
115
Leakage (µA)
Blocking Voltage (VP)
0
0.35
0
125
0
-0.66
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(IF=2mA, VL=60V)
0.40
120
-20
150
Load Voltage (V)
Typical Blocking Voltage
vs. Temperature
(IF=2mA)
-40
175
25
-150
-1.00
Temperature (ºC)
125
Maximum Load Current
vs. Temperature
(IF=0mA)
Typical Load Current vs. Load Voltage
150
Load Current (mA)
8
Typical On-Resistance vs. Temperature
(IF=0mA, IL=150mA)
-20
0
20
40
60
80
100
Temperature (ºC)
0
10
20
30
40
Load Voltage (V)
50
60
Load Current (A)
Energy Rating Curve
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10μs 100μs 1ms 10ms 100ms
1s
10s 100s
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R09
INTEGRATED CIRCUITS DIVISION
CPC1117N
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1117N
MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
Maximum Reflow Cycles
CPC1117N
260ºC for 30 seconds
3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
R09
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INTEGRATED CIRCUITS DIVISION
CPC1117N
Mechanical Dimensions
CPC1117N
4.089 ± 0.203
(0.161 ± 0.008)
Recommended PCB Land Pattern
0.200 ± 0.025
(0.008 ± 0.001)
0.60
(0.0217)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.076
(0.150 ± 0.003)
0.432 ± 0.127
(0.017 ± 0.005)
5.60
(0.2205)
1.02 ± 0.025
(0.040 ± 0.001)
Pin 1
2.54 Typ
(0.100 Typ)
1.30
(0.0512)
2.184 Max
(0.086 Max)
2.54
(0.10)
Pin to package standoff:
0.0637 ± 0.0383
(0.0025 ± 0.0015)
0.762 ± 0.102
(0.030 ± 0.004)
Dimensions
mm
(inches)
0.381 TYP.
(0.015 TYP.)
CPC1117NTR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=12.00
(0.472)
B0=4.70
(0.185)
K0=2.70
(0.106)
K1=2.30
(0.091)
P=8.00
(0.315)
A0=6.50
(0.256)
User Direction of Feed
Dimensions
mm
(inches)
Embossed
Carrier
Embossment
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
6
Specification: DS-CPC1117N-R09
©Copyright 2014, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
11/10/2014