PCI9052 G Material Analysis Data

Package Material Composition and Mass Calculation
Customer:
Package:
Device Type:
Pad/Cavity Size:
Die Size:
PLX
QFP 160L (28 X 28)
PCI9052 G
354 SQ MILS
188 X 175 MILS
name
Date:
composition
%
mg.(ave)
density
Mold Compound Sumitomo G600C
4447.8
Silica Fused
Epoxy Resin
Cresol Novolac
Phenol Resin
Carbon Black
Leadframe
75~95
2-8
1-3
2-8
0.1-0.5
3.32
Composition
Silicon
Die Attach
Ablebond 8361J
Cu
Ni
Si
Mg
96.20
3.00
0.65
0.15
gamma-Butyrolactone
Silver
Epoxy Resin
Diglycidylether
of bisphenol-F
2.4
External Plating
Total
Sn
607,066
216,809
14,743
21,681
6,938
11.86
118,627
11.41
0.36
0.08
0.02
114,119
3,559
771
178
19.4
0.38
3,783
2.8
0.05
546
608.4
0.17
2.10
0.17
0.00
0.04
0.00
33
409
33
5~15
0.36
0.01
71
0.173533
1,735
0.173516
1.73533E-05
1,735
0.174
41.40
0.8072
0.8072
8,072
8,072
5128.7
100.00
1,000,000
19.3
Solder Plate
60.71
21.68
1.47
2.17
0.69
1~10
70~80
1~10
Wire
Au
Ion Impurities
PPM
867,237
585.28
18.25
3.95
0.91
Silicon
%
86.72
3113.46
1111.95
75.613
111.195
35.5824
C7025
Die
mg.
14/09/2004
99.99
0.01
8.8991
0.0009
100
41.4
7.9
8.9