Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 Package: Total Device Weight Die % of Total Pkg. Wt. 1.59% Mold 35.40% January, 2005 D/A Epoxy 0.22% Weight (g) 516 fpBGA (w/heatsink) 4.97 Grams % of Total Pkg. Wt. Weight (g) 0.079 with SnPb Solder Balls Substance CAS # Notes / Assumptions: Silicon 7440-21-3 Die size: 9.63 x 11.36 mm 60676-86-0 129915-35-1 1309-64-4 1333-86-4 1.760 30.34% 3.54% 0.53% 0.89% 0.11% 1.508 0.176 0.026 0.044 0.005 Silica Epoxy/Phenol resin Metal Hydroxide Antimony Trioxide Carbon black 0.18% 0.04% 0.009 0.002 Silver (Ag) Organic esters and resins 0.011 Wire 0.30% 0.015 Solder Balls 10.33% 0.514 5.41% 4.93% Substrate 16.16% 0.803 Foil 35.98% 1.788 0.269 0.245 7440-57-5 Tin (Sn) Lead (Pb) 7440-31-5 Solder ball composition Sn63/Pb37 7439-92-1 129915-35-1 BT Resin Copper (Cu) The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. www.latticesemi.com 1.00 mil diameter; 1 wire per solder ball Gold (Au) Notes: The information provided above is representative of the package as of the date listed, and is subject to change at any time. Mold Compound composition: 75 to 95% Silica Fused or Amorphous (LSC uses 85.7% in our calculation) 4 to 20% Epoxy/Phenol resin (LSC uses 10% in our calculation) 0 to 2.5% Metal Hydroxide (LSC uses 1.5% in our calculation) 0 to 5% Antimony Trioxide (LSC uses 2.5% in our calculation) 0 to 0.5% Carbon black (LSC uses 0.3% in our calculation) Mold Compound Density between 1.8 and 2.1 grams/cc Die attach epoxy Density: 4 grams/cc 7440-22-4 60 to 100% Silver (LSC uses 80% in our calculation) 0 to 30% Organic Esters and Resins (LSC uses 20% in our calculation) - 7440-50-8