TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP0544T Series SP0544T Series 0.5pF 12KV Diode Array RoHS Pb GREEN Description The SP0544T integrates 4 channels of ultra low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). This robust device can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (±8kV contact discharge) without performance degradation. The extremely low loading capacitance also makes it ideal for protecting high speed signal pins such as V-By-One, HDMI, USB3.0, USB2.0, and IEEE 1394. Pinout Features 1 8 2 GND 7 3 6 4 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. Revision: 03/17/16 • Low capacitance of 0.5pF (TYP) per I/O • EFT, IEC61000-4-4, 40A (tP=5/50ns) • Low leakage current of 1.5μA (MAX) at 5V • Lightning, IEC610004-5 2nd edition, 4A (tP=8/20μs) • Halogen free, Lead free and RoHS compliant 5 Functional Block Diagram ©2016 Littelfuse, Inc. Specifications are subject to change without notice. • ESD, IEC61000-4-2, ±12kV contact, ±25kV air Applications • V-By-One • Flat Panel Displays • Embedded DisplayPort • LCD/LED TVs • USB 2.0/3.0 Ports • Smartphones • HDMI • Mobile Computing TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP0544T Series Absolute Maximum Ratings Symbol Parameter IPP Peak Current (tp=8/20μs) TOP TSTOR Value Units 4.0 A Operating Temperature -40 to 150 °C Storage Temperature -55 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Symbol Test Conditions Reverse Standoff Voltage Parameter VRWM IR ≤ 1µA 5.0 V Reverse Leakage Current ILEAK VR=5V, Any I/O to GND 1.5 µA Clamp Voltage1 VC Dynamic Resistance RDYN 2 ESD Withstand Voltage1 Min Typ Units IPP=1A, tp=8/20µs, Fwd 6.6 V IPP=2A, tp=8/20µs, Fwd 7.0 V TLP, tP=100ns, I/O to GND VESD Max 0.3 IEC61000-4-2 (Contact) ±12 IEC61000-4-2 (Air) ±25 Ω kV kV Diode Capacitance1 CI/O-GND Reverse Bias=0V, f=1 MHz 0.5 pF Diode Capacitance1 CI/O-/O Reverse Bias=0V, f=1 MHz 0.3 pF Note: 1 Parameter is guaranteed by design and/or device characterization. 2 Transmission Line Pulse (TLP) with 100ns width and 2ns rise time. 8/20μS Pulse Waveform Capacitance vs. Reverse Bias 110% 1 100% 0.9 90% Capacitance (pF) Percent of IPP 80% 70% 60% 50% 40% 30% 20% 0.8 0.7 0.6 0.5 0.4 0.3 0.2 10% 0.1 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) Clamping Voltage vs IPP 0 8.0 1.5 2 2.5 3 3.5 Bias Voltage (V) 4 15 TLP Current (A) Clamp Voltage (VC) 1 20 6.0 4.0 2.0 10 5 1.0 2.0 3.0 Peak Pulse Current-IPP (A) ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 03/17/16 0.5 Transmission Line Pulsing(TLP) Plot 10.0 0.0 0 4.0 0 0 3 6 9 TLP Voltage (V) 12 15 4.5 5 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP0544T Series Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C tL Ramp-do Ramp-down Preheat TS(min) tS time to peak temperature Time Product Characteristics Part Numbering System SP 0544T U T G TVS Diode Arrays (SPA® Diodes) G= Green T= Tape & Reel Series Critical Zone TL to TP Ramp-up TL TS(max) 25 Peak Temperature (TP) tP TP Temperature Reflow Condition Package U=μDFN-10 (2.0x1.0mm) Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.004 inches(0.102mm) Substrate material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Ordering Information Part Marking System Part Number Package Marking Min. Order Qty. SP0544TUTG µDFN-10 H G4 3000 HG4 Product Series H = SP5044T Number of Channels Assembly Site ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 03/17/16 4=4 channels TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP0544T Series Package Dimensions µDFN--10 (2.0x1.0mm) JEDEC MO-229 Symbol Millimeters Inches Min Nom Max Min Nom Max A 0.3 - 0.4 0.012 - 0.016 A1 0 - 0.05 0 - 0.002 0.125 REF A3 0.049 REF D 1.95 2.00 2.05 0.077 0.079 0.081 E 0.95 1.00 1.05 0.037 0.039 0.041 b 0.15 0.20 0.25 0.006 0.008 0.010 L 0.28 0.38 0.48 0.011 0.015 0.019 e 0.40 BSC 0.016 BSC Embossed Carrier Tape & Reel Specification 5° Max ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 03/17/16 Symbol Millimeters A0 1.15 +/- 0.05 B0 2.15 +/- 0.05 D Ø 1.55 + 0.1/- 0 D1 Ø 0.80 + 0.25/- 0 E 1.75 +/- 0.10 F 3.50 +/- 0.05 K0 0.48 +/- 0.05 P 4.00 +/- 0.10 P0 4.00 +/- 0.10 P2 2.00 +/- 0.05 T 0.20 +/- 0.03 W 8.00 + 0.30 /- 0.10