TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP03-3.3 Series SP03-3.3 Series 3.3V 150A Diode Array RoHS Pb GREEN This new broadband protection device from Littelfuse provides overvoltage protection for applications such as 10/100/1000 BaseT Ethernet, T3/E3 DS3 interfaces, ADSL2+, and VDSL2+. This new protector combines the TVS diode element with a diode rectifier bridge to provide both longitudinal and differential protection in one package. This design innovation results in a capacitive loading characteristic that is log-linear with respect to the signal voltage across the device. This reduces intermodulation (IM) distortion caused by a typical solid-state protection solution. The application schematic provides the connection information. Agency Approvals - Pending Agency Features • SOIC-8 surface mount package (JEDEC MS-012) E128662 Pinout 1 8 2 7 3 6 4 5 • Low insertion loss, loglinear capacitance • Pending UL recognized component • Combined longitudinal and metallic protection • Low clamping voltage Applications • T1/E1 Line cards • 10/100/1000 BaseT Ethernet • T3/E3 and DS3 Interfaces Functional Block Diagram Pin 1 and 8 • UL 94V-0 epoxy molding • Lightning Protection, IEC61000-4-5, 100A (8/20µs) SOIC-8 (Top View) Line in • Clamping speed of nanoseconds • RoHS compliant Agency File Number • STS-1 Interfaces Line out Application Example TeleLink (0461 1.25) TIP Pin 2, 3, 6, and 7 Line out Line in Pin 4 and 5 Resources 1 8 2 7 3 6 4 5 to chipset (Ethernet PHY, T3/E3 PHY, etc.) RING Additional Information Datasheet SP03-3.3 Samples Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. This schematic shows a high-speed data interface protection solution. The SP03-3.3 provides both metallic (differential) and longitudinal (common mode) protection from lightning induced surge events. Its surge rating is compatible with the intra-building surge requirements of Telcordia’s GR-1089-CORE, and the Basic Level Recommendations of ITU K.20 and .21. This device protects against both positive and negative induced surge events. The TeleLink fuse provides overcurrent protection for the long term 50/60 Hz power fault events. © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 SP03-3.3 Description TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP03-3.3 Series Absolute Maximum Ratings Thermal Information Parameter Rating Parameter Units Rating Units 170 °C/W Peak Pulse Current (8/20µs) 150 A SOIC Package Peak Pulse Power (8/20µs) 3300 W Operating Temperature Range –40 to 125 °C –55 to 150 °C IEC 61000-4-2, Direct Discharge, (Level 4) 30 kV Storage Temperature Range IEC 61000-4-2, Air Discharge, (Level 4) 30 kV Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) (SOIC - Lead Tips Only) 260 °C IEC 61000-4-5 (8/20µs) 100 A Telcordia GR 1089 (Intra-Building) (2/10µs) 100 A ITU K.20 (5/310µs) 40 A CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP = 25°C) Parameter Symbol Test Conditions Min Typ Max Units VRWM - - - 3.3 V Reverse Breakdown Voltage VBR IT= 2µA 3.3 - - V Reverse Breakdown Voltage VBR IT= 50µA 3.3 - - V Reverse Stand-Off Voltage Reverse Leakage Current IR VRWM= 3.3V, T= 25°C - - 1 µA Clamping Voltage, Line-Ground VC IPP= 50A, tp=8/20 µs - - 11.5 V Clamping Voltage, Line-Ground VC IPP= 100A, tp=8/20 µs - - 15 V Clamping Voltage, Line-Line VC IPP= 50A, tp=8/20 µs - - 13.5 V Clamping Voltage, Line-Line VC IPP= 100A, tp=8/20 µs - - 18 V Between I/O Pins and Ground VR=0V, f= 1MHz - 16 25 pF Between I/O Pins VR=0V, f= 1MHz - 8 12 pF Junction Capacitance Cj Figure 1: Non-repetitive Peak Pulse Current vs. Pulse Time Figure 2: Current Derating Curve 120 Percentage of Rated Current (%IP) Peak Pulse Current (A) 1000 100 10 1 1 10 100 Pulse decay time (µs) © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 1000 100 80 60 40 20 0 0 20 40 60 80 100 Ambient Temperature (C) 120 140 160 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP03-3.3 Series Figure 3: Pulse Waveform Figure 4: Clamping Voltage vs. Peak Pulse Current 20 100 18 VC Clamping Voltage (V) Percentage of IPP (%) 16 80 60 40 20 14 12 Line to Line 10 8 6 Line to Ground 4 2 0 0 0 5 10 15 20 25 30 35 0 40 10 20 30 40 50 Figure 5: Capacitance vs. Reverse Voltage 70 80 90 100 Figure 6: Forward Voltage vs. Forward Current 7 20 18 6 Line to Ground Ground-to-Line Forward Voltage (V) 16 Capacitance (pF) 60 IP Peak Impulse Current (A) Time, µs 14 12 10 8 Line to Line 6 4 5 4 3 2 1 2 0 0 0 0.5 1 1.5 2 2.5 0 3 10 20 30 Reverse Voltage (V) 40 50 60 70 80 90 100 Forward Current (A) Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 Peak Temperature (TP) +0/-5 tP TP Temperature Reflow Condition tS time to peak temperature Time °C Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP03-3.3 Series Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline Package SOIC-8 Pins 8 JEDEC MS-012 Millimetres LF o Recommended Soldering Pad Outline (Reference Only) Inches Min Max Min Max A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 A2 1.25 1.65 0.050 0.065 B 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 1.27 BSC e 1.27 0.40 L 0.050 BSC 0.050 0.016 Embossed Carrier Tape & Reel Specification — SOIC Package Millimetres E G= Green Package B = SOIC Series Working Voltage LF SP03-3.3 First Line: Part number Second Line: Date code Ordering Information Part Number Package Marking Min. Order Qty. SP03-3.3BTG SOIC Tape & Reel SP03-3.3 2500 © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 0.065 0.073 5.6 0.213 0.22 2.05 0.077 0.081 D 1.5 1.6 0.059 0.063 1.50 Min 3.9 4.1 40.0 ± 0.20 0.059 Min 0.154 0.161 1.574 ± 0.008 W 11.9 12.1 0.468 0.476 P 7.9 8.1 0.311 0.319 A0 6.3 6.5 0.248 0.256 B0 5.1 5.3 0.2 0.209 K0 2 2.2 0.079 0.087 0.30 ± 0.05 0.012 ± 0.002 Product Characteristics Part Marking System XXXXXXXX 1.85 5.4 t T= Tape & Reel Max 1.65 1.95 10P0 TVS Diode Arrays (SPA® Diodes) Min F P0 SP 03 – 3.3 B T G Max P2 D1 Part Numbering System Inches Min Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13.