TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP3374NUTG SP3374NUTG 3.3V 40A Diode Array RoHS Pb GREEN Description The SP3374NUTG is a low-capacitance, TVS Diode Array designed to provide protection against ESD (electrostatic discharge), CDE (cable discharge events), EFT (electrical fast transients), and lightning induced surges for highspeed, differential data lines. It’s packaged in a µDFN package (3.0 x 2.0mm) and each device can protect up 4 channels or 2 differential pairs, up to 40A (IEC 61000-45 2nd edition,) and up to 30kV ESD (IEC 61000-4-2). The “flow-through” design minimizes signal distortion, reduces voltage overshoot, and provides a simplified PCB design. The SP3374NUTG with its low capacitance and low clamping voltage makes it ideal for high-speed data interfaces such as 1GbE applications found in notebooks, switches, etc. Pinout Features 10 9 8 7 • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air 6 • EFT, IEC 61000-4-4, 40A (5/50ns) • Lightning, IEC 610004-5 2nd edition, 40A (tP=8/20μs) 1 2 3 4 • Low capacitance of 3.5pF@0V (TYP) per I/O 5 • Low leakage current of 0.1μA (TYP) at 3.3V Functional Block Diagram LINE1 IN (Pin 1) LINE2 IN (Pin 2) • μDFN-10 package is optimized for high-speed data line routing • Provides protection for two differential data pairs (4 channels) up to 40A • Low operating and clamping voltage • AEC-Q101 qualified • Halogen free, Lead free and RoHS compliant Applications LINE1 OUT (Pin 10) LINE2 OUT (Pin 9) •10/100/1000 Ethernet • LVDS Interfaces • WAN/LAN Equipment • Integrated Magnetics • Desktops, Servers and Notebooks • Smart TV Application Example GND GND RJ-45 Connector LINE3 IN (Pin 4) Ethernet PHY TP0+ LINE3 OUT (Pin 7) TP0LINE4_IN (Pin 5) LINE4_OUT (Pin 6) TP1+ TP1TP2+ TP2TP3+ TP3- Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 06/07/16 SP2574N SP3374 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP3374NUTG Absolute Maximum Ratings Symbol Parameter Value IPP Peak Current (tp=8/20μs) PPk Peak Pulse Power (tp=8/20μs) TOP TSTOR Units 40 A 1000 W Operating Temperature -40 to 125 °C Storage Temperature -55 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Symbol Test Conditions Reverse Standoff Voltage Parameter VRWM IR ≤ 1µA Reverse Leakage Current IR VRWM = 3.3V, T = 25°C Snap Back Voltage Clamp Voltage Dynamic Resistance2 ESD Withstand Voltage Diode Capacitance VSB VC RDYN VESD ISB = 50mA Min 0.1 Revision: 06/07/16 Max V 0.5 µA 2.8 V 5.5 IPP = 10A, tp = 8/20μs Any I/O to Ground 10.5 IPP = 25A, tp = 8/20μs Any I/O to Ground 18.0 IPP = 40A, tp = 8/20μs Line-to-Line1, two I/O Pins connected together on each line 25.0 TLP, tp=100ns, Any I/O to Ground Units 3.3 IPP = 1A, tp = 8/20μs Any I/O to Ground 0.15 V Ω IEC 61000-4-2 (Contact) ±30 kV IEC 61000-4-2 (Air) ±30 kV CI/O to GND Between I/O Pins and Ground VR = 0V, f = 1MHz 3.5 CI/O to I/O Between I/O Pins VR = 0V, f = 1MHz 1.7 Notes: 1. Rating with 2 pins connected together per sugguested diagram ( For example, pin1 is connected to pin 10, pin 2 is connected to Pin 9, Pin 4 is connected to pin 7 and pin 5 is connected to pin 6) 2. Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Typ 5.0 pF pF TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP3374NUTG Clamping Voltage vs. IPP (I/O to GND) 15.0 15 12.0 12 Clamp Voltage (VC) Capacitance (pF) Capacitance vs. Reverse Bias 9.0 6.0 6 3 3.0 0.0 9 0 0 0.5 1 1.5 2 2.5 3 3.5 0 5 Bias Voltage (V) Clamping Voltage vs. IPP (Line-to-Line) 15 20 25 25.0 30.0 8/20μS Pulse Waveform 25 110% 100% 20 Clamp Voltage (VC) 10 Peak Pulse Current-IPP (A) 90% Percent of IPP 80% 15 10 70% 60% 50% 40% 30% 5 20% 10% 0 0 5 10 15 20 25 30 35 Transmission Line Pulsing(TLP) Plot 20 18 16 TLP Current (A) 14 12 10 8 6 4 2 0 2 4 6 TLP Voltage (V) ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 06/07/16 8 0% 0.0 5.0 10.0 15.0 Time (μs) Peak Pulse Current-IPP (A) 0 40 10 20.0 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP3374NUTG Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C tL Ramp-do Ramp-down Preheat TS(min) tS time to peak temperature Part Number Package Marking Min. Order Qty. SP3374NUTG µDFN-10 (3.0x2.0mm) bG4 3000 Part Numbering System Product Characteristics Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.004 inches(0.102mm) Substrate material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 MSL Rating Level 1 Part Marking System SP3374N U T G Series G= Green T= Tape & Reel Package μDFN-10 (3.0x2.0mm) ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 06/07/16 Time °C Ordering Information TVS Diode Arrays (SPA® Diodes) Critical Zone TL to TP Ramp-up TL TS(max) 25 Peak Temperature (TP) +0/-5 tP TP Temperature Reflow Condition bG4 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP3374NUTG Package Dimensions — µDFN-10 (3.0x2.0mm) D L b1 E Package µDFN-10 (3.0x2.0mm) JEDEC MO-229 L1 Symbol e PIN1 INDICATOR b e1 A A1 0.95mm 0.25mm 0.95mm 1.40mm 0.85mm 0.40mm 0.60mm 1.40mm 0.60mm 0.40mm 1.98mm 0.25mm 0.95mm 1.00mm 1.98mm 0.95mm 0.60mm 0.65mm 0.65mm 0.60mm 0.60mm 0.65mm 0.65mm 0.60mm Recommended Soldering Pads Layout Recommended Stencil Apertures Recommended Stencil thickness 5mils Inches Nom Max Min Nom Max A 0.50 0.60 0.65 0.020 0.024 0.026 A1 0.00 0.03 0.05 0.000 0.001 0.002 0.15 Ref A3 e2 A3 Millimeters Min 0.006 Ref b 0.15 0.20 0.25 0.006 0.008 0.010 b1 0.25 0.35 0.45 0.010 0.014 0.018 D 2.90 3.00 3.10 0.114 0.118 0.122 E 1.90 2.00 2.10 0.075 0.079 0.083 e 0.60 BSC 0.024 BSC e1 0.65 BSC 0.026 BSC e2 0.95 BSC 0.037 L 0.25 0.30 0.35 0.010 0.012 0.014 L1 0.95 1.00 1.05 0.037 0.039 0.041 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Tape & Reel Specification — µDFN-10 (3.0x2.0mm) P0 T P2 ø1.55±0.05 Package Device Orientation in Tape E Top Cover Tape 5° Max K0 W A0 F B0 P ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 06/07/16 ø1.0±0.1 Pin1 Location µDFN-10 (3.0x2.0mm) Symbol Millimeters A0 2.30 +/- 0.10 B0 3.20 +/- 0.10 E 1.75 +/- 0.10 F 3.50 +/- 0.05 K0 1.0 +/- 0.10 P 4.00 +/- 0.10 P0 4.00 +/- 0.10 P2 2.00 +/- 0.10 T 0.3 +/- 0.05 W 8.00 +0.30/- 0.10