LTM8023 2A, 36V DC/DC Step-Down µModule Regulator DESCRIPTION FEATURES Complete Step-Down Switch Mode Power Supply Wide Input Voltage Range: 3.6V to 36V 2A Output Current 0.8V to 10V Output Voltage Selectable Switching Frequency: 200kHz to 2.4MHz Current Mode Control Programmable Soft-Start SnPb (BGA) or RoHS Compliant (LGA and BGA) Finish n Tiny, Low Profile, Surface Mount LGA (9mm × 11.25mm × 2.82mm) and BGA (9mm × 11.25mm × 3.42mm) Packages n n n n n n n n APPLICATIONS n n n n n Automotive Battery Regulation Power for Portable Products Distributed Supply Regulation Industrial Supplies Wall Transformer Regulation The LTM®8023 is a complete 2A, DC/DC step-down power supply. Included in the package are the switching controller, power switches, inductor, and all support components. Operating over an input voltage range of 3.6V to 36V, the LTM8023 supports an output voltage range of 0.8V to 10V, and a switching frequency range of 200kHz to 2.4MHz, each set by a single resistor. Only the bulk input and output filter capacitors are needed to finish the design. The low profile package enables utilization of unused space on the bottom of PC boards for high density point of load regulation. The LTM8023 is packaged in a thermally enhanced, compact and low profile over-molded land grid array (LGA) and ball grid array (BGA) packages suitable for automated assembly by standard surface mount equipment. The LTM8023 is available with SnPb (BGA) or RoHS compliant terminal finish. L, LT, LTC, LTM, Linear Technology, the Linear logo, Burst Mode and µModule are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. TYPICAL APPLICATION 5.5VIN to 36VIN, 3.3V/2A DC/DC µModule® Converter VIN* 5.5V TO 36V VIN VOUT AUX 22µF BIAS SHARE LTM8023 PGOOD RT 1.6 1.4 80 1.2 75 1.0 70 0.8 65 0.6 0.4 VIN = 12V VOUT = 3.3V f = 650 kHz 55 GND SYNC 8023 TA01 49.9k 85 60 ADJ SELECTABLE OPERATING FREQUENCY 1.8 154k 50 *RUNNING VOLTAGE RANGE. PLEASE REFER TO APPLICATIONS INFORMATION FOR START-UP DETAILS POWER LOSS (W) RUN/SS VOUT 3.3V 2A EFFICIENCY (%) 2.2µF Efficiency and Power Loss 90 0.01 0.1 1 LOAD CURRENT (A) 0.2 0 10 8023 TA01b 8023fj For more information www.linear.com/LTM8023 1 LTM8023 ABSOLUTE MAXIMUM RATINGS (Note 1) VIN + BIAS..................................................................56V Internal Operating Temperature (Note 2)................................................... –40°C to 125°C Storage Temperature.............................. –55°C to 125°C Solder Temperature................................................ 250°C VIN, RUN/SS Voltage..................................................40V ADJ, RT, SHARE Voltage..............................................5V VOUT, AUX..................................................................10V PGOOD, SYNC...........................................................30V BIAS...........................................................................16V PIN CONFIGURATION GND (BANK 3) SHARE RT ADJ SHARE RT GND (BANK 3) 7 ADJ 7 6 SYNC PGOOD 6 SYNC PGOOD 5 RUN/SS 5 RUN/SS BIAS 4 3 VOUT (BANK 2) 2 VIN (BANK 1) BIAS 4 AUX AUX 3 VOUT (BANK 2) 2 1 VIN (BANK 1) 1 A B C D E F G H A LGA PACKAGE 50-LEAD (11.25mm × 9mm × 2.82mm) B C E D F G H BGA PACKAGE 50-LEAD (11.25mm × 9mm × 3.42mm) TJMAX = 125°C, θJA = 30.4°C/W, θJCbottom = 12.2°C/W, θJCtop = 23.9°C/W, θJB = 12.1°C/W, WEIGHT = 0.9g θ VALUES DETERMINED PER JEDEC 51-9, 51-12 TJMAX = 125°C, θJA = 32.1°C/W, θJCbottom = 14.8°C/W, θJCtop = 23.7°C/W, θJB = 14.6°C/W, WEIGHT = 0.9g θ VALUES DETERMINED PER JEDEC 51-9, 51-12 ORDER INFORMATION PART NUMBER PAD OR BALL FINISH LTM8023EV#PBF Au (RoHS) PART MARKING* DEVICE FINISH CODE PACKAGE TYPE LTM8023V e4 LGA MSL RATING 3 TEMPERATURE RANGE (Note 2) –40°C to 85°C LTM8023IV#PBF Au (RoHS) LTM8023V e4 LGA 3 –40°C to 85°C LTM8023MPV#PBF Au (RoHS) LTM8023MPV e4 LGA 3 –55°C to 125°C LTM8023EY#PBF SAC305 (RoHS) LTM8023Y e1 BGA 3 –40°C to 85°C LTM8023IY#PBF SAC305 (RoHS) LTM8023Y e1 BGA 3 –40°C to 85°C LTM8023IY SnPb (63/37) LTM8023Y e0 BGA 3 –40°C to 85°C LTM8023MPY#PBF SAC305 (RoHS) LTM8023Y e1 BGA 3 –55°C to 125°C LTM8023MPY SnPb (63/37) LTM8023Y e0 BGA 3 –55°C to 125°C Consult Marketing for parts specified with wider operating temperature ranges. *Device temperature grade is indicated by a label on the shipping container. Pad or ball finish code is per IPC/JEDEC J-STD-609. • Recommended LGA and BGA PCB Assembly and Manufacturing Procedures: www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: www.linear.com/leadfree • LGA and BGA Package and Tray Drawings: www.linear.com/packaging 2 8023fj For more information www.linear.com/LTM8023 LTM8023 ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. VIN = 10V, VRUN/SS = 10V, VBIAS = 3V, RT = 60.4k, COUT = 4.7µF unless otherwise specified. SYMBOL PARAMETER VIN Input DC Voltage VOUT Output DC Voltage RADJ(MIN) Minimum Allowable RADJ (Note 4) IOUT Continuous Output DC Current 4 ≤ VIN ≤ 36, COUT = 51µF IQVIN VIN Quiescent Current VRUN/SS = 0.2V, RT = 174k VBIAS = 3V, Not Switching, RT = 174k (E, I) VBIAS = 3V, Not Switching, RT = 174k (MP) VBIAS = 0V, Not Switching, RT = 174k l l VRUN/SS = 0.2V, RT = 174k VBIAS = 3V, Not Switching, RT = 174k (E, I) VBIAS = 3V, Not Switching, RT = 174k (MP) VBIAS = 0V, Not Switching, RT = 174k l l IQBIAS BIAS Quiescent Current CONDITIONS MIN l TYP 3.6 0A < IOUT ≤ 2A, RADJ Open, COUT = 51µF (Note 3) 0A < IOUT ≤ 2A, RADJ = 43.2k, COUT = 51µF (Note 3) MAX 36 0.8 10 UNITS V V V 42.2 kΩ 0 2 A 0.1 25 25 85 0.5 60 350 120 µA µA µA µA 0.03 50 50 1 0.5 120 200 5 µA µA µA µA ΔVOUT/VOUT Line Regulation 5 ≤ VIN ≤ 36, IOUT = 1A, VOUT = 3.3V, COUT = 51µF 0.1 ΔVOUT/VOUT Load Regulation VIN = 24V, 0 ≤ IOUT ≤ 2A, VOUT = 3.3V, COUT = 51µF 0.4 % VIN = 24V, IOUT = 2A, VOUT = 3.3V, COUT = 51µF 10 mV 325 kHz VOUT(AC_RMS) Output Ripple (RMS) fSW Switching Frequency RT = 113k, COUT = 51µF ISC(OUT) Output Short Circuit Current VIN = 36V, VOUT = 0V (Note 5) VADJ Voltage at ADJ Pin COUT = 51µF VBIAS(MIN) Minimum BIAS Voltage for Proper Operation IADJ Current Out of ADJ Pin ADJ = 1V, COUT = 51µF IRUN/SS RUN/SS Pin Current VRUN/SS = 2.5V VIH(RUN/SS) RUN/SS Input High Voltage COUT = 51µF 2.9 l 765 A 790 805 mV 2.3 2.8 V 2 5 µA 10 2.5 VIL(RUN/SS) RUN/SS Input Low Voltage COUT = 51µF PGOOD Threshold VOUT Rising 730 0.2 IPGOOD(O) PGOOD Leakage VPGOOD = 30V 0.1 IPGOOD(SINK) PGOOD Sink Current VPGOOD = 0.4V VSYNCIL SYNC Input Low Threshold fSYNC = 550kHz, COUT = 51µF VSYNCIH SYNC Input High Threshold fSYNC = 550kHz, COUT = 51µF ISYNCBIAS SYNC Pin Bias Current VSYNC = 0V 200 µA V VPGOOD(TH) Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LTM8023E is guaranteed to meet performance specifications from 0°C to 85°C ambient. Specifications over the full –40°C to 85°C ambient operating temperature range are assured by design, characterization and correlation with statistical process controls. The LTM8023I is guaranteed to meet specifications over the full –40°C to 85°C ambient operating temperature range. The LTM8023MP is guaranteed to % 1 800 µA µA 0.5 0.7 V mV V V 0.1 µA meet specifications over the full –55°C to 125°C temperature range. Note that the maximum internal temperature is determined by specific operating conditions in conjunction with board layout, the rated package thermal resistance and other environmental factors. Note 3: COUT = 51µF is composed of a 4.7µF ceramic capacitor in parallel with a 47µF electrolytic. Note 4: Guaranteed by design. Note 5: Short circuit current at VIN = 36V is guaranteed by characterization and correlation. 100% tested at VIN = 10V 8023fj For more information www.linear.com/LTM8023 3 LTM8023 TYPICAL PERFORMANCE CHARACTERISTICS Efficiency (8VOUT) 90 VOUT = 8V 90 70 60 50 40 30 20 0.01 0.1 OUTPUT CURRENT (A) 75 70 65 50 0.01 20 0.1 OUTPUT CURRENT (A) 8023 G01 Minimum Required Input Voltage vs Output Voltage 75 70 65 60 12VIN 24VIN 36VIN 55 1 VOUT = 3.3V 80 60 12VIN 24VIN 36VIN Efficiency (3.3VOUT) 85 80 EFFICIENCY (%) EFFICIENCY (%) 90 VOUT = 5V 85 80 5VIN 12VIN 24VIN 36VIN 55 50 0.01 1 0.1 OUTPUT CURRENT (A) 8023 G02 36VIN Start-Up Waveforms (5VOUT) 1 8023 G03 36VIN Start-Up Waveforms (3.3VOUT) IOUT = 2A 18 16 INPUT VOLTAGE (V) Efficiency (5VOUT) EFFICIENCY (%) 100 TA = 25°C unless otherwise noted 14 OPERATING FREQUENCY AS RECOMMENDED IN TABLE 1 12 10 VOUT 2V/DIV IIN 0.2A/DIV VOUT 2V/DIV IIN 0.2A/DIV RUN/SS 5V/DIV RUN/SS 5V/DIV VIN = 36V IOUT = 2A VBIAS = 3V 8 6 50µs/DIV 8023 G05 VIN = 36V IOUT = 2A VBIAS = 3V 50µs/DIV 8023 G06 4 2 0 2 4 6 OUTPUT VOLTAGE (V) 8 10 8023 G04 Input Current vs Output Current 1600 VOUT = 8V 1400 800 600 400 12VIN 24VIN 36VIN 200 4 VOUT = 5V 0 500 1000 1500 OUTPUT CURRENT (mA) 2000 8023 G07 VOUT = 3.3V 1800 1600 INPUT CURRENT (mA) 1000 0 Input Current vs Output Current 2000 1000 1200 INPUT CURRENT (mA) INPUT CURRENT (mA) Input Current vs Output Current 1200 800 12VIN 24VIN 36VIN 600 400 1400 1200 5VIN 12VIN 24VIN 36VIN 1000 800 600 400 200 200 0 0 500 1000 1500 OUTPUT CURRENT (mA) 2000 8023 G08 0 0 500 1000 1500 OUTPUT CURRENT (mA) 2000 8023 G09 8023fj For more information www.linear.com/LTM8023 LTM8023 TYPICAL PERFORMANCE CHARACTERISTICS Output Short-Circuit Current vs Input Voltage BIAS Current vs Load Current 30 3200 2500 25 2600 2400 2200 2000 20 3.3VOUT 5VOUT 8VOUT 15 10 1500 1000 500 5 1800 0 10 20 30 INPUT VOLTAGE (V) 2500 0 40 0 500 1000 1500 LOAD CURRENT (mA) Load Current vs Input Voltage (5VOUT, LGA) 1500 1000 0 10 20 30 INPUT VOLTAGE (V) 40 8023 G13 1500 1000 0 40 25°C 40°C 85°C 0 10 8023 G14 20 30 INPUT VOLTAGE (V) 80 60 70 TEMPERATURE RISE (°C) 35 30 25 20 15 10 12VIN 24VIN 36VIN 5 1000 1500 CURRENT (mA) 2000 2500 8023 G16 TEMPERATURE RISE (°C) 50 40 40 30 20 12VIN 24VIN 36VIN 10 0 40 8023 G15 8VOUT Junction Temperature vs Load (LGA) 45 TEMPERATURE RISE (°C) 20 30 INPUT VOLTAGE (V) Load Current vs Input Voltage (3.3VOUT, LGA) 5VOUT Junction Temperature vs Load (LGA) 50 500 10 500 25°C 40°C 85°C 3.3VOUT Junction Temperature vs Load (LGA) 0 0 2000 500 0 25°C 40°C 85°C 8023 G11 2500 LOAD CURRENT (mA) LOAD CURRENT (mA) 0 2000 8023 G10 2000 0 Maximum Load Current vs Input Voltage (8VOUT, LGA) 2000 LOAD CURRENT (mA) 2800 BIAS CURRENT (mA) OUTPUT CURRENT (mA) 3000 1600 TA = 25°C unless otherwise noted 0 500 1000 1500 CURRENT (mA) 2000 2500 8023 G17 60 50 40 30 20 16VIN 24VIN 36VIN 10 0 0 500 1000 1500 CURRENT (mA) 2000 2500 8023 G18 8023fj For more information www.linear.com/LTM8023 5 LTM8023 TYPICAL PERFORMANCE CHARACTERISTICS 5VOUT Temperature Rise vs Load Current (BGA) 60 50 50 40 30 20 12VIN 24VIN 36VIN 0 0 6 500 1000 1500 2000 LOAD CURRENT (mA) 2500 8023 G19 8VOUT Temperature Rise vs Load Current (BGA) 90 80 TEMPERATURE RISE (°C) 60 TEMPERATURE RISE (°C) TEMPERATURE RISE (°C) 3.3VOUT Temperature Rise vs Load Current (BGA) 10 TA = 25°C unless otherwise noted 40 30 20 12VIN 24VIN 36VIN 10 0 0 500 1000 1500 2000 LOAD CURRENT (mA) 2500 8023 G20 70 60 50 40 30 20 18VIN 24VIN 36VIN 10 0 0 500 1000 1500 2000 LOAD CURRENT (mA) 2500 8023 G21 8023fj For more information www.linear.com/LTM8023 LTM8023 PIN FUNCTIONS VIN (Bank 1): The VIN pin supplies current to the LTM8023’s internal regulator and to the internal power switch. This pin must be locally bypassed with an external, low ESR capacitor of at least 2.2µF. VOUT (Bank 2): Power Output Pins. Apply the output filter capacitor and the output load between these pins and GND pins. AUX (Pin F5): Low Current Voltage Source for BIAS. The VAUX pin is internally connected to VOUT and is placed adjacent to the BIAS pin to ease printed circuit board routing. Although this pin is internally connected to VOUT, do NOT connect this pin to the load. If this pin is not tied to BIAS, leave it floating. large impact on the thermal performance of the part. See the PCB Layout and Thermal Consideration sections for more details. Return the feedback divider (RADJ) to this net. RT (Pin G7): The RT pin is used to program the switching frequency of the LTM8023 by connecting a resistor from this pin to ground. The Applications Information section of the data sheet includes a table to determine the resistance value based on the desired switching frequency. Minimize capacitance at this pin. SHARE (Pin F7): Tie this to the SHARE pin of another LTM8023 when paralleling the outputs. Otherwise, do not connect (leave floating). BIAS (Pin G5): The BIAS pin connects to the internal power bus. Connect to a power source greater than 2.8V. If the output is greater than 2.8V, connect this pin there. If the output voltage is less, connect this to a voltage source between 2.8V and 16V. Also, make sure that BIAS + VIN is less than 56V. SYNC (Pin G6): This is the external clock synchronization input. Ground this pin for low ripple Burst Mode® operation at low output loads. Tie to a stable voltage source greater than 0.7V to disable Burst Mode operation. Do not leave this pin floating. Tie to a clock source for synchronization. Clock edges should have rise and fall times faster than 1µs. See synchronizing section in Applications Information. RUN/SS (Pin H5): Tie RUN/SS pin to ground to shut down the LTM8023. Tie to 2.5V or more for normal operation. If the shutdown feature is not used, tie this pin to the VIN pin. RUN/SS also provides a soft-start function; see the Applications Information section. PGOOD (Pin H6): The PGOOD pin is the open-collector output of an internal comparator. PG remains low until the ADJ pin is within 10% of the final regulation voltage. PG output is valid when VIN is above 3.6V and RUN/SS is high. If this function is not used, leave this pin floating. GND (Bank 3): Tie these GND pins to a local ground plane below the LTM8023 and the circuit components. In most applications, the bulk of the heat flow out of the LTM8023 is through these pads, so the printed circuit design has a ADJ (Pin H7): The LTM8023 regulates its ADJ pin to 0.79V. Connect the adjust resistor from this pin to ground. The value of RADJ is given by the equation RADJ = 394.21/ (VOUT – 0.79), where RADJ is in kΩ. 8023fj For more information www.linear.com/LTM8023 7 LTM8023 BLOCK DIAGRAM VIN VOUT 4.7µH 0.1µF 4.7pF 499k 10µF AUX BIAS SHARE RUN/SS PGOOD CURRENT MODE CONTROLLER SYNC GND RT ADJ 8023 BD 8 8023fj For more information www.linear.com/LTM8023 LTM8023 OPERATION The LTM8023 is a standalone nonisolated step-down switching DC/DC power supply. It can deliver up to 2A of DC output current with only bulk external input and output capacitors. This module provides a precisely regulated output voltage programmable via one external resistor from 0.8VDC to 10VDC. The input voltage range is 3.6V to 36V. Given that the LTM8023 is a step-down converter, make sure that the input voltage is high enough to support the desired output voltage and load current. A simplified Block Diagram is given on the previous page. The LTM8023 contains a current mode controller, power switching element, power inductor, power Schottky diode and a modest amount of input and output capacitance. The LTM8023 is a fixed frequency PWM regulator. The switching frequency is set by simply connecting the appropriate resistor value from the RT pin to GND. An internal regulator provides power to the control circuitry. The bias regulator normally draws power from the VIN pin, but if the BIAS pin is connected to an external voltage higher than 2.8V, bias power will be drawn from the external source (typically the regulated output voltage). This improves efficiency. The RUN/SS pin is used to place the LTM8023 in shutdown, disconnecting the output and reducing the input current to less than 1µA. To further optimize efficiency, the LTM8023 automatically switches to Burst Mode operation in light load situations. Between bursts, all circuitry associated with controlling the output switch is shut down reducing the input supply current to 50µA in a typical application. The oscillator reduces the LTM8023’s operating frequency when the voltage at the ADJ pin is low. This frequency foldback helps to control the output current during start-up and overload. The LTM8023 contains a power good comparator which trips when the ADJ pin is at 92% of its regulated value. The PGOOD output is an open-collector transistor that is off when the output is in regulation, allowing an external resistor to pull the PGOOD pin high. Power good is valid when the LTM8023 is enabled and VIN is above 3.6V. APPLICATIONS INFORMATION For most applications, the design process is straight forward, summarized as follows: 1.Look at Table 1 and find the row that has the desired input range and output voltage. 2.Apply the recommended CIN, COUT, RADJ and RT values. 3.Connect BIAS as indicated. While these component combinations have been tested for proper operation, it is incumbent upon the user to verify proper operation over the intended system’s line, load and environmental conditions. Capacitor Selection Considerations The CIN and COUT capacitor values in Table 1 are the minimum recommended values for the associated operating conditions. Applying capacitor values below those indicated in Table 1 is not recommended, and may result in undesirable operation. Using larger values is generally acceptable, and can yield improved dynamic response, if it is necessary. Again, it is incumbent upon the user to verify proper operation over the intended system’s line, load and environmental conditions. Ceramic capacitors are small, robust and have very low ESR. However, not all ceramic capacitors are suitable. X5R and X7R types are stable over temperature and applied voltage and give dependable service. Other types, including Y5V and Z5U have very large temperature and voltage coefficients of capacitance. In an application circuit they may have only a small fraction of their nominal capacitance resulting in much higher output voltage ripple than expected. 8023fj For more information www.linear.com/LTM8023 9 LTM8023 APPLICATIONS INFORMATION Table 1. Recommended Component Values and Configuration (TA = 25°C) VIN VOUT CIN COUT RADJ BIAS fOPTIMAL (kHz) RT(OPTIMAL) fMAX (kHz) RT(MIN) 3.6V to 36V 0.82V 10µF 200µF 1206 13M ≥2.8V, <16V 250 150k 250 150k 3.6V to 36V 1.00V 10µF 147µF 1206 1.87M ≥2.8V, <16V 300 124k 300 124k 3.6V to 36V 1.20V 10µF 100µF 1206 953k ≥2.8V, <16V 350 105k 350 105k 88.7k 3.6V to 36V 1.50V 10µF 100µF 1206 549k ≥2.8V, <16V 400 88.7k 400 3.6V to 36V 1.80V 4.7µF 100µF 1206 383k ≥2.8V, <16V 450 79k 450 79k 3.6V to 36V 2.00V 2.2µF 68µF 1206 324k ≥2.8V, <16V 450 79k 500 69.8k 3.6V to 36V 2.20V 2.2µF 47µF 1206 274k ≥2.8V, <16V 500 69.8k 550 61.9k 4.1V to 36V 2.50V 2.2µF 47µF 1206 226k ≥2.8V, <16V 550 61.9k 615 54.9k 5.5V to 36V 3.30V 2.2µF 22µF 1206 154k AUX 650 49.9k 750 42.2k 7.5V to 36V 5.00V 2.2µF 10µF 0805 93.1k AUX 650 49.9k 890 34.8k 3.6V to 15V 0.82V 10µF 200µF 1206 13M VIN 350 105k 650 49.9k 3.6V to 15V 1.00V 10µF 147µF 1206 1.87M VIN 400 88.7k 725 43.2k 3.6V to 15V 1.20V 10µF 100µF 1206 953k VIN 450 79k 800 39.2k 3.6V to 15V 1.50V 10µF 100µF 1206 549k VIN 450 79k 1000 29.4k 3.6V to 15V 1.80V 4.7µF 100µF 1206 383k VIN 450 79k 1100 26.7k 3.6V to 15V 2.00V 2.2µF 68µF 1206 324k VIN 450 79k 1200 23.7k 3.6V to 15V 2.20V 2.2µF 47µF 1206 274k VIN 500 69.8k 1300 21.0k 3.6V to 15V 2.50V 2.2µF 47µF 1206 226k VIN 550 61.9k 1450 18.2k 5.5V to 15V 3.30V 2.2µF 22µF 1206 154k AUX 650 49.9k 1400 19.6k 7.5V to 15V 5.00V 2.2µF 10µF 0805 93.1k AUX 650 49.9k 1200 23.7k 9V to 24V 0.82V 10µF 200µF 1206 13M ≥2.8V, <16V 250 150k 250 150k 9V to 24V 1.00V 10µF 147µF 1206 1.87M ≥2.8V, <16V 300 124k 450 79k 9V to 24V 1.20V 2.2µF 100µF 1206 953k ≥2.8V, <16V 450 79k 500 69.8k 9V to 24V 1.50V 2.2µF 100µF 1206 549k ≥2.8V, <16V 450 79k 615 54.9k 9V to 24V 1.80V 2.2µF 100µF 1206 383k ≥2.8V, <16V 450 79k 700 44.2k 9V to 24V 2.00V 2.2µF 68µF 1206 324k ≥2.8V, <16V 450 79k 750 42.2k 9V to 24V 2.20V 2.2µF 47µF 1206 274k ≥2.8V, <16V 500 69.8k 800 39.2k 9V to 24V 2.50V 2.2µF 47µF 1206 226k ≥2.8V, <16V 550 61.9k 890 34.8k 9V to 24V 3.30V 2.2µF 22µF 1206 154k AUX 650 49.9k 1150 25.5k 9V to 24V 5.00V 2.2µF 10µF 0805 93.1k AUX 650 49.9k 1000 29.4k 14.5V to 24V 8.00V 2.2µF 10µF 0805 53.6k AUX 650 49.9k 800 39.2k 18V to 36V 0.82V 10µF 200µF 1206 13M ≥2.8V, <16V 250 150k 250 150k 18V to 36V 1.00V 10µF 147µF 1206 1.87M ≥2.8V, <16V 300 124k 300 124k 18V to 36V 1.20V 2.2µF 100µF 1206 953k ≥2.8V, <16V 350 105k 350 105k 18V to 36V 1.50V 2.2µF 100µF 1206 549k ≥2.8V, <16V 400 88.7k 400 88.7k 18V to 36V 1.80V 2.2µF 100µF 1206 383k ≥2.8V, <16V 450 79k 450 79k 18V to 36V 2.00V 2.2µF 68µF 1206 324k ≥2.8V, <16V 450 79k 500 69.8k 18V to 36V 2.20V 2.2µF 47µF 1206 274k ≥2.8V, <16V 450 79k 550 61.9k 18V to 36V 2.50V 2.2µF 47µF 1206 226k ≥2.8V, <16V 500 69.8k 615 54.9k 18V to 36V 3.30V 2.2µF 22µF 1206 154k AUX 650 49.9k 750 42.2k 18V to 36V 5.00V 2.2µF 10µF 0805 93.1k AUX 800 39.2k 890 34.8k 18V to 36V 8.00V 2.2µF 10µF 0805 53.6k AUX 650 49.9k 800 39.2k 20V to 36V 10.00V 2.2µF 10µF 0805 42.2k AUX 615 54.9k 750 42.2k 4.75V to 32V –3.30V 2.2µF 22µF 1206 154k AUX 550 61.9k 800 39.2k 7V to 31V –5.00V 2.2µF 10µF 0805 93.1k AUX 800 39.2k 1100 26.7k 15V to 28V –8.00V 2.2µF 10µF 0805 53.6k AUX 800 39.2k 1600 15.8k A bulk input capacitor is required. 10 8023fj For more information www.linear.com/LTM8023 LTM8023 APPLICATIONS INFORMATION Ceramic capacitors are also piezoelectric. In Burst Mode operation, the LTM8023’s switching frequency depends on the load current, and can excite a ceramic capacitor at audio frequencies, generating audible noise. Since the LTM8023 operates at a lower current limit during Burst Mode operation, the noise is typically very quiet to a casual ear. If this audible noise is unacceptable, use a high performance electrolytic capacitor at the output. The input capacitor can be a parallel combination of a 2.2µF ceramic capacitor and a low cost electrolytic capacitor. A final precaution regarding ceramic capacitors concerns the maximum input voltage rating of the LTM8023. A ceramic input capacitor combined with trace or cable inductance forms a high Q (under damped) tank circuit. If the LTM8023 circuit is plugged into a live supply, the input voltage can ring to twice its nominal value, possibly exceeding the device’s rating. This situation is easily avoided; see the Hot-Plugging Safely section. Frequency Selection The LTM8023 uses a constant frequency PWM architecture that can be programmed to switch from 200kHz to 2.4MHz by using a resistor tied from the RT pin to ground. Table 2 provides a list of RT resistor values and their resultant frequencies. Table 2. Switching Frequency vs RT Value SWITCHING FREQUENCY (MHz) RT VALUE (kΩ) 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 187 124 88.7 69.8 56.2 46.4 39.2 34.6 29.4 23.7 19.6 15.8 13.3 11.5 9.76 8.66 Operating Frequency Trade-Offs It is recommended that the user apply the optimal RT value given in Table 1 for the input and output operating condition. System level or other considerations, however, may necessitate another operating frequency. While the LTM8023 is flexible enough to accommodate a wide range of operating frequencies, a haphazardly chosen one may result in undesirable operation under certain operating or fault conditions. A frequency that is too high can reduce efficiency, generate excessive heat or even damage the LTM8023 if the output is overloaded or short circuited. A frequency that is too low can result in a final design that has too much output ripple or too large of an output capacitor. The maximum frequency (and attendant RT value) at which the LTM8023 should be allowed to switch is given in Table 1 in the f(MAX) column, while the recommended frequency (and RT value) for optimal efficiency over the given input condition is given in the fOPTIMAL column. There are additional conditions that must be satisfied if the synchronization function is used. Please refer to the Synchronization section for details. BIAS Pin Considerations The BIAS pin is used to provide drive power for the internal power switching stage and operate internal circuitry. For proper operation, it must be powered by at least 2.8V. If the output voltage is programmed to be 2.8V or higher, simply tie BIAS to VOUT. If VOUT is less than 2.8V, BIAS can be tied to VIN or some other voltage source. In all cases, ensure that the maximum voltage at the BIAS pin is both less than 16V and the sum of VIN and BIAS is less than 56V. If BIAS power is applied from a remote or noisy voltage source, it may be necessary to apply a decoupling capacitor locally to the LTM8023. 8023fj For more information www.linear.com/LTM8023 11 LTM8023 APPLICATIONS INFORMATION Load Sharing Minimum Input Voltage Two or more LTM8023’s may be paralleled to produce higher currents. To do this, tie the VIN, ADJ, VOUT and SHARE pins of all the paralleled LTM8023’s together. To ensure that paralleled modules start up together, the RUN/ SS pins may be tied together, as well. If the RUN/SS pins are not tied together, make sure that the same valued softstart capacitors are used for each module. An example of two LTM8023 modules configured for load sharing is given in the Typical Applications section. The LTM8023 is a step-down converter, so a minimum amount of headroom is required to keep the output in regulation. In addition, the input voltage required to turn on is higher than that required to run, and depends upon whether the RUN/SS is used. As shown in Figure 2, it takes only about 3.5VIN for the LTM8023 to run a 3.3V output at light load. If RUN/SS is tied to VIN, a 5.5V input voltage is required to start. If VIN is allowed to settle in the operating region first then the RUN/SS pin is enabled, the minimum input voltage to start at light load is lower, about 4.2V. A similar curve for 5VOUT operation is also provided in Figure 2. For current sharing applications using multiple LTM8023s, the ADJ pins for all regulators may be combined using one resistor to ground as determined by: 6.0 394.21 N R ADJ = V OUT – 0.79 where N is the number of paralleled modules and RADJ is in kΩ. INPUT VOLTAGE (V) 5.5 Burst Mode Operation 4.5 RUN/SS ENABLED 4.0 3.5 Burst Mode operation is enabled by tying SYNC to GND. To disable Burst Mode operation, tie SYNC to a stable voltage above 0.7V or synchronize to an external clock. Do not leave the SYNC pin floating. VOUT = 3.3V TA = 25°C f = 650kHz TO RUN 3.0 500 1000 1500 LOAD CURRENT (mA) 0 2000 7.5 7.0 INPUT VOLTAGE (V) To enhance efficiency at light loads, the LTM8023 automatically switches to Burst Mode operation which keeps the output capacitor charged to the proper voltage while minimizing the input quiescent current. During Burst Mode operation, the LTM8023 delivers single cycle bursts of current to the output capacitor followed by sleep periods where the output power is delivered to the load by the output capacitor. In addition, VIN and BIAS quiescent currents are reduced to typically 25µA and 50µA respectively during the sleep time. As the load current decreases towards a no load condition, the percentage of time that the LTM8023 operates in sleep mode increases and the average input current is greatly reduced, resulting in higher efficiency. 12 TO START 5.0 6.5 TO START 6.0 RUN/SS ENABLED 5.5 5.0 VOUT = 5V TA = 25°C f = 650kHz TO RUN 0 500 1000 1500 2000 LOAD CURRENT (mA) 8023 F02 Figure 2. The LTM8023 Needs More Voltage to Start Than to Run 8023fj For more information www.linear.com/LTM8023 LTM8023 APPLICATIONS INFORMATION Soft-Start Shorted Input Protection The RUN/SS pin can be used to soft-start the LTM8023, reducing the maximum input current during start-up. The RUN/SS pin is driven through an external RC filter to create a voltage ramp at this pin. Figure 3 shows the start-up and shutdown waveforms with the soft-start circuit. By choosing an appropriate RC time constant, the peak start-up current can be reduced to the current that is required to regulate the output, with no overshoot. Choose the value of the resistor so that it can supply at least 20µA when the RUN/SS pin reaches 2.5V. Care needs to be taken in systems where the output will be held high when the input to the LTM8023 is absent. This may occur in battery charging applications or in battery backup systems where a battery or some other supply is diode OR-ed with the LTM8023’s output. If the VIN pin is allowed to float and the RUN/SS pin is held high (either by a logic signal or because it is tied to VIN), then the LTM8023’s internal circuitry will pull its quiescent current through its internal power switch. This is fine if your system can tolerate a few milliamps in this state. If you ground the RUN/SS pin, the internal power switch current will drop to essentially zero. However, if the VIN pin is grounded while the output is held high, then parasitic diodes inside the LTM8023 can pull large currents from the output through the VIN pin. Figure 4 shows a circuit that will run only when the input voltage is present and that protects against a shorted or reversed input. IL 1A/DIV RUN 15k RUN/SS 0.22µF VRUN/SS 2V/DIV GND VOUT 2V/DIV VIN VIN VOUT RUN/SS 2ms/DIV 8023 F03 AUX LTM8023 Figure 3. To Soft-Start the LTM8023, Add a Resistor and Capacitor to the RUN/SS Pin VOUT RT SYNC GND BIAS ADJ 8023 F04 Synchronization The internal oscillator of the LTM8023 can be synchronized by applying an external 250kHz to 2MHz clock to the SYNC pin. Do not leave this pin floating. The resistor tied from the RT pin to ground should be chosen such that the LTM8023 oscillates 20% lower than the intended synchronization frequency (see the Frequency Selection section). Figure 4. The Input Diode Prevents a Shorted Input from Discharging a Backup Battery Tied to the Output. It Also Protects the Circuit from a Reversed Input. The LTM8023 Runs Only When the Input is Present. The LTM8023 will not enter Burst Mode operation while synchronized to an external clock, but will instead skip pulses to maintain regulation. 8023fj For more information www.linear.com/LTM8023 13 LTM8023 APPLICATIONS INFORMATION PCB Layout Most of the headaches associated with PCB layout have been alleviated or even eliminated by the high level of integration of the LTM8023. The LTM8023 is nevertheless a switching power supply, and care must be taken to minimize EMI and ensure proper operation. Even with the high level of integration, you may fail to achieve specified operation with a haphazard or poor layout. See Figure 5 for a suggested layout. GND RT RADJ SHARE RUN/SS AUX BIAS COUT CIN VIN 8023 F05 Figure 5. Layout Showing Suggested External Components, GND Plane and Thermal Vias Ensure that the grounding and heatsinking are acceptable. A few rules to keep in mind are: 1.Place the RADJ and RT resistors as close as possible to their respective pins. 2.Place the CIN capacitor as close as possible to the VIN and GND connection of the LTM8023. 3.Place the COUT capacitor as close as possible to the VOUT and GND connection of the LTM8023. 14 5.Connect all of the GND connections to as large a copper pour or plane area as possible on the top layer. Avoid breaking the ground connection between the external components and the LTM8023. 6.Use vias to connect the GND copper area to the boards internal ground plane. Liberally distribute these GND vias to provide both a good ground connection and thermal path to the internal planes of the printed circuit board. Hot-Plugging Safely SYNC PGOOD VOUT 4.Place the CIN and COUT capacitors such that their ground current flow directly adjacent or underneath the LTM8023. The small size, robustness and low impedance of ceramic capacitors make them an attractive option for the input bypass capacitor of LTM8023. However, these capacitors can cause problems if the LTM8023 is plugged into a live supply (see Linear Technology Application Note 88 for a complete discussion). The low loss ceramic capacitor combined with stray inductance in series with the power source forms an underdamped tank circuit, and the voltage at the VIN pin of the LTM8023 can ring to twice the nominal input voltage, possibly exceeding the LTM8023’s rating and damaging the part. If the input supply is poorly controlled or the user will be plugging the LTM8023 into an energized supply, the input network should be designed to prevent this overshoot. Figure 6 shows the waveforms that result when an LTM8023 circuit is connected to a 24V supply through six feet of 24-gauge twisted pair. The first plot is the response with a 2.2µF ceramic capacitor at the input. The input voltage rings as high as 35V and the input current peaks at 20A. One method of damping the tank circuit is to add another capacitor with a series resistor to the circuit. In Figure 6c an aluminum electrolytic capacitor has been added. This capacitor’s high equivalent series resistance damps the circuit and eliminates the voltage overshoot. The extra capacitor improves low frequency 8023fj For more information www.linear.com/LTM8023 LTM8023 APPLICATIONS INFORMATION CLOSING SWITCH SIMULATES HOT PLUG IIN VIN + LOW IMPEDANCE ENERGIZED 24V SUPPLY DANGER RINGING VIN MAY EXCEED ABSOLUTE MAXIMUM RATING LTM8023 4.7µF IIN 10A/DIV STRAY INDUCTANCE DUE TO 6 FEET (2 METERS) OF TWISTED PAIR 0.7Ω + VIN 20V/DIV 0.1µF 20µs/DIV (6a) LTM8023 VIN 20V/DIV 4.7µF IIN 10A/DIV (6b) + 22µF 35V AI.EI. + LTM8023 20µs/DIV VIN 20V/DIV 4.7µF IIN 10A/DIV (6c) 20µs/DIV 8023 F06 Figure 6. A Well Chosen Input Network Prevents Input Voltage Overshoot and Ensures Reliable Operation When the LTM8023 is Connected to a Live Supply ripple filtering and can slightly improve the efficiency of the circuit, though it is likely to be the largest component in the circuit. An alternative solution is shown in Figure 6b. A 0.7Ω resistor is added in series with the input to eliminate the voltage overshoot (it also reduces the peak input current). A 0.1µF capacitor improves high frequency filtering. This solution is smaller and less expensive than the electrolytic capacitor. For high input voltages its impact on efficiency is minor, reducing efficiency less than one-half percent for a 5V output at full load operating from 24V. 8023fj For more information www.linear.com/LTM8023 15 LTM8023 APPLICATIONS INFORMATION Thermal Considerations The LTM8023 output current may need to be derated if it is required to operate in a high ambient temperature or deliver a large amount of continuous power. The amount of current derating is dependent upon the input voltage, output power and ambient temperature. The temperature rise curves given in the Typical Performance Characteristics section can be used as a guide. These curves were generated by an LTM8023 mounted to a 33cm2 4-layer FR4 printed circuit board. Boards of other sizes and layer count can exhibit different thermal behavior, so it is incumbent upon the user to verify proper operation over the intended system’s line, load and environmental operating conditions. The thermal resistance numbers listed in the Pin Configuration are based on modeling the µModule package mounted on a test board specified per JESD51-9 “Test Boards for Area Array Surface Mount Package Thermal Measurements.” The thermal coefficients provided in this page are based on JESD 51-12 “Guidelines for Reporting and Using Electronic Package Thermal Information.” For increased accuracy and fidelity to the actual application, many designers use FEA to predict thermal performance. To that end, the Pin Configuration typically gives four thermal coefficients: • θJA – Thermal resistance from junction to ambient. • θJCbottom – Thermal resistance from junction to the bottom of the product case. • θJCtop – Thermal resistance from junction to top of the product case. • θJB – Thermal resistance from junction to the printed circuit board. While the meaning of each of these coefficients may seem to be intuitive, JEDEC has defined each to avoid confusion and inconsistency. These definitions are given in JESD 51-12, and are quoted or paraphrased in the following: • θJA is the natural convection junction-to-ambient air thermal resistance measured in a one cubic foot sealed enclosure. This environment is sometimes referred to as 16 “still air” although natural convection causes the air to move. This value is determined with the part mounted to a JESD 51-9 defined test board, which does not reflect an actual application or viable operating condition. • θJCbottom is the junction-to-board thermal resistance with all of the component power dissipation flowing through the bottom of the package. In the typical µModule regulator, the bulk of the heat flows out the bottom of the package, but there is always heat flow out into the ambient environment. As a result, this thermal resistance value may be useful for comparing packages but the test conditions don’t generally match the user’s application. • θJCtop is determined with nearly all of the component power dissipation flowing through the top of the package. As the electrical connections of the typical µModule regulator are on the bottom of the package, it is rare for an application to operate such that most of the heat flows from the junction to the top of the part. As in the case of θJCbottom, this value may be useful for comparing packages but the test conditions don’t generally match the user’s application. • θJB is the junction-to-board thermal resistance where almost all of the heat flows through the bottom of the µModule regulator and into the board, and is really the sum of the θJCbottom and the thermal resistance of the bottom of the part through the solder joints and through a portion of the board. The board temperature is measured a specified distance from the package, using a two sided, two layer board. This board is described in JESD 51-9. The most appropriate way to use the coefficients is when running a detailed thermal analysis, such as FEA, which considers all of the thermal resistances simultaneously. None of them can be individually used to accurately predict the thermal performance of the product, so it would be inappropriate to attempt to use any one coefficient to correlate to the junction temperature versus load graphs given in the LTM8023 data sheet. 8023fj For more information www.linear.com/LTM8023 LTM8023 APPLICATIONS INFORMATION A graphical representation of these thermal resistances is given in Figure 7. The blue resistances are contained within the µModule regulator, and the green are outside. The die temperature of the LTM8023 must be lower than the maximum rating of 125°C, so care should be taken in the layout of the circuit to ensure good heat sinking of the LTM8023. The bulk of the heat flow out of the LTM8023 is through the bottom of the module and the LGA pads into the printed circuit board. Consequently a poor printed circuit board design can cause excessive heating, resulting in impaired performance or reliability. Please refer to the PCB Layout section for printed circuit board design suggestions. Finally, be aware that at high ambient temperatures the internal Schottky diode will have significant leakage current increasing the quiescent current of the LTM8023. JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD) JUNCTION-TO-CASE (TOP) RESISTANCE JUNCTION CASE (TOP)-TO-AMBIENT RESISTANCE JUNCTION-TO-BOARD RESISTANCE JUNCTION-TO-CASE CASE (BOTTOM)-TO-BOARD (BOTTOM) RESISTANCE RESISTANCE At BOARD-TO-AMBIENT RESISTANCE 8023 F07 µMODULE REGULATOR Figure 7 8023fj For more information www.linear.com/LTM8023 17 LTM8023 TYPICAL APPLICATIONS 0.82V Step-Down Converter VIN* 3.6V TO 15V VIN 1.8V Step-Down Converter VOUT BIAS 10µF 200µF RUN/SS VOUT 0.82V 2A VIN* 3.6V TO 15V VIN VOUT BIAS 4.7µF 100µF RUN/SS AUX AUX LTM8023 LTM8023 SHARE PGOOD SHARE PGOOD ADJ ADJ RT GND SYNC RT GND SYNC 8023 TA02 105k 8023 TA03 13M 79k *RUNNING VOLTAGE RANGE. PLEASE REFER TO APPLICATIONS INFORMATION FOR START-UP DETAILS VIN 2.2µF 5V Step-Down Converter VOUT 47µF RUN/SS SHARE VOUT 2.5V 2A VIN* 7.5V TO 36VDC BIAS VOUT RUN/SS BIAS 10µF VOUT 5V 2A AUX LTM8023 PGOOD SHARE ADJ PGOOD ADJ RT GND SYNC RT GND SYNC 8023 TA04 61.9k VIN AUX 2.2µF LTM8023 3.3V 383k *RUNNING VOLTAGE RANGE. PLEASE REFER TO APPLICATIONS INFORMATION FOR START-UP DETAILS 2.5V Step-Down Converter VIN* 4.5V TO 36VDC VOUT 1.8V 2A 8023 TA05 226k 49.9k *RUNNING VOLTAGE RANGE. PLEASE REFER TO APPLICATIONS INFORMATION FOR START-UP DETAILS 93.1k *RUNNING VOLTAGE RANGE. PLEASE REFER TO APPLICATIONS INFORMATION FOR START-UP DETAILS VIN* 5.5V TO 36V VIN VOUT RUN/SS BIAS VOUT 3.3V 2A AUX LTM8023 2.2µF 22µF SHARE PGOOD ADJ RT GND SYNC 8023 TA07 49.9k 154k *RUNNING VOLTAGE RANGE. PLEASE REFER TO APPLICATIONS INFORMATION FOR START-UP DETAILS 18 8023fj For more information www.linear.com/LTM8023 LTM8023 TYPICAL APPLICATIONS –5V Positive to Negative Converter VIN* 7V TO 31V VIN –5V Positive to Negative Converter Load Current vs Input Voltage VOUT 2500 AUX RUN/SS BIAS LOAD CURRENT (mA) 2000 LTM8023 SHARE 2.2µF PGOOD 10µF ADJ RT 1500 1000 500 GND SYNC 8023 TA06 39.2k 93.1k 0 –5V *RUNNING VOLTAGE RANGE. PLEASE REFER TO APPLICATIONS INFORMATION FOR START-UP DETAILS 0 10 20 30 INPUT VOLTAGE (V) 40 8023 TA06b Two LTM8023’s in Parallel, 3.3V at 4A VIN* 6.5V TO 36V VIN VOUT RUN/SS BIAS AUX VOUT 3.3V 4A LTM8023 SHARE PGOOD ADJ 2.2µF RT SYNC GND 49.9k 76.8k VIN VOUT RUN/SS BIAS AUX 2.2k 47µF LTM8023 SHARE 2.2µF PGOOD ADJ 0.22µF RT SYNC GND 8023 TA08 49.9k *RUNNING VOLTAGE RANGE. PLEASE REFER TO APPLICATIONS INFORMATION FOR START-UP DETAILS 8023fj For more information www.linear.com/LTM8023 19 For more information www.linear.com/LTM8023 0.000 3.810 2.540 1.270 0.3175 0.3175 1.270 2.540 0.000 SUGGESTED PCB LAYOUT TOP VIEW 1.905 PACKAGE TOP VIEW 0.635 3.175 aaa Z 3.810 4 0.635 0.9525 0.635 0.3175 PAD 1 CORNER 11.25 BSC 1.905 X 9.00 BSC Y DETAIL A PACKAGE SIDE VIEW 2.45 – 2.55 DETAIL A MOLD CAP 0.27 – 0.37 SUBSTRATE DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR A MARKED FEATURE 7 PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY SYMBOL TOLERANCE aaa 0.15 bbb 0.10 ! 6. THE TOTAL NUMBER OF PADS: 50 5. PRIMARY DATUM -Z- IS SEATING PLANE LAND DESIGNATION PER JESD MO-222, SPP-010 AND SPP-020 4 3 TRAY PIN 1 BEVEL PADS SEE NOTES 1.27 BSC 0.605 – 0.665 7.62 BSC 3 2. ALL DIMENSIONS ARE IN MILLIMETERS NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 aaa Z 2.72 – 2.92 (Reference LTC DWG # 05-08-1804 Rev C) bbb Z 20 Z LGA Package 50-Lead (11.25mm × 9.00mm × 2.82mm) H G E D C B A LGA 50 0113 REV C PACKAGE IN TRAY LOADING ORIENTATION LTMXXXXXX µModule PACKAGE BOTTOM VIEW F 8.89 BSC 0.605 – 0.665 1 2 3 4 5 6 7 C(0.30) PAD 1 7 SEE NOTES LTM8023 PACKAGE DESCRIPTION Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. 8023fj 4.445 3.175 4.445 0.630 ±0.025 Ø 50x SUGGESTED PCB LAYOUT TOP VIEW 2.540 PACKAGE TOP VIEW 1.270 4 0.3175 0.000 0.3175 PIN “A1” CORNER E 1.270 aaa Z 2.540 Y For more information www.linear.com/LTM8023 4.445 3.175 1.905 0.635 0.000 0.635 1.905 3.175 4.445 D X 4.76 4.13 aaa Z NOM 3.42 0.60 2.82 0.78 0.63 11.25 9.0 1.27 8.89 7.62 0.32 2.50 DIMENSIONS b1 A A2 MAX 3.62 0.70 2.92 0.85 0.66 NOTES DETAIL B PACKAGE SIDE VIEW 0.37 2.55 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 50 0.27 2.45 MIN 3.22 0.50 2.72 0.71 0.60 DETAIL A SYMBOL A A1 A2 b b1 D E e F G H1 H2 aaa bbb ccc ddd eee H1 SUBSTRATE A1 ddd M Z X Y eee M Z DETAIL B H2 MOLD CAP ccc Z Z 3.810 3.810 Z (Reference LTC DWG # 05-08-1883 Rev A) Øb (50 PLACES) // bbb Z BGA Package 50-Lead (11.25mm × 9.00mm × 3.42mm) F e 7 5 4 3 2 PACKAGE BOTTOM VIEW 6 1 DETAIL A H G F E D C B A PIN 1 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 4 TRAY PIN 1 BEVEL COMPONENT PIN “A1” 7 ! BGA 50 1212 REV A PACKAGE IN TRAY LOADING ORIENTATION LTMXXXXXX µModule PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY 6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu OR Sn Pb EUTECTIC 5. PRIMARY DATUM -Z- IS SEATING PLANE BALL DESIGNATION PER JESD MS-028 AND JEP95 3 2. ALL DIMENSIONS ARE IN MILLIMETERS 7 SEE NOTES NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 b 3 SEE NOTES G LTM8023 PACKAGE DESCRIPTION Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. 8023fj 21 LTM8023 PACKAGE DESCRIPTION Table 3. Pin Assignment (Sorted by Pin Number) PIN 22 SIGNAL DESCRIPTION PIN SIGNAL DESCRIPTION A1 VOUT D5 GND A2 VOUT D6 GND A3 VOUT D7 GND A4 VOUT E1 GND A5 GND E2 GND A6 GND E3 GND A7 GND E4 GND B1 VOUT E5 GND B2 VOUT E6 GND B3 VOUT E7 GND B4 VOUT F5 AUX B5 GND F6 GND B6 GND F7 SHARE B7 GND G1 VIN C1 VOUT G2 VIN C2 VOUT G3 VIN C3 VOUT G5 BIAS C4 VOUT G6 SYNC C5 GND G7 RT C6 GND H1 VIN C7 GND H2 VIN D1 GND H3 VIN D2 GND H5 RUN/SS D3 GND H6 PGOOD D4 GND H7 ADJ 8023fj For more information www.linear.com/LTM8023 LTM8023 REVISION HISTORY (Revision history begins at Rev F) REV DATE DESCRIPTION PAGE NUMBER F 8/10 Added Note 5 3 G 8/11 Added BGA package. Changes reflected throughout the data sheet. H 8/13 Changed output capacitor from 2.2µF to 22µF I 2/14 Added SnPb BGA package option J 8/15 Updated thermal impedance values 1 to 24 1 1, 2 2 8023fj Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. For more information www.linear.com/LTM8023 23 LTM8023 PACKAGE PHOTOGRAPHS LGA BGA RELATED PARTS PART NUMBER DESCRIPTION COMMENTS LTM8022 36V, 1A Step-Down µModule Regulator 0.8V ≤ VOUT ≤ 10V, Synchronizable, 9mm × 11.25mm × 2.8mm LGA LTM8025 36V, 3A Step-Down µModule Regulator 0.8V ≤ VOUT ≤ 24V, Synchronizable, 9mm × 15mm × 4.3mm LGA LTM8027 60V, 4A Step-Down µModule Regulator 2.5V ≤ VOUT ≤ 24V, Synchronizable, 15mm × 15mm × 4.3mm LGA LTM4612 EN55022B Certified 36V, 5A Step-Down µModule Regulator 3.3V ≤ VOUT ≤ 15V, Synchronizable, 15mm × 15mm × 2.8mm LGA LTM4613 EN55022B Certified 36V, 8A Step-Down µModule Regulator 3.3V ≤ VOUT ≤ 15V, Synchronizable, 15mm × 15mm × 4.3mm LGA LTM8061 32V, 2A Li-Ion/Li-Polymer µModule Battery Charger C/10 or Timer Termination, Auto-Recharge, Programmable Charge Current, 9mm × 15mm × 4.3mm LGA 24 Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 For more information www.linear.com/LTM8023 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com/LTM8023 8023fj LT 0815 REV J • PRINTED IN USA LINEAR TECHNOLOGY CORPORATION 2007