Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink evaluation kit. BGA Sizes (mm) Heat Sink Footprint (mm) Heat Sink Height (inches) Recommended Series # Attachment Method 17 19 21 21 23 23 25 27 29 31 31 33 35 35 35 37.5 37.5 45.7 x 35.5 40 37.5 40 40 42.5 45 45 47.5 50 50 50 50 50 up to 45 up to 45 17 x 17 19 x 19 21 x 21 21 x 21 22 x 22 22 x 22 25 x 25 28 x 28 30 x 30 31 x 28 31 x 31 32 x 32 35 x 35 35 x 35 35 x 35 37 x 37 37 x 37 37 x 47 38 x 38 38 x 38 40 x 28 40 x 40 41 x 41 43 x 43 43 x 43 47 x 47 50 x 50 51 x 51 52 x 51 53 x 47 64 x 51 73 x 50 73 x 50 .40 1.00 .40 .25 .35 .45 .60 .40 .60 .75 .25 .35 .45 .60 .25 .35 .45 .60 .77 .65 .80 .35 .40 .65 .25 .35 .45 .60 .25 .35 .45 .60 .50 .65 .80 .30 .50 1.00 .29 .35 .26 .53 .41 .20 .25 .35 .45 .60 .15 .80 .40 .65 .80 1.00 .20 1.00 .80 .40 .65 .80 1.00 .24 .50 1.00 .95 D10650 602 D10850 624 604 605 625 658 606 607 611 610 612 642 630 613 659 617 614 660 643 655 615 628 662 616 698 618 622 798 620 609 619 Adhesive Adhesive Adhesive Adhesive Adhesive Adhesive Adhesive Adhesive Adhesive Adhesive Adhesive Adhesive Adhesive Adhesive Adhesive Adhesive Adhesive Adhesive Adhesive Adhesive Clip Adhesive Adhesive Adhesive Adhesive Adhesive Adhesive Adhesive Adhesive Adhesive Adhesive Clip Clip RoHS COMPLIANCE Please note that Wakefield part numbers designated with an “E” in this catalog denote new parts in compliance with the RoHS initiative, with the exception of our Precision Clamps. Wakefield will still continue to offer non-RoHS compliant versions of these parts. Please be aware that many Wakefield Standard parts have always been compliant since their design inception and therefore will not carry the “E” designation. Wakefield requests that you refer to the RoHS compliance tool on our website at www.wakefield.com to verify RoHS compliance. If you require further clarification or information regarding RoHS, please contact the factory. 2 Thermal Interface THERMAL INTERFACE MATERIAL PART NUMBER GUIDE All of the heat sinks shown in this catalog are available with any of the following thermal tape and interface materials, pre-applied at the factory. Use the “T” series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide a good thermal link to the heat sink. The “S” series interface materials have adhesives on only one side, for pre-attachment to the heat sink, and provide superior thermal performance. Specify these materials in applications where the heat sink will be fixed to the electronic package by some mechanical means other than a tape. Please note that none of these materials are for use in applications requiring electrical isolation from the electronic device. All options other than -T1 and -T4 are RoHS compliant. Note: To obtain the estimated thermal resistance of the interface material in your application, divide the thermal impedance value by the area of the pad in square inches. For example, a 2” x 2” piece of T4 has a resistance of 1.10 C-in^2/W 4 in^2=0.275 C/W “T” SERIES THERMALLY ENHANCED PRESSURE SENSITIVE ADHESIVES Suffix Manufacturer Product Thermal Impedance C-in^2/W Thickness, Inches Package Surface, Comments -T1 Chomerics, T405 0.47 0.006 Metal/ceramic; aluminum carrier -T1E Chomerics, T405R 0.47 0.006 RoHS-compliant version of -T1 -T3 Chomerics, T412 0.25 0.009 Metal/ceramic; very good performance and conformity -T4 Chomerics, T410 1.10 0.007 Plastic -T4E Chomerics, T410R 1.10 0.007 RoHS-compliant version of -T4 -T5 Chomerics, T411 1.00 0.011 Plastic; conforms to out-of-flat packages -T6 3M, 8810 0.88 0.010 Metal/ceramic; very good adhesion and conformity -T7 Bergquist, BP 108 1.28 0.008 Metal/ceramic; electrically insulating Package Surface, Comments “S” SERIES THERMAL INTERFACE PADS Suffix Manufacturer Product Thermal Impedance C-in^2/W Thickness, Inches -S4 Berquist Softface 0.06 0.005 All surfaces; requires mechanical fasteners ORDERING INFORMATION Once you have chosen heat sink and thermal interface material that meets your thermal & mechanical requirements it is easy to designate the part number. Simply add the interface material suffix referenced on the chart above to the base part number for the heat sink. The base part number already includes information regarding its size and finish. Example: To order the 658 Series heat sink at .350” tall with the T5 thermal interface material, specify part number: 658-35AB - T5 From Catalog Page ?? From Table on Page ?? 3 Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 624 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Standard P/N Base Dimensions in. Sq. Fin Height “A” in. (mm) Typical Applications Weight lbs. (grams) 624-25AB 624-35AB 624-45AB 624-60AB .827 (21) .827 (21) .827 (21) .827 (21) .250 (6.4) .350 (8.9) .450 (11.4) .600 (15.2) 21mm BGA 21mm BGA 21mm BGA 21mm BGA .009 (4.09) .011 (4.99) .015 (6.81) .026 (11.80) Material: Aluminum, Black Anodized PRODUCT FEATURES The 624 Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. • Available in four standard heights, .25 inch, .35 inch, .45 inch, and .60 inch. • Available with pressure sensitive adhesives for quick and easy mounting. See Page 3 Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS). 624 SERIES MECHANICAL DIMENSIONS Case-to-Ambient Thermal Resistance, C/W 624 THERMAL PERFORMANCE 30 624-25-T4 624-35-T4 25 624-45-T4 624-60-T4 20 15 10 5 0 200 300 400 500 600 Approach Velocity, LFM Dimensions: in. 625 SERIES Standard P/N Omnidirectional Pin Fin Heat Sink for BGAs Base Dimensions in. Sq. 625-25AB .984 (25) 625-35AB .984 (25) 625-45AB .984 (25) 625-60AB .984 (25) Material: Aluminum, Black Anodized Fin Height “A” in. (mm) Typical Applications Weight lbs. (grams) 0.250 (6.4) 0.350 (8.9) 0.450 (11.4) 0.600 (15.2) 25 mm BGA 25 mm BGA 25 mm BGA 25 mm BGA .012 (5.45) .014 (6.36) .018 (8.17) .030 (13.62) PRODUCT FEATURES The 625 Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. • Available in four standard heights, .25 inch, .35 inch, .45 inch, and .60 inch. • Available with pressure sensitive adhesives for quick and easy mounting. See Page 3 Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS). MECHANICAL DIMENSIONS 625 SERIES Case-to-Ambient Thermal Resistance, C/W 625 THERMAL PERFORMANCE 20 18 625-25-T4 16 625-45-T4 625-25-T4 625-60-T4 14 12 10 8 6 4 2 0 200 300 400 500 600 Approach Velocity, LFM Dimensions: in. 4 Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 659 SERIES Standard P/N Unidirectional Fin Heat Sink for BGAs Base Dimensions in. (mm) Height in. (mm) 659-65AB 1.45 (36.8) sq 0.650 (16.5) Notes: 1. Optional factory preapplied pressure-sensitive adhesive. See Page 3 Typical Application Heat Sink Finish Weight lbs. (grams) 37mm BGA Black Anodized 0.050 (22.68) NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS Dimensions: in. (mm) 655 SERIES Standard P/N Omnidirectional Pin Fin Heat Sink for BGAs and PowerPC™ Base Dimensions in. (mm) Dimension “A” in. (mm) Dimension “B” in. (mm) 655-26AB 1.600 (40.6) sq 0.260 (6.6) 0.125 (3.2) 655-53AB 1.600 (40.6) sq 0.525 (13.3) 0.145 (3.7) Notes: 1. Optional factory preapplied pressure-sensitive adhesive. See Page 3 Typical Applications Heat Sink Finish Weight lbs. (grams) 40mm BGA 40mm BGA Black Anodized Black Anodized 0.038 (17.01) 0.050 (22.68) NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS Dimensions: in. (mm) 658 SERIES Standard P/N Omnidirectional Pin Fin Heat Sink for BGAs and PowerPC™ Base Dimensions in. (mm) Dimension “A” in. (mm) 658-25AB 1.100 (27.9) sq 0.250 (6.4) 658-35AB 1.100 (27.9) sq 0.350 (8.9) 658-45AB 1.100 (27.9) sq 0.450 (11.4) 658-60AB 1.100 (27.9) sq 0.600 (15.2) Notes: 1. Optional factory preapplied pressure-sensitive adhesive. See Page 3 Typical Applications Heat Sink Finish Weight lbs. (grams) 27mm BGA 27mm BGA 27mm BGA 27mm BGA Black Anodized Black Anodized Black Anodized Black Anodized 0.013 (5.67) 0.015 (6.70) 0.019 (8.50) 0.031 (14.17) NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS Dimensions: in. (mm) KEY: 658-25AB +658-35AB 658-45AB 658-60AB 5 Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 660 SERIES Standard P/N Unidirectional Fin Heat Sink for BGAs Base Dimensions in. (mm) Height in. (mm) 660-29AB 1.530SQ. (38.9)SQ. 0.285 (7.2) Notes: 1. Optional factory preapplied pressure-sensitive adhesive. See Page 3 Typical Application Heat Sink Finish Weight lbs. (grams) 37mm BGA Black Anodized 0.031 (14.17) MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) 642 SERIES Standard P/N Unidirectional Fin Heat Sink for BGAs Base Dimensions in. Sq. Fin Height "A" in. (mm) Typical Applications Weight lbs. (grams) .250 (6.4) .350 (8.9) .450 (11.4) .600 (15.2) 35 mm BGA 35 mm BGA 35 mm BGA 35 mm BGA .022 (9.99) .027 (12.26) .031 (14.07) .039 (17.71) 642-25AB 1.378 (35) 642-35AB 1.378 (35) 642-45AB 1.378 (35) 642-60AB 1.378 (35) Material: Aluminum, Black Anodized PRODUCT FEATURES The 642 Series is an unidirectional pin fin heat sink for both natural and forced-convection applications. • Available in four standard heights, .25 inch, .35 inch, .45 inch, and .60 inch. • Available with pressure sensitive adhesives for quick and easy mounting. See Page 3 Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS). MECHANICAL DIMENSIONS 642 SERIES Case-to-Ambient Thermal Resistance, C/W 642 THERMAL PERFORMANCE 14 642-25-T4 642-35-T4 12 642-45-T4 642-60-T4 10 8 6 4 2 0 200 300 400 500 Approach Velocity, LFM Performance shown is with T4 thermal adhesive applied. Dimensions: in. (mm) 6 600 Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 662 SERIES Standard P/N Omnidirectional Pin Fin Heat Sink for Limited Height BGAs Base Dimensions in. (mm) Height in. (mm) 662-15AG 1.713 (43.5) sq 0.150 (3.8) 662-15AB 1.713 (43.5) sq 0.150 (3.8) Notes: 1. Optional factory preapplied pressure-sensitive adhesive. See Page 3 Typical Applications Heat Sink Finish Weight lbs. (grams) 45mm BGA 45mm BGA Gold Iridite Black Anodized 0.019 (8.50) 0.019 (8.50) MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) 628 SERIES Standard P/N Omnidirectional Pin Fin Heat Sink for BGAs Base Dimensions in. (mm) Dimensions “A” in. (mm) Typical Applications Heat Sink Finish Weight lbs. (grams) 628-20AB 1.750 (44.5) x 1.700 (43.2) 0.200 (5.1) 628-25AB 1.750 (44.5) x 1.700 (43.2) 0.250 (6.4) 628-35AB 1.750 (44.5) x 1.700 (43.2) 0.350 (8.9) 628-40AB 1.750 (44.5) x 1.700 (43.2) 0.400 (10.2) 628-65AB 1.750 (44.5) x 1.700 (43.2) 0.650 (16.5) Notes: 1. Optional factory preapplied pressure-sensitive adhesive. See Page 3 45mm BGA 45mm BGA 45mm BGA 45mm BGA 45mm BGA Black Anodized Black Anodized Black Anodized Black Anodized Black Anodized 0.031 (14.17) 0.038 (17.01) 0.044 (19.84) 0.050 (22.68) 0.056 (25.51) NATURAL CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) KEY: 628-20AB 628-25AB 628-35AB 628-40AB 628-65AB 7 Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 630 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Standard P/N Base Dimensions in. Sq. Fin Height “A” in. (mm) Typical Applications Weight lbs. (grams) 630-25AB 630-35AB 630-45AB 630-60AB 1.378 (35) 1.378 (35) 1.378 (35) 1.378 (35) .250 (6.4) .350 (8.9) .450 (11.4) .600 (15.2) 35mm BGA 35mm BGA 35mm BGA 35mm BGA .009 (4.09) .011 (4.99) .015 (6.81) .026 (11.80) Material: Aluminum, Black Anodized The 630 Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS). MECHANICAL DIMENSIONS PRODUCT FEATURES • Available in four standard heights, .25 inch, .35 inch, .45 inch, and .60 inch. • Available with pressure sensitive adhesives for quick and easy mounting. See Page 3 630 SERIES 630 THERMAL PERFORMANCE Dimensions: in. HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 698 SERIES Standard P/N 698-40AB 698-65AB 698-80AB 698-100AB Omnidirectional Pin Fin Heat Sink For BGAs Base Dimensions in. (mm) Dimensions “A” in. (mm) Typical Applications Heat Sink Finish Weight lbs. (grams) 2.100 (53.3) sq. 2.100 (53.3) sq. 2.100 (53.3) sq. 2.100 (53.3) sq. 0.400 (10.2) sq. 0.650 (16.5) sq. 0.800 (20.3) sq. 1.000 (25.4) sq. 45mm BGA 45mm BGA 45mm BGA 45mm BGA Black Anodized Black Anodized Black Anodized Black Anodized 0.075 (34.02) 0.119 (53.86) 0.125 (56.70) 0.144 (65.20) Notes: 1. Optional factory preapplied pressure-sensitive adhesive. See Page 3 MECHANICAL DIMENSIONS Dimensions: in. (mm) 8 FORCED CONVECTION THERMAL PERFORMANCE DATA (FLOW PARALLEL TO EXTRUSION DIRECTION) KEY: 698-40AB 698-65AB 698-80AB 698-100AB Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 798 SERIES Standard P/N 798-40AB 798-65AB 798-80AB 798-100AB Pin Fin Heat Sink for BGAs Base Dimensions in. (mm) Dimensions “A” in. (mm) Typical Applications Heat Sink Finish Weight lbs. (grams) 2.100 (53.3) x 1.860 (47.2) 2.100 (53.3) x 1.860 (47.2) 2.100 (53.3) x 1.860 (47.2) 2.100 (53.3) x 1.860 (47.2) 0.400 (10.2) 0.650 (16.5) 0.800 (20.3) 1.000 (25.4) 45mm BGA 45mm BGA 45mm BGA 45mm BGA Black Anodized Black Anodized Black Anodized Black Anodized 0.063 (28.35) 0.106 (48.19) 0.113 (51.03) 0.131 (59.53) MECHANICAL DIMENSIONS FORCED CONVECTION THERMAL PERFORMANCE DATA (FLOW PARALLEL TO EXTRUSION DIRECTION) 798-40AB KEY: 798-65AB 798-80AB 798-100AB Notes: 1 . Heat sink mounting surface flatness: 0.004" TIR 2. Optional factory preapplied pressure-sensitive adhesive. See Page 3 Dimensions: in. (mm) 643 SERIES Standard P/N Omnidirectional Pin Fin Heat Sink for BGAs Base Dimensions in. (mm) 643-35AP 1.60 (40.64) x 1.10 (27.94) Material: Aluminum, Plain Finish Fin Height in. (mm) Typical Applications Weight lbs. (grams) 0.350 (8.89) 40 mm BGA .070 (31.78) The Series 643-35AP is an omnidirectional pin fin heat sink for both natural and forced-convection applications designed to fit a 40 mm BGA. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS). PRODUCT FEATURES • Available with pressure sensitive adhesives to ensure good thermal performance. See page 3 • Can be ordered with the 829SC clip. Order clip separately. (Clip cannot be purchased without heat sink) MECHANICAL DIMENSIONS 643 THERMAL PERFORMANCE Case-to-Ambient Thermal Resistance, C/W 643-35AP SERIES 10 9 8 7 6 5 4 3 2 1 0 0 100 200 300 400 500 600 700 Approach Air Velocity, LFM Performance shown is with S5 interface material applied. Dimensions: in. 9 Integrated Circuit Heat Sinks DELTEM™ COMPOSITE HEAT SINKS FOR BGAs Deltem™ D10650-40 Pin Fin Heat Sink Standard P/N Base Dimensions in. (mm) Height in. (mm) Weight lbs. (grams) D10650-40 0.650 (16.5) sq 0.400 (10.2) Notes: Available with pressure sensitive adhesives for quick and easy mounting. See Page 3 Deltem™ D10850-40 Standard P/N 0.004 (1.91) Pin Fin Heat Sink Base Dimensions in. (mm) Height in. (mm) D10850-40 0.850 (21.6) sq 0.400 (10.2) Notes: Available with pressure sensitive adhesives for quick and easy mounting. See Page 3 Typical Applications Weight lbs. (grams) 21mm BGA 0.006 (3.9) MECHANICAL DIMENSIONS DELTEM™ D10650-40 PIN FIN HEAT SINK DELTEM™ D10850-40 PIN FIN HEAT SINK NATURAL AND FORCED CONVECTION CHARACTERISTICS NATURAL AND FORCED CONVECTION CHARACTERISTICS AIR VELOCITY (LFM) 600 1000 0 100 30 80 25 20 60 15 40 10 20 5 0 0 0 0.25 0.50 0.75 HEAT DISSIPATED (WATTS) Dimensions: in. (mm) 10 AIR VELOCITY (LFM) 800 1.00 1.25 200 400 600 800 1000 16 100 14 80 12 10 60 8 40 6 4 20 2 0 0 0 0.25 0.50 0.75 HEAT DISSIPATED (WATTS) 1.00 1.25 THERMAL RESISTANCE SINK TO AMBIENT (C) 400 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 200 THERMAL RESISTANCE SINK TO AMBIENT (C) HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 0 Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 609 SERIES Standard P/N Pin Fin Heat Sink/Clip Assembly for BGAs and PowerPC™ Packages Base Dimensions in. (mm) Dimensions “A” in. (mm) 609-50AB 2.895 (73.5) x 2.000 (50.8) 0.500 (12.7) 609-100AB 2.808 (71.32) x 1.700 (43.2) 1.00 (25.4) Note: Optional factory preapplied thermal interface material. S3 (Bergquist Q-Pad 3, 0.14 °C in2/w) S4 (Bergquist Softface, 0.07 °C in2/w) Typical Applications Heat Sink Finish Weight lbs. (grams) 40&45mm BGA 40&45mm BGA Black Anodized Black Anodized 0.094 (42.5) 0.130 (59.0) THERMAL RESISTANCE SINK TO AMBIENT (°C/WATT) MECHANICAL DIMENSIONS 2.808 FORCED CONVECTION THERMAL PERFORMANCE DATA (FLOW PARALLEL TO EXTRUSION DIRECTION) 5 4 * 609-100AB 2 1 0 100 200 300 AIR VELOCITY (LFM) 400 500 *Performance is for shrouded conditions. 609-100 will perform better than 609-50 in cases with bypass. “A” DIM. (609-50AB) 609-50AB 3 (609-100AB) Dimensions: in. (mm) 609-50AB HEAT SINK AND CLIP ASSEMBLY Designed to fit a .063” thick PCB electronic package thickness of .110” 619 SERIES Standard P/N Fan Heat Sink for BGA and PowerPC™ Packages Base Dimensions in. (mm) Height in. (mm) Typical Applications 61995AB124D1 2.871 (72.92) x 1.98 (50.29) 0.953 (24.21) 40&45mm BGA 61995AB054D1 2.871 (72.92) x 1.98 (50.29) 0.953 (24.21) 40&45mm BGA Note: Optional factory preapplied thermal interface material. See 609 series. Heat Sink Finish Thermal Performance Weight lbs. (grams) Black Anodized Black Anodized 1.2° C/W 1.2° C/W .150 (68.10) .150 (68.10) FEATURES AND BENEFITS: • Captivated clips for ease of assembly • Low acoustic noise • Impingement air flow • Accommodates BGA packages up to 45 mm in size MECHANICAL DIMENSIONS Dimensions: in. See 609 Series for PCB hole layout for clip attachment 11 Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 602 SERIES Standard P/N 602-100AP Unidirectional Fin Heat Sink for BGAs Base Dimensions in. (mm) .750 (19.1) sq Height in. (mm) 1.000 (25.4) Heat Sink Finish Plain Weight lbs. (grams) .021 (9.59) Material: Aluminum, Plain Finish MECHANICAL DIMENSIONS THERMAL RESISTANCE SINK TO AMBIENT (C) 602 THERMAL PERFORMANCE 7 6 5 4 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) 604 SERIES Standard P/N 604-40AB 604-60AB Omnidirectional Pin Fin Heat Sink for BGAs Base Dimensions in. (mm) .850 (21.6) sq .850 (21.6) sq Height in. (mm) .400 (10.2) .600 (15.2) Heat Sink Finish Black Anodized Black Anodized Weight lbs. (grams) .012 (5.60) .016 (7.47) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 604 THERMAL PERFORMANCE THERMAL RESISTANCE SINK TO AMBIENT (C) 14 12 604-40AB 10 8 6 4 604-60AB 2 0 100 200 300 400 500 AIR VELOCITY (LFM) 12 600 700 Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 605 SERIES Standard P/N 605-75AB Unidirectional Fin Heat Sink for BGAs Base Dimensions in. (mm) .880 (22.4) sq Height in. (mm) .750 (19.1) Heat Sink Finish Black Anodized Weight lbs. (grams) .030 (13.5) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS THERMAL RESISTANCE SINK TO AMBIENT (C) 605 THERMAL PERFORMANCE 8 7 6 5 4 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) 606 SERIES Standard P/N 606-77AB Unidirectional Fin Heat Sink for BGAs Base Dimensions in. (mm) 1.185 (30.1) sq Height in. (mm) .767 (19.5) Heat Sink Finish Black Anodized Weight lbs. (grams) .041 (18.7) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS THERMAL RESISTANCE SINK TO AMBIENT (C) 606 THERMAL PERFORMANCE 7 6 5 4 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) 13 Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 607 SERIES Standard P/N 607-65AB Unidirectional Fin Heat Sink for BGAs Base Dimensions in. (mm) 1.200 (30.5) x 1.105 (28.1) Height in. (mm) .650 (16.5) Heat Sink Finish Black Anodized Weight lbs. (grams) .041 (18.7) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS THERMAL RESISTANCE SINK TO AMBIENT (C) 607 THERMAL PERFORMANCE 7 6 5 4 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) 610 SERIES Standard P/N 610-35AB 610-40AB Omnidirectional Pin Fin Heat Sink for BGAs Base Dimensions in. (mm) 1.240 (31.5) sq 1.240 (31.5) sq Height in. (mm) .350 (8.9) .400 (10.2) Heat Sink Finish Black Anodized Black Anodized Weight lbs. (grams) .022 (10.0) .024 (10.8) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS THERMAL RESISTANCE SINK TO AMBIENT (C) 610 THERMAL PERFORMANCE 10 9 8 7 6 5 4 3 2 1 0 100 610-35AB 610-40AB 200 300 400 500 AIR VELOCITY (LFM) 14 600 700 Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 611 SERIES Standard P/N 611-80AB Unidirectional Fin Heat Sink for BGAs Base Dimensions in. (mm) 1.200 (30.5) sq Height in. (mm) .800 (20.3) Heat Sink Finish Black Anodized Weight lbs. (grams) .036 (16.3) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS THERMAL RESISTANCE SINK TO AMBIENT (C) 611 THERMAL PERFORMANCE 7 6 5 4 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) 612 SERIES Standard P/N 612-65AB Unidirectional Fin Heat Sink for BGAs Base Dimensions in. (mm) 1.390 (35.3) sq Height in. (mm) .650 (16.5) Heat Sink Finish Black Anodized Weight lbs. (grams) .054 (24.5) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS THERMAL RESISTANCE SINK TO AMBIENT (C) 612 THERMAL PERFORMANCE 4 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) 15 Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 613 SERIES Standard P/N 613-50AB Unidirectional Fin Heat Sink for BGAs Base Dimensions in. (mm) 1.450 (36.8) sq Height in. (mm) .500 (12.7) Heat Sink Finish Black Anodized Weight lbs. (grams) .046 (20.8) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS THERMAL RESISTANCE SINK TO AMBIENT (C) 613 THERMAL PERFORMANCE 6 5 4 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) 614 SERIES Standard P/N 614-30AB 614-50AB 614-100AP Unidirectional Fin Heat Sink for BGAs Base Dimensions in. (mm) 1.500 (38.1) sq 1.500 (38.1) sq 1.500 (38.1) sq Height in. (mm) .300 (7.6) .500 (12.7) 1.000 (25.4) Heat Sink Finish Black Anodized Black Anodized Plain Weight lbs. (grams) .030 (13.8) .048 (21.8) .046 (20.9) Material: Aluminum, Black Anodized or Plain MECHANICAL DIMENSIONS THERMAL RESISTANCE SINK TO AMBIENT (C) 614 THERMAL PERFORMANCE 8 7 614-30AB 6 5 614-100AP (dashed) 4 614-50AB 3 2 100 200 300 400 500 AIR VELOCITY (LFM) 16 600 700 Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 615 SERIES Standard P/N 615-41AB Unidirectional Fin Heat Sink for BGAs Base Dimensions in. (mm) 1.600 (40.6) sq Height in. (mm) .410 (10.4) Heat Sink Finish Black Anodized Weight lbs. (grams) .046 (21.0) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS THERMAL RESISTANCE SINK TO AMBIENT (C) 615 THERMAL PERFORMANCE 8 7 6 5 4 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) 616 SERIES Standard P/N 616-80AB Unidirectional Fin Heat Sink for BGAs Base Dimensions in. (mm) 1.85 (47.0) sq Height in. (mm) .800 (20.3) Heat Sink Finish Black Anodized Weight lbs. (grams) .054 (24.5) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS THERMAL RESISTANCE SINK TO AMBIENT (C) 616 THERMAL PERFORMANCE 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) 17 Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 617 SERIES Standard P/N 617-80AB Unidirectional Fin Heat Sink for BGAs Base Dimensions in. (mm) 1.450 (36.8) x 1.850 (47.0) Height in. (mm) .800 (20.3) Heat Sink Finish Black Anodized Weight lbs. (grams) .082 (37.2) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS THERMAL RESISTANCE SINK TO AMBIENT (C) 617 THERMAL PERFORMANCE 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) 618 SERIES Standard P/N 618-20AB 618-100AP Unidirectional Fin Heat Sink for BGAs Base Dimensions in. (mm) 2.00 (50.8) sq 2.00 (80.8) sq Height in. (mm) .200 (5.1) 1.000 (25.4) Heat Sink Finish Black Anodized Plain Weight lbs. (grams) .046 (21.0) .122 (55.5) Material: Aluminum, Black Anodized or Plain MECHANICAL DIMENSIONS THERMAL RESISTANCE SINK TO AMBIENT (C) 618 THERMAL PERFORMANCE 7 6 618-20AB 5 4 3 2 1 0 100 618-100AB 200 300 400 500 AIR VELOCITY (LFM) 18 600 700 Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 620 SERIES Standard P/N 620-24AB Unidirectional Fin Heat Sink for BGAs Base Dimensions in. (mm) 2.500 (63.5) x 2.000 (50.8) Height in. (mm) .235 (6.0) Heat Sink Finish Black Anodized Weight lbs. (grams) .063 (28.6) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS THERMAL RESISTANCE SINK TO AMBIENT (C) 620 THERMAL PERFORMANCE 5 4 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) 622 SERIES Standard P/N 622-80AB Unidirectional Fin Heat Sink for BGAs Base Dimensions in. (mm) 2.050 (52.1) x 2.000 (50.8) Height in. (mm) .800 (20.3) Heat Sink Finish Black Anodized Weight lbs. (grams) .123 (56.0) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS THERMAL RESISTANCE SINK TO AMBIENT (C) 622 THERMAL PERFORMANCE 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) 19 Integrated Circuit Heat Sinks HEAT SINKS FOR MICROPROCESSORS AND ASICs 569, 579, 589, 599 SERIES Heat Sinks & Clip for Intel’s Pentium, Pentium MMX, AMD’s K6 & K62, CYRIX’s 6x86 & Media GX, Centaur/IDT’s WinChip C6 Fin Height in. (mm) 1.00 (25.4) 1.50 (38.10) 1.50 (38.10) 1.00 (25.4) Standard Base Dimensions P/N in. (mm) 569-100AK 2.34 (59.44) x 2.68 (67.95) 579-150AK 2.15 (54.71) x 1.95 (49.53) 589-150AK 2.15 (54.71) x 3.10 (78.74) 599X-100AB 1.96 (49.78) x 2.67 (67.95) Material: Aluminum, Black Anodized PRODUCT FEATURES • Compact design heat sinks can comfortably fit a variety of Robust Socket 7-based PC boxes • Robust clip attachments Thermal Resistance at 200 LFM (°C/W) 1.7 1.6 1.5 1.9 Interface Material Options Pages 74–76 Pages 74–76 Pages 74–76 Pages 74–76 • Clips are not captive to sink • To order heat sink with optional interface material pre-applied at the factory, add S4 or S5 suffix to the part number. (See Product Designation) MECHANICAL DIMENSIONS 2.34 .42 1.00 1.50 5x9SC .23 1.50 Wakefield 2.68 PRODUCT DESIGNATION 569-100AK SERIES 569 - 100 XX - XX OPTIONAL THERMAL INTERFACE PAD (SEE PRODUCT DES.) MODEL NUMBER THERMAL INTERFACE HEIGHT S4 = DELTALINK IV BLANK = NO THERMAL PAD 100 = 1.00" CLIP SPRING CLIP OPTION (SEE PRODUCT DES.) Dimensions: in. 650/651 SERIES Standard P/N 650B 651B AK = SPRING CLIP Low-Cost Heat Sinks for DIPs and SRAMs Length in. (mm) Width in. (mm) Height in. (mm) Typical Applications Weight lbs. (grams) 0.250 (6.4) 0.750 (19.1) 0.740 (18.9) 0.415 (10.5) 0.240 (6.1) 0.240 (6.1) 14-Pin, 16-Pin DIP 14-Pin, 16-Pin DIP 0.003 (1.36) 0.005 (2.27) These extruded heat sinks serve as low-cost heat dissipation solutions for DIPs with pin counts from 14 to 16. Use an epoxy such as Wakefield Engineering DeltaBond™ 152 or 155, or use Wakefield 2-part DeltaBond™ 156 modified Notes: 1. Finish: black anodize 2. TIR: Total Indicator Reading. This is a measure of flatness across the greatest dimension of a surface. 650B 20 acrylic adhesive. The 650 and 651 are also available in natural aluminum finish. They can be ordered as 650P or 651P. NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS Dimensions: in. (mm) 14-16 Pin DIPs 651B Integrated Circuit Heat Sinks HEAT SINKS FOR MICROPROCESSORS AND ASICs 649 SERIES SpiderClip™ Heat Sink Assembly for Motorola MC68040™, MC68060 18 x 18 PGA Standard P/N Base Dimensions in. (mm) Height in. (mm) Base Thickness in. (mm) Clip Color Heat Sink Finish Weight lbs. (grams) 649-33AB 649-51AB 1.70 (43.2) sq 1.86 (47.2) sq 0.315 (8.0) 0.510 (13.0) 0.090 (2.3) 0.090 (2.3) Gray Gray Black Anodized Black Anodized 0.044 (19.84) 0.056 (25.51) NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS Dimensions: in. (mm) 649-33AB SPIDERCLIP™ ASSEMBLY 649-51AB SPIDERCLIP™ ASSEMBLY 669 SERIES SpiderClip™ Heat Sink Assembly for IntelDX4™, AMD AM486DX2, and AM486DX4 661 SERIES Heat Sink without clip 17 x 17 SPGA Standard P/N Base Dimensions in. (mm) Dimensions “A” Height in. (mm) Base Thickness in. (mm) Clip Color Standard Finish Weight lbs. (grams) 669-32AG 669-33AB 669-40AB 669-52AB 661-32AG 661-33AB 661-40AB 661-52AB 1.70 (43.2) sq 1.70 (43.2) sq 1.70 (43.2) sq 1.70 (43.2) sq 1.70 (43.2) sq 1.70 (43.2) sq 1.70 (43.2) sq 1.70 (43.2) sq 0.315 (8.0) 0.315 (8.0) 0.400 (10.2) 0.520 (13.2) 0.315 (8.0) 0.315 (8.0) 0.400 (10.2) 0.520 (13.2) 0.090 (2.3) 0.090 (2.3) 0.090 (2.3) 0.090 (2.3) 0.090 (2.3) 0.090 (2.3) 0.090 (2.3) 0.090 (2.3) Black Black Black Black N/A N/A N/A N/A Gold Iridite Black Anodized Black Anodized Black Anodized Gold Iridite Black Anodized Black Anodized Black Anodized 0.044 (19.84) 0.044 (19.84) 0.044 (19.84) 0.050 (22.68) 0.044 (19.84) 0.044 (19.84) 0.044 (19.84) 0.050 (22.68) 669 Series SpiderClip™ Heat Sink Assemblies may be applied to the following: • Intel 80486DX and 80486DX2™ (168 PGA) • AMD AM 29000 Microcontrollers • Intel 82495 Cache Controller • Intel 80486SX (168 PGA) and I860XR (208 PGA) • Intel I960CA, I960CF Enbedded Controllers • Intel DX4™ (168 PGA) • AMD AM 486 Microprocessors AM486DX2, AM486DX4 MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 669-32AG 669-32AG SPIDERCLIP™ ASSEMBLY 669-33AB 669-40AB 669-52AB 669-52AB SPIDERCLIP™ ASSEMBLY Dielectric Breakdown (Nylon Clip Coating) Dimensions: in. (mm) Dielectric Strength: 100 VDC/mil Breakdown Voltage: 200 VDC (minimum) KEY: 669-32AG 0.315 (8.0) Pin Height, low density pin pattern 669-33AB 0.315 (8.0) Pin Height, high density pin pattern 669-40AB 0.400 (10.2) Pin Height, high density pin pattern 669-52AB 0.520 (13.2) Pin Height, high density pin pattern 21