Materials Analysis

Environmental Management and Materials Information
Product Content Information for: DS31408GN+
Links
Qualifications
Package Description
Chemical Composition Summary
Detailed Package Component Data
Qualifications Top
Lead−Free Qualified
Yes
REACH
Yes: 20−Jun−11
RoHS Qualified
Yes
Green
No
Moisture Sensitivity Level
L3
Flammability Meets UL−94 (V−0 Rating)
No
Assembler Qualified
Signetics
Package Description Top
Package Code
X25677+12
Package Type
FBGA
Package Description
Package Option
??
Body Size
17x17mm
Pin Count
256
Unit Weight in Grams
0.9971
Chemical Composition Summary Top
Maxim NIA/NIU Substance List (PDF, 24k)
Substance
CAS
Number
Amount
(grams)
% of
Unit Weight
Aluminum (Al)
7429−90−5
0
0
Antimony (Sb2O3)
1309−64−4
0
0
0
0
BCB Resin
Bromine (Br)
7726−95−6
0
0
Carbon (C)
7440−44−0
0
0
1
Carbon Black
1333−86−4
0.0038
0.38111
Ceramic (BaTiO3)
12047−27−7
0
0
Chromium (Cr)
7440−47−3
0
0
Cobalt (Co)
7440−48−4
0
0
Copper (Cu)
7440−50−8
0.1542065
15.46550
Gold (Au)
7440−57−5
0.0085
0.85247
Indium (In)
7440−74−6
0
0
0
0
Insulator (Polyimide)
Iron (Fe)
7439−89−6
0
0
FeO2
12411−15−36
0
0
Lead (Pb)
7439−92−1
0
0
Magnesium (Mg)
7439−95−4
0
0
Manganese (Mn)
7439−96−5
0
0
0
0
0.0228
2.28663
NiPdAu
0
0
Nickel−V (NiV)
0
0
MnO3
Nickel (Ni)
7440−02−0
Palladium (Pd)
7440−05−3
0
0
Phosphorus (P)
7723−14−0
0
0
Silica (SiO2)
11126−22−0
0.2493
25.00251
Silicon (Si)
7440−21−3
0.0281
2.81817
Silver (Ag)
7440−22−4
0.010039
1.00682
Solder Mask
0.056
5.61629
Solder Paste
0
0
Spheron Polymer Passivation
0
0
Sulfur (S)
7704−34−9
0
0
Tin (Sn)
7440−31−5
0.0977545
9.80388
Titanium (Ti)
7440−32−6
0
0
0
0
Titanium−W (TiW)
Tungsten (W)
7440−33−7
0
0
Vanadium (V)
7440−62−2
0
0
Zinc (Zn)
7440−66−6
0
0
ZnO
1314−13−2
0
0
Zirconium (Zr)
7440−67−7
0
0
Detailed Package Component Data Top
Bond Wire Components
2
Summary
Component Weight
0.0042
Substance
Amount
(grams)
% of
Component Weight
% of
Unit Weight
Gold (Au)
0.0042
100.00000
0.42122
0
0
0
Aluminum (Al)
Die Attach Epoxy Components
Summary
Die Attach Material
Ablebond 2100A
Component Weight
0.01
Amount
(grams)
% of
Component Weight
% of
Unit Weight
Aromatic Amine
0
0
0
Copper (Cu)
0
0
0
Diester
0
0
0
Epoxy
0.0003
3.00000
0.03009
Functionalized Ester
0
0
0
Functionalized Urethane
0
0
0
Indium (In)
0
0
0
Lactone
0
0
0
Lead (Pb)
0
0
0
Polymeric
0.0003
3.00000
0.03009
0
0
0
Resin
0.0024
0
0
Silver Filler (Ag)
0.0070
70.00000
0.70204
Tin (Sn)
0
0
0
Other
0
0
0
Substance
Polyoxypropylenediamine
Mold Compound Components
Summary
Mold Material
Nitto GE100LFCS
Resin Type
Phenolic &solid epoxy
Component Weight
0.4156
Amount
(grams)
% of
Component Weight
% of
Unit Weight
Antimony (Sb2O3)
ND
0
0
Bromine (Br)
ND
0
0
Substance
3
Carbon Black
Epoxy
0.0038
0.91434
0.38111
0
0
0
0
0
Epoxy Cresol Novolac
Metal Hydroxide
0.0378
9.09528
3.79099
Phenol Novolac
0.0378
9.09528
3.79099
Silica (SiO2)
0.2493
59.98556
25.00251
Resin
0.0869
20.90953
8.71527
0
0
Amount
(grams)
% of
Component Weight
% of
Unit Weight
0.0281
100
2.81817
Other
Silicon Chip Components
Substance
Silicon Chip
Solder Ball Components
Summary
Component Weight
0.1013
Amount
(grams)
% of
Component Weight
% of
Unit Weight
0.0005065
0.50000
0.05080
Lead (Pb)
0
0
0
Nickel (Ni)
0
0
0
Silver (Ag)
0.003039
3.00000
0.30478
0.0977545
96.50000
9.80388
Substance
Copper (Cu)
Tin (Sn)
Substrate Components
Summary
Substrate Weight
0.4758
Substrate Material
PSR4000AUS308 &HL832NX
Substrate Core Material
Bromine−Free
YES
Amount
(grams)
% of
Component Weight
% of
Unit Weight
Copper
0.1537
32.30349
15.41470
Gold
0.0043
0.90374
0.43125
Nickel
0.0228
4.79193
2.28663
Substrate Core Material
0.2389
50.21017
23.95948
Solder Mask
0.0560
11.76965
5.61629
Substance
4
Triazol
Other
0
0
0
0
0
5
Notes:
1.
Lead Form: GW − Gull Wing, TH − Through Hole.
2.
Refer to product data sheet to confirm actual wire diameter.
3.
'ND' means None Detected, negligible amount present.
This part is qualified as lead−free.
Parts qualified as lead−free can be manufactured and supplied as lead−free, if and only if, the customer
makes such requests to the Maxim Business Units for approval. The navigation bar on the EMMI website
contains information regarding the lead−free process (e.g. MSL's, Peak reflow Temperatures, JEDEC
methods, frequently asked questions and answers, lead−free package tables, and status/qualification plans for
particular package types qualified as lead−free or in the qualification process).
This report was generated on 2012−01−23. For additional information, please visit the
Maxim/Dallas Environmental Management and Materials Information website located at:
http://www.maxim−ic.com/emmi
6