Environmental Management and Materials Information Product Content Information for: MAX3636ETM+ Links Qualifications Package Description Chemical Composition Summary Detailed Package Component Data Qualifications Top Lead−Free Qualified Yes REACH Yes: 2011−06−20 RoHS Qualified Yes Starting Date Code: 1052+ Green Moisture Sensitivity Level L1 Flammability Meets UL−94 (V−0 Rating) Yes Assembler Qualified UTL Package Description Top Package Code T4877+4 Package Type TQFN * Package Description Thin Quad Flatpack, No Leads Package Option Sawn/Epad Footprint Area (mm2) 50.4 Body Size 7x7x0.8mm Pin Count 48 Unit Weight in Grams 0.1323334 Chemical Composition Summary Top Maxim NIA/NIU Substance List (PDF, 24k) Substance CAS Number Aluminum (Al) 7429−90−5 0 0 Antimony (Sb2O3) 1309−64−4 0 0 0 0 0 0 BCB Resin Bromine (Br) 7726−95−6 Amount (grams) % of Unit Weight 1 Carbon (C) 7440−44−0 0 0 Carbon Black 1333−86−4 0 0 Ceramic (BaTiO3) 12047−27−7 0 0 Chromium (Cr) 7440−47−3 0 0 Cobalt (Co) 7440−48−4 0 0 Copper (Cu) 7440−50−8 0.05101 38.54658 Gold (Au) 7440−57−5 0.00086 0.64987 Indium (In) 7440−74−6 0 0 0 0 0.001165 0.88035 Insulator (Polyimide) Iron (Fe) 7439−89−6 FeO2 12411−15−36 0 0 Lead (Pb) 7439−92−1 0 0 Magnesium (Mg) 7439−95−4 0 0 Manganese (Mn) 7439−96−5 0 0 0 0 0 0 NiPdAu 0 0 Nickel−V (NiV) 0 0 MnO3 Nickel (Ni) 7440−02−0 Palladium (Pd) 7440−05−3 0 0 Phosphorus (P) 7723−14−0 0 0 Silica (SiO2) 11126−22−0 0.05451 41.19142 Silicon (Si) 7440−21−3 0.009 6.80100 Silver (Ag) 7440−22−4 0.00327 2.47103 Solder Mask 0 0 Solder Paste 0 0 Spheron Polymer Passivation 0 0 Sulfur (S) 7704−34−9 0 0 Tin (Sn) 7440−31−5 0.00606 4.57934 Titanium (Ti) 7440−32−6 0 0 0 0 Titanium−W (TiW) Tungsten (W) 7440−33−7 0 0 Vanadium (V) 7440−62−2 0 0 Zinc (Zn) 7440−66−6 6.8e−05 0.05139 ZnO 1314−13−2 0 0 Zirconium (Zr) 7440−67−7 0 0 Detailed Package Component Data Top 2 Bond Wire Components Summary Component Weight 0.00086 Substance Amount (grams) % of Component Weight % of Unit Weight Gold (Au) 0.00086 100.00000 0.64987 0 0 0 Aluminum (Al) Die Attach Epoxy Components Summary Die Attach Material Ablebond 8200T Component Weight 0.00339 % of Component Weight % of Unit Weight 0 0 0 0 0 0 20.05900 0.51385 Functionalized Ester 0 0 Functionalized Urethane 0 0 0 0 0 0 0 0 Polymeric 0 0 Polyoxypropylenediamine 0 0 0 0 0 0.00271 79.94100 2.04786 0 0 0 0 0 Substance Amount (grams) Aromatic Amine Copper (Cu) 0 Diester Epoxy Indium (In) 0.00068 0 Lactone Lead (Pb) Resin Silver Filler (Ag) Tin (Sn) 0 Other Lead Finish/Plating Components Summary Lead Finish Plating 100% Tin Assembly Lead Finish Process Component Weight Substance Lead (Pb) 0.00606 Amount (grams) % of Component Weight % of Unit Weight 0 0 0 3 Tin (Sn) 0.00606 100.00000 4.57934 NiPdAu 0 0 0 Gold (Au) 0 0 0 Nickel (Ni) 0 0 0 Lead Frame Components Summary Lead Frame Material Copper C194 Component Weight 0.052803 % of Component Weight % of Unit Weight Aluminum (Al) 0 0 Carbon (C) 0 0 0 0 0 0 96.60436 38.54658 0 0 2.20631 0.88035 0 0 0 0 0 0 0 0 Palladium (Pd) 0 0 Phosphorus (P) 0 0 Silicon (Si) 0 0 1.06055 0.42317 Sulfur (S) 0 0 Tin (Sn) 0 0 0.000068 0.12878 0.05139 0 0 0 Substance Chromium (Cr) Amount (grams) ND Cobalt (Co) Copper (Cu) 0.05101 Gold (Au) Iron (Fe) 0.001165 Lead (Pb) Magnesium (Mg) ND Manganese (Mn) Nickel (Ni) Silver (Ag) Zinc (Zn) Zirconium (Zr) ND 0.00056 Mold Compound Components Summary Mold Material Sumitomo G770HCD Resin Type Multi−Functional Component Weight Substance 0.06023 Amount (grams) % of Component Weight % of Unit Weight 4 Antimony (Sb2O3) ND 0 0 Bromine (Br) ND 0 0 Carbon Black 0 0 Epoxy 0 0 Epoxy Cresol Novolac 0 0 Metal Hydroxide 0 0 Phenol Novolac 0 0 Silica (SiO2) 0.05451 90.50307 41.19142 Resin 0.00572 9.49693 4.32242 0 0 Substance Amount (grams) % of Component Weight % of Unit Weight Silicon Chip 0.00900 100 6.80100 Other Silicon Chip Components Substrate Components Summary Substrate Weight Substrate Material 0 Substrate Core Material 0 Bromine−Free 0 Amount (grams) % of Component Weight % of Unit Weight Copper 0 0 0 Gold 0 0 0 Nickel 0 0 0 Substrate Core Material 0 0 0 Solder Mask 0 0 0 Triazol 0 0 Other 0 0 Substance 5 Notes: 1. Lead Form: GW − Gull Wing, TH − Through Hole. 2. Refer to product data sheet to confirm actual wire diameter. 3. 'ND' means None Detected, negligible amount present. * This package may be remarked. If remarked, the package will contain additional homogeneous materialsinksthat are not listed in contents of this report. + Existing inventory of non Halogen−free product will be sold first. Halogen−free product is identified by date code only. If you need to confirm delivery of Halogen−free product, please contact Customer Service. This part is qualified as lead−free. Parts qualified as lead−free can be manufactured and supplied as lead−free, if and only if, the customer makes such requests to the Maxim Business Units for approval. The navigation bar on the EMMI website contains information regarding the lead−free process (e.g. MSL's, Peak reflow Temperatures, JEDEC methods, frequently asked questions and answers, lead−free package tables, and status/qualification plans for particular package types qualified as lead−free or in the qualification process). This report was generated on 2012−01−23. For additional information, please visit the Maxim/Dallas Environmental Management and Materials Information website located at: http://www.maxim−ic.com/emmi 6