Material Declaration Report Package Type: MSOP 8L Component Weight (mg): 22.110 Pericom Package Code: U8(Pb-free) MSL Rating: 1 Termination Plating: Matte Tin RoHS Compliance: Yes Peak Body Temp (C): 260 JESD 97 Pb-free Category: e3 Applicable Exemption: N/A Max Time (sec): 40 Plating Thickness (um): 10~20 Reflow Cycles: 3 Tin Whisker Mitigation: Anneal, 150C/1hr Rev Date: 6/4/2008 Homogeneous Material Declaration MATERIAL ITEM MATERIAL WEIGHT(mg) MOLD COMPOUND ASSEMBLY SUBCON 7.743 UTL MATERIAL COMPOSITION Silica Fused Epoxy Resin Phenolic Resin Epoxy, Cresol Novolac Carbon Black CAS NO. COMPOSITION % 88.000 5.000 4.500 2.000 0.500 COMPOSITION WEIGHT(mg) 6.8140 0.3872 0.3484 0.1549 0.0387 60676-86-0 Proprietary Proprietary 29690-82-2 1333-86-4 Copper Nickel Silver Silicon Magnesium 7440-50-8 7440-02-0 7440-22-4 7440-21-3 7439-95-4 95.140 3.200 0.760 0.725 0.175 12.2599 0.4124 0.0979 0.0934 0.0226 Silicon (Si) Non-hazardous Metal 7440-21-3 Proprietary 99.192 0.808 0.6385 0.0052 Silver Functionalized Urethane Diester Resin Epoxy Resin 7440-22-4 72869-86-4 94-80-4 Proprietary 80.000 8.000 7.000 5.000 0.1269 0.0127 0.0111 0.0079 LEADFRAME 12.886 SILICON DIE 0.644 DIE ATTACH EPOXY 0.159 GOLD WIRE 0.115 Gold(Au) Impurities 7440-57-5 - 99.990 0.010 0.1150 0.0000 SOLDER PLATING 0.563 Tin (Sn) Impurity 7440-31-5 - 99.990 0.010 0.5632 0.0001 NOTE: The device contents disclosed are approximated and are based on engineering estimates. 3rd Party Analysis Results (PPM) Device MATERIAL Pb Hg Cr+6 Cd PBB Mold Compound Leadframe Silicon Die Die Attach Epoxy Gold Wire Solder Plating <2 <50 <2 <2 <2 <50 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <5 <5 <5 <5 <5 <5 PBDE <5 <5 <5 <5 <5 <5 ROHS MATERIAL COMPOSITION DECLARATION EU RoHS Directive 2002/95/EC Declaration Statement: Quantity limit of 0.1% (1000 PPM) by mass in homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium(Cr+6), Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE); and Quantity limit of 0.01% (100 PPM) for Cadmium and Pb China RoHS Directive <1000ppm O Hg <1000ppm O Cr+6 <1000ppm O Cd <100ppm O PBB <1000ppm PBDE <1000ppm O SJ/T11363-2006 O: Indicates that this toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006. X: Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement in SJ/T11363-2006. O