2SC1472(K) Silicon NPN Epitaxial, Darlington REJ03G0688-0200 (Previous ADE-208-1054) Rev.2.00 Aug.10.2005 Application High gain amplifier Outline RENESAS Package code: PRSS0003DA-A (Package name: TO-92 (1)) 3 1. Emitter 2. Collector 3. Base 2 1 3 2 1 Absolute Maximum Ratings (Ta = 25°C) Item Collector to base voltage Collector to emitter voltage Emitter to base voltage Collector current Collector peak current Collector power dissipation Junction temperature Storage temperature Rev.2.00 Aug 10, 2005 page 1 of 5 Symbol VCBO VCEO VEBO IC iC(peak) PC Tj Tstg Ratings 40 30 10 300 500 500 150 –55 to +150 Unit V V V mA mA mW °C °C 2SC1472(K) Electrical Characteristics (Ta = 25°C) Item Collector to emitter breakdown voltage Collector cutoff current Emitter cutoff current DC current transfer ratio Collector to emitter saturation voltage Base to emitter voltage Gain bandwidth product Collector output capacitance Turn on time Symbol V(BR)CEO ICBO IEBO hFE1*1 hFE2*1 Min 30 — — 2000 3000 Typ — — — — — Max — 100 100 100000 — hFE3*1 3000 — — VCE(sat) VBE(sat) fT Cob ton — — 50 — — — — — — 60 1.5 2.0 — 10 — V V MHz pF ns toff tstg — — 800 350 — — ns ns Turn off time Storage time Note: hFE1 hFE2 hFE3 Unit V nA nA Test conditions IC = 1 mA, RBE = ∞ VCB = 30 V, IE = 0 VEB = 10 V, IC = 0 IC = 10 mA, VCE = 5 V IC = 100 mA, VCE = 5 V (Pulse Test) IC = 400 mA, VCE = 5 V (Pulse Test) IC = 100 mA, IB = 0.1 mA IC = 100 mA, IB = 0.1 mA VCE = 5 V, IC = 10 mA VCB = 10 V, IE = 0, f = 1 MHz VCC = 11 V IC = 100 IB1 = 100 mA IB2 = –IB1 1. The 2SC1472(K) is grouped by hFE as follows. A B 2000 to 100000 5000 to 100000 3000 min 10000 min 3000 min 10000 min Switching Time Test Circuit Response Waveform CRT D.U.T. 6k P.G. tr, tf ≤ 15 ns PW 10 µs duty ratio ≤ 10% 50 –6 V 100 6k 0.002 0.002 – + 50 – + 50 Rev.2.00 Aug 10, 2005 page 2 of 5 11 V Unit R : Ω C : µF 13 V Input 0 Output 0 90% 10% 90% 90% 10% td ton 10% tstg toff 2SC1472(K) Main Characteristics Typical Output Characteristics 400 200 0 50 100 150 12 10 400 8 300 6 200 4 100 2 µA 0 PC = 50 0 mW Pulse 3.5 120 3.0 2.5 80 2.0 40 0 1.5 1.0 10 PC = 500 0.5 µA 20 30 mW IB = 0 40 Collector Cutoff Current ICEO (nA) 10,000 0 5. 5 4. 0 4. 40 30 Ta 50 =1 00 ° 5075 C 60 20 25 0 10 –25 –50 0 2.0 5.0 10 20 50 100 200 500 Collector Current IC (mA) Rev.2.00 Aug 10, 2005 page 3 of 5 10 75 100 10 50 1.0 TC = 25°C 0.1 0.01 0 10 20 30 Collector to Emitter Voltage VCE (V) Collector to Emitter Saturation Voltage vs. Collector Current Collector to Emitter Saturation Voltage VCE (sat) (V) VCE = 5 V Pulse 8.0 RBE = ∞ DC Current Transfer Ratio vs. Collector Current 70 6.0 100 1,000 50 Collector to Emitter Voltage VCE (V) 80 4.0 Collector Cutoff Current vs. Collector to Emitter Voltage 200 160 2.0 Collector to Emitter Voltage VCE (V) Typical Output Characteristics DC Current Transfer Ratio hFE (×103) 20 8 1 6 1 4 1 IB = 0 Ambient Temperature Ta (°C) Collector Current IC (mA) 35 30 25 500 600 Collector Current IC (mA) Collector Power Dissipation PC (mW) Maximum Collector Dissipation Curve 1.1 IC = 1,000 IB 1.0 0°C Ta = –5 –25 0 25 50 75 100 0.9 0.8 0.7 0.6 0.5 Pulse 0.4 0.3 1 2 5 10 20 50 100 200 500 Collector Current IC (mA) 2SC1472(K) Base to Emitter Saturation Voltage vs. Collector Current 2.4 Base to Emitter Saturation Voltage VBE (sat) (V) Collector to Emitter Saturation Voltage VCE (sat) (V) Collector to Emitter Saturation Voltage vs. Base Current Ta = 25°C Pulse 2.0 1.6 20 50 100 200 IC = 500 mA 1.2 0.8 0.4 0 1 3 10 30 100 2.0 Ta = –50°C –25 0 25 50 75 100 1.6 1.4 1.2 1.0 0.8 0.6 0.4 1 300 1,000 Input and Output Capacitance vs. Voltage 5 10 20 50 100 200 500 Switching Time vs. Collector Current 30 10 f = 1 MHz 8 Switching Time t (µs) Collector Output Capacitance Cob (pF) Emitter Input Capacitance Cib (pF) 2 Collector Current IC (mA) Base Current IB (mA) 6 C (I = 0) ib C Cob(IE = 0) 4 2 0 0.1 Pulse IC = 1,000 IB 1.8 IC = 100 IB1 = –100 IB2 VCC = 10.5 V 10 toff 3 1.0 tstg 0.3 0.1 0.3 1.0 3 10 0.03 0.3 30 ton td 1.0 3 10 30 100 300 Base Current IC (mA) Collector to Base Voltage VCB (V) Emitter to Base Voltage VEB (V) Response Waveform Switching Time Test Circuit CRT D.U.T. 13 V Input 0 P.G. tr, tf ≤ 15 ns PW ³ 10 µs duty ratio ≤ 10% 50 –6 V 0.002 – + 50 0.002 – + 50 Unit R : Ω C : µF 10.5 V 90% 10% 90% Output 0 10% td ton Rev.2.00 Aug 10, 2005 page 4 of 5 90% 10% tstg toff 2SC1472(K) Package Dimensions JEITA Package Code RENESAS Code SC-43A PRSS0003DA-A Package Name MASS[Typ.] TO-92(1) / TO-92(1)V Unit: mm 0.25g 4.8 ± 0.3 2.3 Max 0.7 0.60 Max 0.55 Max 12.7 Min 5.0 ± 0.2 3.8 ± 0.3 0.5 Max 1.27 2.54 Ordering Information Part Name 2SC1472KATZ-E 2SC1472KBTZ-E Quantity 2500 Shipping Container Hold Box, Radial Taping Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product. Rev.2.00 Aug 10, 2005 page 5 of 5 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. http://www.renesas.com RENESAS SALES OFFICES Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> 2-796-3115, Fax: <82> 2-796-2145 Renesas Technology Malaysia Sdn. Bhd. Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510 © 2005. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .3.0