PC956L0NSZ0F Series

PC956L0NSZ0F Series
PC956L0NSZ0F
Series
High Speed 2Mb/s, High CMR
DIP 8 pin ∗OPIC Photocoupler
■ Description
■ Agency approvals/Compliance
PC956L0NSZ0F Series contains a LED optically
coupled to an OPIC chip.
It is packaged in a 8 pin DIP, available in SMT
gullwing lead form option.
Input-output isolation voltage(rms) is 5.0kV, High
speed response (TYP. 2Mb/s) and CMR is MIN.
15kV/µs.
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC956L)
2. Approved by VDE, DIN EN60747-5-2 (∗) (as an
option), file No. 40008898 (as model No. PC956L)
3. Package resin : UL flammability grade (94V-0)
■ Features
■ Applications
1. 8 pin DIP package
2. Double transfer mold package
(Ideal for Flow Soldering)
3. High noise immunity due to high instantaneous
common mode rejection voltage (CMH : MIN.
15kV/µs, CML : MIN. −15kV/µs)
4. High speed response
(tPHL : TYP. 210 ns, tPLH : TYP. 400 ns)
5. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
6. Lead-free and RoHS directive compliant
1. Programmable controller
2. Inverter
(∗)
DIN EN60747-5-2 : successor standard of DIN VDE0884
∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing
circuit integrated onto a single chip.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D2-A05502EN
Date Jun. 30. 2005
© SHARP Corporation
PC956L0NSZ0F Series
■ Internal Connection Diagram
7
6
5
1
2
Voltage
regulator
3
4
Amp.
1
2
3
NC
Anode
Cathode
NC
5
6
7
8
GND
VO
VL
VCC
4
■ Outline Dimensions
(Unit : mm)
1. Through-Hole [ex. PC956L0NSZ0F]
6
3
1
4
Date code
θ:0 to 13˚
3
3.4±0.5 3.5±0.5
1.2±0.3
8
0.85±0.2
7
6
5
6.5±0.5
PC956L
4
Primary side
mark
1
4
2
3
9.66±0.5
VDE Identification mark
Epoxy resin
7.62±0.3
0.26
±0.1
0.35±0.25
0.26±0.1
7.62±0.3
1.0+0.4
−0
4
Date code
Date code
3.5±0.5
θ
4. SMT Gullwing Lead-Form (VDE option)
[ex. PC956L0YIP0F]
9.66±0.5
2.54±0.25
θ:0 to 13˚
Product mass : approx. 0.55g
5
Primary side
mark
0.26±0.1
0.5±0.1
θ
0.85±0.2
PC956L
2.54±0.25
7.62±0.3
Epoxy resin
θ
3. SMT Gullwing Lead-Form [ex. PC956L0NIP0F]
1.2±0.3
Date code
0.5
0.26
0.5±0.1
Product mass : approx. 0.55g
2
VDE Identification mark
4
TYP.
Epoxy resin
θ
1
3
Primary side
mark
7.62±0.3
±0.1
2.54±0.25
6
2
3.05±0.5
3.05±0.5
3.4±0.5 3.5±0.5
Primary side
mark
7
5
9.66±0.5
9.66±0.5
8
6
0.5TYP.
2
7
PC956L
4
6.5±0.5
PC956L
1
8
5
6.5±0.5
7
0.85±0.2
2.54±0.25
1.0+0.4
−0
3.5±0.5
8
1.2±0.3
0.85±0.2
6.5±0.5
1.2±0.3
2. Through-Hole (VDE option) [ex. PC956L0YSZ0F]
1.0+0.4
−0
Epoxy resin
0.35±0.25
8
1.0+0.4
−0
10.0+0
−0.5
10.0+0
−0.5
Product mass : approx. 0.51g
Product mass : approx. 0.51g
Plating material : SnCu (Cu : TYP. 2%)
Sheet No.: D2-A05502EN
2
PC956L0NSZ0F Series
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
1st digit
Year of production
A.D
Mark
2002
A
2003
B
2004
C
2005
D
2006
E
2007
F
2008
H
2009
J
2010
K
2011
L
2012
M
··
N
·
Mark
P
R
S
T
U
V
W
X
A
B
C
··
·
2nd digit
Month of production
Month
Mark
January
1
February
2
March
3
April
4
May
5
June
6
July
7
August
8
September
9
October
O
November
N
December
D
repeats in a 20 year cycle
Country of origin
Japan
Rank mark
There is no rank mark indicator.
Sheet No.: D2-A05502EN
3
PC956L0NSZ0F Series
■ Absolute Maximum Ratings
(Ta=25˚C)
Parameter
Symbol
Rating
25
Forward current
IF
Input
Reverse voltage
VR
5
*2
Power dissipation
P
45
−0.5 to +35
VCC
Supply voltage
VO
−0.5 to +35
Output voltage
Output
Output current
IO
15
*3 Power dissipation
PO
100
Operating temperature
−40 to +85
Topr
−55 to +125
Tstg
Storage temperature
*4
Viso (rms)
Isolation voltage
5.0
*5
270
Soldering temperature
Tsol
*1
Unit
mA
V
mW
V
V
mA
mW
˚C
˚C
kV
˚C
*1 When ambient temperature goes above 70˚C, the power dissipation goes down
at approx. 0.5mA/˚C.(Fig.3)
*2 When ambient temperature goes above 70˚C, the power dissipation goes down
at approx. 0.8mW/˚C.(Fig.4)
*3 When ambient temperature goes above 70˚C, the power dissipation goes down
at approx. 1.8mW/˚C.(Fig.4)
*4 40 to 60%RH, AC for 1minute, f=60Hz
*5 For 10s
Parameter
Forward voltage
Reverse current
Terminal capacitance
Operating supply voltage
Low level output voltage
Low level output current
High level output current
High level supply current
Low level supply current
Symbol
VF
IR
Ct
VCC
VOL
IOL
IOH
ICCH
ICCL
"High→Low" input threshold current
IFHL
Isolation resistance
Floating capacitance
Internal pull-up resistance
"High→Low" propagation delay time
"Low→High" propagation delay time
Distortion of pulse width
RISO
Cf
RL
tPHL
tPLH
∆tw
Transfer characteristics
Response time
Output
Input
■ Electro-optical Characteristics*6
Propagation delay skew
Instantaneous common mode rejection
voltage
(High level output)
Instantaneous common mode rejection
voltage
(Low level output)
(unless otherwise specified Ta=−40 to +85˚C, VCC=4.5 to 35V)
Unit
MIN.
TYP. MAX.
Conditions
−
V
1.6
1.95
Ta=25˚C, IF=10mA
−
µA
−
10
Ta=25˚C, VR=5V
Ta=25˚C, V=0, f=1MHz
60
−
pF
250
−
4.5
−
35
V
−
IF=10mA, Io=2.4mA
0.3
0.6
V
−
4.4
9
mA
IF=10mA, Vo=0.6V
50
IF=0, VCC=Vo
−
5
µA
−
mA
0.6
1.3
IF=0, Vo=OPEN
0.8
−
mA
1.3
IF=10mA, Vo=OPEN
Vo=0.8V, RL=20kΩ, VCC=15V
mA
1.5
5
−
Short circuit between pin 7 and pin 8
5×1010
−
14
30
270
−
1011
0.6
20
210
400
190
−
1
25
400
550
450
Ω
pF
kΩ
ns
ns
ns
−
200
450
ns
CMH
Ta=25˚C, IF=0, VCC=15V,
CL=100pF, VCM=1.5kV(P-P), RL=20kΩ,
VO>3.0V, Short circuit between
pin 7 and pin 8
15
30
−
kV/µs
CML
Ta=25˚C, IF=10mA, VCC=15V,
CL=100pF, VCM=1.5kV(P-P), RL=20kΩ,
VO<1.0V, Short circuit between
pin 7 and pin 8
−15
−30
−
kV/µs
TPSK
Ta=25˚C, DC500V, 40 to 60%RH
Ta=25˚C, V=0, f=1MHz
Ta=25˚C
IF=10mA (tpHL), IF=0 (tpLH),
VCC=15V, RL=20kΩ, CL=100pF
VTHLH=2.0V, VTHHL=1.5V
Short circuit between pin 7 and
pin 8
*6 It shall connect a by-pass capacitor of 0.01µF or more between VCC (pin 8 ) and GND (pin 5 ) near the device, when it measures the transfer characteristics and the output side
characteristics
*7 Distortion of pulse width ∆tw= | tPHL− tPLH |
Sheet No.: D2-A05502EN
4
PC956L0NSZ0F Series
■ Model Line-up
Through-Hole
SMT Gullwing
Sleeve
Taping
Package
50pcs/sleeve
1 000pcs/reel
−−−−−−
Approved
−−−−−−
Approved
DIN EN60747-5-2
Model No.
PC956L0NSZ0F PC956L0YSZ0F PC956L0NIP0F PC956L0YIP0F
Lead Form
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A05502EN
5
PC956L0NSZ0F Series
Fig.1 Test Circuit for Propagation Delay Time
10mA
VCC
RL
IF
tPHL
0.1µF
Voltage
regulator
0mA
IF
tPLH
90%
VO
VO
Amp.
VTHHL
47Ω
VTHLH
10%
CL
tr
tf
VOL
GND
Fig.2 Test Circuit for Common Mode Rejection Voltage
1.5kV
VCC
RL
IF
CMH,VO
(IF=0)
0.1µF
Voltage
regulator
B
VCM
A
CML,VO
(IF=10mA)
VO
Amp.
+
VCM
CL
0V
VCC
VO (MIN.)
SW is A
VO (MAX.)
VOL
SW is B
−
GND
Fig.3 Forward Current vs. Ambient
Temperature
Fig.4 Power Dissipation vs. Ambient
Temperature
Power dissipation P, PO (mW)
Forward current IF (mA)
20
15
10
80
60
P
45
40
20
5
70
0
−40 −25
PO
100
25
0
25
85
50
75
100
70
0
−40 −25
125
Ambient temperature Ta (˚C)
0
25
50
85
75
100
125
Ambient temperature Ta (˚C)
Sheet No.: D2-A05502EN
6
PC956L0NSZ0F Series
Fig.5 Output Current vs. Forward Current
Fig.6 Forward Current vs. Forward Voltage
15
100
Ta=−40˚C
10
Forward current IF (mA)
Output current IO (mA)
VO=0.6V
Ta=25˚C
Ta=75˚C
Ta=100˚C
5
10
Ta=25˚C
Ta=0˚C
Ta=50˚C
Ta=−20˚C
1
Ta=75˚C
Ta=−40˚C
0
0
5
10
15
0.1
1.0
20
1.2
Forward current IF (mA)
Input threshold current IFHL (mA)
Relative output current IO (%)
5
100
90
80
70
60
−40
−20
0
20
40
60
80
4
3
2
1
0
−40
100
−20
40
1.6
VCC=4.5V
IF=10mA
IO=2.4mA
60
80
100
VCC=35V
VO=Open
ICCH:IF=0
ICCL:IF=10mA
1.4
Supply current ICCH, ICCL (mA)
Low level output voltage VOL (V)
20
Fig.10 Supply Current vs. Ambient
Temperature
0.4
0.3
0.2
0.1
0
−40
0
Ambient temperature Ta (˚C)
Fig.9 Low Level Output Voltage vs. Ambient
Temperature
0.5
2.0
VCC=15V
VO=0.8V
RL=20kΩ
Ambient temperature Ta (˚C)
0.6
1.8
Fig.8 Input Threshold Current vs. Ambient
Temperature
IF=10mA
VO=0.6V
IO=100% at Ta=25˚C
110
1.6
Forward voltage VF (V)
Fig.7 Relative Output Current vs. Ambient
Temperature
120
1.4
1.2
ICCL
1.0
0.8
ICCH
0.6
0.4
0.2
−20
0
20
40
60
80
0
−40
100
Ambient temperature Ta (˚C)
−20
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Sheet No.: D2-A05502EN
7
PC956L0NSZ0F Series
Fig.11 Propagation Delay Time vs. Ambient
Temperature
Fig.12 Propagation Delay Time vs. Load
Resistance
2.0
2.0
IF=10mA
VCC=15V
CL=100pF
RL=20kΩ
1.6
1.4
1.2
1.0
0.8
0.6
tPLH
0.4
IF=10mA
VCC=15V
CL=100pF
Ta=25˚C
1.8
Propagation delay time tPHL, tPLH (µs)
Propagation delay time tPHL, tPLH (µs)
1.8
tPHL
1.6
1.4
1.2
1.0
0.8
tPLH
0.6
0.4
tPHL
0.2
0.2
0
0
−40
−20
0
20
40
60
80
0
100
5
10
Ambient temperature Ta (˚C)
Fig.13 Propagation Delay Time vs. Load
Capacitance
20
25
30
35
40
45
50
Fig.14 Propagation Delay Time vs. Supply
Voltage
2.0
2.0
IF=10mA
VCC=15V
RL=20kΩ
Ta=25˚C
1.6
1.4
1.2
tPLH
1.0
0.8
0.6
IF=10mA
CL=100pF
RL=20kΩ
Ta=25˚C
1.8
Propagation delay time tPHL, tPLH (µs)
1.8
Propagation delay time tPHL, tPLH (µs)
15
Load resistance RL (kΩ)
tPHL
0.4
0.2
1.6
1.4
1.2
1.0
tPLH
0.8
0.6
0.4
0.2
0
tPHL
0
0
50 100 150 200 250 300 350 400 450 500
0
Load capacitance CL (pF)
5
10
15
20
25
30
35
Supply voltage VCC (V)
Fig.15 Propagation Delay Time vs. Forward
Current
2.0
VCC=15V
CL=100pF
RL=20kΩ
Ta=25˚C
Propagation delay time tPHL, tPLH (µs)
1.8
1.6
1.4
1.2
1.0
0.8
0.6
tPLH
0.4
tPHL
Remarks : Please be aware that all data in the graph
are just for reference and not for guarantee.
0.2
0
0
2
4
6
8
10
12
14
16
18
20
Forward current IF (mA)
Sheet No.: D2-A05502EN
8
PC956L0NSZ0F Series
■ Design Considerations
● Recommended operating conditions
Parameter
Forward current
Supply voltage
Output voltage
Operating temperature
Symbol
IF
VCC
VO
Topr
MIN.
10
4.5
0
−40
TYP.
−
−
−
−
MAX.
20
35
35
70
Unit
mA
V
V
˚C
● Notes about static electricity
Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute
design.
When handling these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
● Design guide
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of
0.01µF or more between VCC and GND near the device.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in
false operation since current may go through LED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of LED.
The detector which is used in this device, has parasitic diode between each pins and GND.
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin
becomes below GND level even for instant.
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become
below GND level.
This product is not designed against irradiation and incorporates non-coherent LED.
Sheet No.: D2-A05502EN
9
PC956L0NSZ0F Series
● Degradation
In general, the emission of the LED used in photocouplers will degrade over time.
In the case of long term operation, please take the general LED degradation (50% degradation over 5 years)
into the design consideration.
Please decide the input current which become 2 times of MAX. IFHL.
● Recommended Foot Print (reference)
1.7
2.54
2.54
2.54
8.2
2.2
(Unit : mm)
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A05502EN
10
PC956L0NSZ0F Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
150 to 180˚C, 120s or less
100
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A05502EN
11
PC956L0NSZ0F Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Sheet No.: D2-A05502EN
12
PC956L0NSZ0F Series
■ Package specification
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
±2
5.8
10.8
520
6.7
(Unit : mm)
Sheet No.: D2-A05502EN
13
PC956L0NSZ0F Series
● Tape and Reel package
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
J
D
E
G
MA
X.
H
H
A
B
C
I
5˚
K
Dimensions List
A
B
16.0±0.3
7.5±0.1
H
I
±0.1
10.4
0.4±0.05
C
1.75±0.1
J
4.2±0.1
D
12.0±0.1
K
10.2±0.1
E
2.0±0.1
(Unit : mm)
F
G
+0.1
4.0±0.1
φ1.5−0
Reel structure and Dimensions
e
d
c
g
Dimensions List
a
b
330
e
23±1.0
f
a
b
17.5±1.5
f
2.0±0.5
(Unit : mm)
c
d
±1.0
100
13±0.5
g
2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D2-A05502EN
14
PC956L0NSZ0F Series
■ Important Notices
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials,
structure, and other contents described herein at any
time without notice in order to improve design or
reliability. Manufacturing locations are also subject to
change without notice.
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in
whole or in part, without the express written permission
of SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
[E231]
Sheet No.: D2-A05502EN
15