Power Amplifier Tour

POWER AMPLIFIERS
PRODUCT & CAPABILITIES OVERVIEW
COMPANY OVERVIEW
• Premier provider of technically demanding
RF/microwave, electromagnetic, power, and security
solutions for defense, aerospace, commercial and
medical industries
• Founded in 1981; Listed on NASDAQ June 2011
with a new company vision
– Today, one of the largest non-Prime provider of
RF/Microwave and microelectronics products and services
• 1,975 employees worldwide
• 3,000+ customers worldwide
• Revenue breakdown
– ~75% Domestic / 25% International
– ~60% Defense & Government / 40% Commercial
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Design & Manufacturing
Design Center
Europe
• 12 trusted design facilities
worldwide (US, UK, Canada)
Manufacturing Center
OUR FOOTPRINT
Sales Office
North America
• Technology focused:
Nearly 20% of our
employees are engineers
and skilled design
professionals
Asia
• International manufacturing locations
are API companies - not
subcontractors; same equipment
and processes as U.S.
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POWER AMPLIFIER INTEGRATION
PA Subsystems
Multi-function Amplifier Systems
• Integrated LNA, Filtering, Switching Functions
• Power Conversion
• Digital Control
Complexity
PA Modules
PA Modules - Applications
• Broadband Jamming
• PA Module with Integrated PSU
• Pulsed Radar
• Military Communications
• Co-Site Solutions
PA Drivers
PA Driver Optimization
• 3 Stage Amplifier w/ Internal Voltage Regulation
• Class AB Biased for Radar, Jammers
• Balanced Output Stage
• Filtered Input (18 dB/Octave Filter Roll-off)
• Latest GaN Technology
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AMPLIFIER SUBSYSTEMS
PA subsystems incorporate
multi-band amplifiers, switched
harmonic filter banks and high
efficiency DC converters with
integrated adaptive biasing
controls.
Designing and Building Integrated Amplifier
Assemblies including:
• Waveguide Splitter/Combiner
• Waveguide Terminations
• DC/Control Functions
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TYPES OF API TECHNOLIGES’ POWER AMPLIFIERS
Power Amplifier Drivers
• Output Power up to 10 watts
• Includes Class A, and AB Linear Amplifiers
• Operating Frequencies to 26GHz
• Narrow and Broadband
CW Power Amplifiers
• Output Power to 500 watts
• Includes Class A, AB Linear and C
• Operating Frequencies to 26GHz
• Narrow and Broadband
Pulsed Power Amplifiers
• Output Power to 1,000 watts
• Includes Class A, AB Linear, and C
• Operating Frequencies to 26GHz
• Narrow and Broadband
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FULL OF STANDARD FEATURES
Wide bandwidth and high efficiency are not
the only features offered in our full line of
higher power amplifiers. API also
incorporates many features not normally
found in power amplifiers, including:
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Built-in User Control Interfaces
High input protection circuitry
Built-in monitoring
Voltage Regulators
Thermal temperature
compensating circuits
Harmonic Filters
Fault Monitoring
Customizable Control Functions
Custom Designs Available
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VERTICAL INTEGRATION
More than just single function product designs!
We are vertically integrated, drawing from
specialists in multiple disciplines such as…
• Filtered Power Amplifiers
• In-house Thin Film Fabrication
• PIN Diode Switches
• FET Switches
• GaAs Switches
• RF & Microwave Filters
• Switched Filter Banks & Integrated Products
• Driver Circuits – Hybrid & SMT
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VERTICAL INTEGRATION
Our engineers are experts at amplifier,
filter and power supply design. Integrating
multiple components in a single housing
reduces overall costs and package housing
size while optimizing heat transfer.
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THE POWER AMPLIFIER ADVANTAGE
The API Technologies Advantage
Multiple Technologies: Modular Designs,
Thin Film, SMT, Chip-and-Wire,
System Integration
Modular SMT
Results: Reduced Size,
Excellent RF Performance,
Improved Thermal Performance
System Integration
Surface Mount
Amplifier (SMT)
Thin Film
Micro-electronic
SMT Pallet
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POWER AMPLIFIER OVERVIEW
2.4 GHz, 2 Watt, Transceiver
180 MHz, 100 watt, PA
225 to 400 MHz
40 watt PA
900 MHz, 40 Watt
Mobile Wireless PA
1930 to 1990 MHz,
40 watt average, 360 watt peak,
mobile wireless, linearized, PA
2 to 6 GHz,
5 watt GaN PA
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API, a world class leader in
amplifier technology, is your full
service partner for high
performance power amplification
requirements.
Designed To Perform
Efficient amplification is a system designer’s
goal and we design Linear Class A, Class AB
and Non-Linear Class C high power amplifiers
using the latest technology such as GaN, GaAs
and LDMOS. Products include both broadband,
high linearity amplifiers, as well as high
frequency, narrowband, higher power amplifiers
to 100 watts with strict attention to size and
value.
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FULL CUSTOMIZATION
What separates API from
other Power Amp vendors?
• Complete custom solutions in a timely manner
• In-house machining and full technology integration for
rapid turn-around prototypes
• Sophisticated software to optimize package layouts for a
variety of thermal conditions (modules, pallets, surface
mount and substrate drop-in)
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PERFORMANCE ENHANCEMENTS
API builds added features into its
lineup of power amplifiers including:
 Fault Reporting.
 Control & Configuration Monitoring using RS-232,
RS-485, MODBUS, I2C, CAN and other protocols.
 High Efficiency Doherty techniques integrated.
 Optimized for Cross-Cancellation Linearization.
 Drain Boost Efficiency Enhancements Implemented.
 Power & Coupler Feedback techniques employed.
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ENGINEERING CAPABILITIES
State-of-the-Art Engineering
Using state-of-the-art software and simulation tools, our experience engineering
team is able to quickly take a requirement from concept to production.
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Ansoft HFSS
Ansoft Designer
Microwave Office
Agilent ADS Design Suite
SolidWorks
Labview
Agilent Genesys
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AutoCAD
Cadence Allegro
Sonnet EM Simulator
PSpice
PCad
Or Cad
Finite Element Analysis for Thermals
3D SolidWorks
modeling is
used to predict
filter profiles as
well as to
optimize PCB
layouts.
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DESIGNED TO PERFORM
• Design Power Amps using GaN
transistor technology in both packaged
and bare die form
• Nonlinear RF simulation capability of
the GaN die
• Detailed theoretical thermal analysis a
measurement correlations capability of
actual performance
• Unified Design Tools
• Genesys, Ansoft HFSS, Labview
• SolidWorks, Cadence Allegro, AutoCAD
• FLIR Thermal Imaging,
Sonnet EM Simulator
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EXCEEDING EXPECTATIONS
Utilizing both hybrid thick film and SMT technology, our
power amplifiers draw from a wide range of leading edge
semiconductors including:
• Silicon MOSFET
• LDMOS
• GaAs
• GaN
• SiC
• MESFET
• Bipolar
• GaAs PHEMT
API’s design engineers focus their
expertise not only on meeting the
customer’s requirements, but on
exceeding expectations. Other
companies talk about technology.
The performance of our sophisticated
designs speak for itself.
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SEMI CONDUCTOR COMPARISON
LDMOS
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GAS FET
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Linear Applications
Low Phase Noise Performance
Low Cost Applications
Operates at Frequencies up to 3.5GHz
Not used in rugged designs
Isolators / Circulators are required in circuit operation
Linear Applications
5X more expensive than LDMOS
Operates to frequencies up to 26GHz
Require +10VDC Operation For Linear Applications
Narrow Bandwidth Operation
GaN Designs
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Saturated Output Power Applications
Rugged Designs
Operates at Frequencies to 26GHz
Requires input supply voltage >+25VDC
Suited for wide band operation
10X more expensive than LDMOS AND 2x more
expensive than GAS Fets.
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BASIC POWER AMPLIFIER PARAMETERS
Amplifiers, Classes of Operation
Conduction Angle, Fidelity, Efficiency vs. Amplifier Class
Amplifier
Class
Conduction
Angle
Fidelity
Efficiency
A
360 º
High
Low
AB
>180º and < 360 º
B
180 º
C
< 180 º
Low
High
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POWER AMPLIFIERS | CLASS A
Class A, Linear, Power Amplifiers
• Best Linearity
• Best Fidelity
• Lowest Efficiency
• Intercept Point is Typically 10 dB
above the P1dB
• Intercept Point relates only to
Class A amplifiers
IIP2 = IMD2 + Pwr
P1dB
Psat
(dBm)
IIP3 = IMD3/2 + Pwr (dBm)
SFDR2 = 0.50(IIP2 – 10logKTB – NF)
SFDR3 = 0.67(IIP3 + 10logKTB – NF)
INPUT POWER
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POWER AMPLIFIERS | CLASS AB
• Operate at a quiescent bias
“Sweet Spot” for best linearity
• Better Efficiency Than Class A
biased Amplifier
Class "AB" Amplifier
P1dB
Gain Slope
• Linearity is bias sensitive
Pout
Psat
Class "A" Amplifier
Gain Slope
Un-corrected
Linearity Corrected
Pin
Gain Slope Comparison, Class A
vs. Class AB Amplifier
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POWER AMPLIFIERS | CLASS AB
Output Signal
The Effect
Input Signal
Quiescent Current Set for “Sweet Spot”
at a Particular Power Level
Effects on Digital Modulated
Spread Spectrum Signal
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POWER AMPLIFIERS | CLASS C
• Biased OFF for < 180 º Conduction Angle
• Better Efficiency Than Class AB biased Amplifier
• Not used for Linear Applications
Class "C" Amplifier
Gain Slope
Pout
Class "AB" Amplifier
P1dB
Gain Slope
Psat
Class "A" Amplifier
Gain Slope
Pin
Gain Slope Comparison, Class A
vs. Class AB Amplifier
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GAIN BLOCKS
• Frequency range: 1 MHz to 18 GHz
• RF/IF drivers and LO buffer amps in Integrated Microwave Assemblies (IMAs)
• Transistor die - extended operating temperature range, -55oC to +125oC
• Power feedback below 1.5 GHz - high reverse isolation reducing load sensitivity
• Frequency selective matching circuits reduces “out-of-band” gain
• Improved efficiency with autotransformers and current sharing
• Utilize the latest technologies: GaN, GaAs, LDMOS
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QB-911
Frequency 2-18 GHz (4 phase tracked amplifier assemblies)
Consists of…
Power Conditioning, EMC Suppression and
Temperature Compensation
J9
J1 (RF IN)
Gain Slope
Adjust
J9
Coupling
AR2
2 stage amplifier (4 channels)
Broadband detector
Gain compensator
Digital fault circuits
Power conditioning
Complex packaging
AR1
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J2 (RF Out)
Equalizer
C1
A1
Bit J2
Vdc
Channel 1
J4 (RF IN)
J3 (RF Out)
Channel 2
J5 (RF IN)
Channel 3
J8 (RF IN)
Channel 4
Bit J3
J6 (RF Out)
Bit J6
J7 (RF Out)
Bit J7
Band 2/3 Amplifier Module Assembly
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MANUFACTURING EXPERTISE
• Void-free die attach process for uniform
coverage and optimum thermal performance
• Extensive handling and mounting expertise
with very large geometry transistor die
• Waveguide combined satellite communication
Power Amps up to EHF frequencies.
• Braised waveguide splitter/combiner
structures
• In-house Laser Sealing for Hermetic and
Environmental Integrity
• In-house Thin & Thick Film
• Precision Hybrid & MIC
• Automated SMT & CCA
• In-house SAW Fab
• Precision Machining
• Comprehensive Metal Works
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Prototype/
Production Centers
Fabrication &
Assembly
Electrical &
Environmental
Testing
MANUFACTURING CAPABILITIES
Prototype Machining
CMM (Coordinate
Measurement Machine)
Laser Welding
J-STD-001, Class 3
Soldering
SMT/Pick n Place
Hybrid Assembly
Automated Test &
Data Recording
Extensive Burn-in and
Thermal Cycling Capabilities
Shock & Vibration
Testing
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• Full RF/Microwave and Environmental Testing
• Complete ATE Development
EXTENSIVE TESTING
• EMC Testing
• 100% Electrical Testing
• Shock Testing & On-site Random and Sinusoidal
Vibration to 30g
• Conversion Gain
• Spurious Testing
• IP2, IP3 and IP2H
• Current Draw
• Noise Figure
• Windowed Gain Ripple
• Compression Tests
• Linearity Testing
• LO Leakage Testing
• Image Rejection
• Group Delay
• Temperature Cycling (-55°C to +85°C)
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API TECHNOLOGIES’
FEATURED CERTIFICATIONS
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All Manufacturing Facilities Certified to ISO 9001:2008
6 Certified AS9100 Facilities
ANSI 20.20 Compliant Facilities
Department of State ITAR Compliant
Cleared Facilities & Personnel
Six Sigma Greenbelts
Hybrid Lab certified MIL-PRF-38534 (Class H and K)
QPL MIL-PRF-15733 & MIL-PRF-28861 (Selected Products)
MIL-STD 790 (DSCC), MIL-STD 1553 (Data Bus), MIL-STD 883 (Hybrid),
MIL-STD 202 (Passive), MIL-STD-810 (Systems), MIL-STD 461
A/B/C/D/E (EMC), MIL-STD 1399 Surge (EMC)
Solder/Assembly J-STD-001 Class 3 and IPC-A-610
NEBS Approved (Selected Products)
RoHS Compliant (Selected Products)
TEMPEST Certifications including: CID/09/15(A), NSTISSAM
TEMPEST/I-92, SDIP 27.
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CONTACTS
Power Amplifier
Points of Contact
Dennis Barrick
• Technical Marketing Manager
• Office: (814) 272-2765
• Mobile: (814) 460-5945
• Email: [email protected]
Jim Callaway
• Engineering Manager
• Office: 321-426-9011
• Email: [email protected]
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