Datasheet

PI6CFGL202B
Low Power PCIe 3.0 Clock Generator with 2 HCSL Outputs
Features
Description
ÎÎPCIe® 3.0, 2.0 and 1.0 compliant
The PI6CFGL202B is a spread spectrum clock generator compliant to PCI Express® 3.0 and Ethernet requirements. The device is
used for PC or embedded systems to substantially reduce Electromagnetic Interference (EMI).
ÎÎLVDS compatible outputs
ÎÎSupply voltage of 3.3V ±10%
ÎÎ25MHz crystal or clock input frequency
ÎÎLow power consumption with independent output power
The PI6CFGL202B provides two differential (HCSL) or LVDS
spread spectrum outputs. The PI6CFGL202B is configured to select spread and clock selection. Using Pericom's patented PhaseLocked Loop (PLL) techniques, the device takes a 25MHz crystal
input and produces two pairs of differential outputs (HCSL) at
25MHz, 100MHz, 125MHz and 200MHz clock frequencies. It
also provides spread selection of -0.5%, -0.75%, and no spread.
supply 1.05V to 3.3V
ÎÎJitter 35ps cycle-to-cycle (typ)
ÎÎSpread of -0.5%, -0.75%, and no spread
ÎÎIndustrial temperature range
ÎÎSpread Bypass option available
ÎÎSpread and frequency selection via external pins
ÎÎPackaging: (Pb-free and Green)
àà 16-pin TSSOP (L16)
Pin Configuration (16-Pin TSSOP)
Block Diagram
VDD
2
SS1:SS0
S1:S0
2
Control
Logic
Pulling
Capacitors
1
16
VDDA3.3
CLK0
S1
2
15
CLK0
CLK0
SS0
3
14
CLK0#
XTAL_IN
4
13
GNDA
XTAL_OUT
5
12
VDDO
OE
6
11
CLK1
GNDX
7
10
CLK1#
SS1
8
9
Phase
Lock
Loop
2
XTAL_IN or Ref CLK
25 MHz
crystal or clock
XTAL_OUT
S0
CLK1
CLK1
Crystal
Driver
2
GND
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VDDDIG3.3
OE
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3B
557-0
PI6C
PI6CFGL202B
Low Power PCIe 3.0 Clock Generator with 2 HCSL Outputs
Pin Description
Pin # Pin Name
Type
Description
1
S0
Input
Select pin 0 (Internal pull-up resistor). See Table 1.
2
S1
Input
Select pin 1 (Internal pull-up resistor). See Table 1.
3
SS0
Input
Spread Select pin 0 (Internal pull-up resistor). See Table 2.
4
XTAL_IN
Input
Crystal or clock input. Connect to a 25MHz crystal or single ended clock.
5
XTAL_OUT
Output
Crystal connection. Leave unconnected for clock input.
6
OE
Input
Output enable. Internal pull-up resistor.
7
GNDX
Power
Crystal ground pin.
8
SS1
Input
Spread Select pin 1 (Internal pull-up resistor). See Table 2.
9
VDDDIG3.3
Power
3.3V digital power.
10
CLK1#
Output
HCSL compliment clock output, LOW when output is disabled.
11
CLK1
Output
HCSL clock output, LOW when output is disabled.
12
VDDO
Power
Power supply, nominal 1.8V, range1.05V~3.3V.
13
GNDA
Power
Output and analog circuit ground.
14
CLK0#
Output
HCSL compliment clock output, LOW when output is disabled.
15
CLK0
Output
HCSL clock output, LOW when output is disabled.
16
VDDA3.3
Power
3.3V power supply for PLL core.
Table 2: Spread Selection Table
Table 1: Frequency Select Table
S1
S0
CLK(MHz)
SS1
SS0
Spread
0
0
25
0
0
No Spread
0
1
100
0
1
Down -0.5
1
0
125
1
0
Down -0.75
1
1
200
1
1
No Spread
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PI6CFGL202B
Low Power PCIe 3.0 Clock Generator with 2 HCSL Outputs
Test Loads
Low-Power HCSL Differential Output Test Load
5 inches
Rs
Zo=100Ω
Rs
2pF
2pF
Device
RO
Driving LVDS
3.3V
Driving LVDS
R7a
R7b
R8a
R8b
Cc
Rs
Zo
Cc
Rs
Device
LVDS Clock
input
R
Driving LVDS inputs with the PI6CFGL202B
Value
Component
Receiver has termination
Receiver does not have termination
R7a, R7b
10K Ω
140 Ω
R8a, R8b
5.6K Ω
75 Ω
Cc
0.1 uF
0.1 uF
1.2 volts
1.2 volts
Vcm
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PI6CFGL202B
Low Power PCIe 3.0 Clock Generator with 2 HCSL Outputs
Maximum Ratings
(Above which useful life may be impaired. For user guidelines, not tested.)
Supply Voltage to Ground Potential.......................................................4.6V
All Inputs and Output......................................................-0.5V toVDD+0.5V
Ambient Operating Temperature............................................ -40 to +85°C
Storage Temperature........................................................... –65°C to +150°C
Junction Temperature........................................................................... 125°C
Note: Stresses greater than those listed under MAXIMUM RATINGS may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any
other conditions above those indicated in the operational sections
of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect reliability.
Soldering Temperature.......................................................................... 260°C
ESD Protection (Input)............................................................2000V(HBM)
Electrical Characteristics–Current Consumption
(TA = -40~85oC; VDD = 3.3V+/-10%; VDDO = 1.8V+/-10%, See Test Loads for Loading Conditions)
Symbol
Parameters
Condition
Min.
IDDOP
Operating supply current1
Total power consumption, All outputs active
@100MHz
Typ.
Max.
Units
52
mA
Notes:
1. Guaranteed by design and characterization, not 100% tested in production.
Electrical Characteristics–Input/Supply/Common Parameters–Normal Operating
Conditions (TA = -40~85oC; VDD = 3.3V+/-10%; VDDO = 1.8V+/-10%, See Test Loads for Loading Conditions)
Symbol
Parameters
Condition
Min.
Typ.
Max.
Units
VDDX
Supply Voltage1
Supply voltage for core, analog
3.0
3.3
3.6
V
VDDO
Supply Voltage
Supply voltage outputs
1.65
1.8
2.0
V
VIH
Input High Voltage1
OE, S0, S1, SS0, SS1
0.65
VDD
VDD +
0.3
V
VIL
Input Low Voltage1
OE, S0, S1, SS0, SS1
-0.3
0.35
VDD
V
Single-ended inputs, VIN = GND, VIN = VDD (exclude XTAL pin)
-5
5
uA
-200
200
uA
26
MHz
7
nH
1
IIN
Single-ended inputs
Input Current1
VIN = 0 V; Inputs with internal pull-up resistors
IINP
VIN = VDD; Inputs with internal pull-down resistors
Fin
Input Frequency
Lpin
Pin Inductance
1
CIN
CINDIF_IN
Capacitance
1,4
23
25
Logic Inputs, except DIF_IN
1.5
5
pF
DIF_IN differential clock inputs
1.5
2.7
pF
6
pF
1
ms
Output pin capacitance
COUT
TSTAB
XTAL or X1 input
1
Clk Stabilization1,2
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From VDD Power-Up and after input clock
stabilization
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PI6CFGL202B
Low Power PCIe 3.0 Clock Generator with 2 HCSL Outputs
Symbol
f MODIN
Parameters
Condition
Input SS Modulation
Allowable Frequency
Frequency1
(Triangular Modulation)
Min.
Typ.
Max.
Units
30
31.500
33
kHz
TOE
Output Enable Time1
All output
10
μs
tOT
Output Disable Time
All output
10
μs
tSTABLE
From Power-up to
VDD =3.3V1
From Power-up VDD =3.3V
3.0
ms
tSPREAD
Setting period after
spread change1
Setting period after spread change
3.0
ms
1
Note:
1. Guaranteed by design and characterization, not 100% tested in production.
2. Control input must be monotonic from 20% to 80% of input swing. Input Frequency Capacitance
3. Time from deassertion until outputs are >200 mV
4. DIF_IN input
Electrical Characteristics–CLK 0.7V Low Power HCSL Outputs (TA = -40~85oC; VDD = 3.3V+/10%; VDDO = 1.8V+/-10%, See Test Loads for Loading Conditions)
Symbol
Parameters
Condition
Trf
Slew rate
VHIGH
Voltage High
VLOW
Voltage Low1
Statistical measurement on single-ended signal
using oscilloscope math function. (Scope averaging on)
Vmax
Max Voltage1
Measurement on single ended signal using
Vmin
Min Voltage
absolute value. (Scope averaging off)
-300
mV
Vswing
Vswing
Scope averaging off
300
mV
Vcross_abs
Crossing Voltage (abs)
Scope averaging off
250
Δ-Vcross
Crossing Voltage (var)
Scope averaging off
tDC
Duty Cycle
tskew
Skew, Output to Output
tjcyc-cyc
Jitter, Cycle to cycle
1,2,3
1
1
1,2
1,5
1,6
1
1,2
Typ.
Max.
Units
1.1
2
4.5
V/ns
660
950
mV
-150
150
mV
1150
mV
550
mV
140
mV
55
%
VT = 50%
50
ps
PLL mode @100MHz output, SSC off
50
ps
Measured differentially, PLL Mode
1
Min.
45
Note:
1. Guaranteed by design and characterization, not 100% tested in production.
2. Measured from differential waveform
3. Slew rate is measured through the Vswing voltage range centered around differential 0V. This results in a +/-150mV window around differential 0V.
4. Matching applies to rising edge rate for Clock and falling edge rate for Clock#. It is measured using a +/-75mV window centered on the average cross point
where Clock rising meets Clock# falling. The median cross point is used to calculate the voltage thresholds the oscilloscope is to use for the edge rate calculations.
5. Vcross is defined as voltage where Clock = Clock# measured on a component test board and only applies to the differential rising edge (i.e. Clock rising and
Clock# falling).
6. The total variation of all Vcross measurements in any particular system. Note that this is a subset of Vcross_min/max (Vcross absolute) allowed. The intent is
to limit Vcross induced modulation by setting Δ-Vcross to be smaller than Vcross absolute.
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PI6CFGL202B
Low Power PCIe 3.0 Clock Generator with 2 HCSL Outputs
Electrical Characteristics–Phase Jitter Parameters
(TA = -40~85oC; VDD = 3.3V+/-10%; VDDO = 1.8V+/-10%, See Test Loads for Loading Conditions)
Symbol
Parameters
tjphPCIeG1
Condition
Min.
PCIe Gen 11,2,3,5
PCIe Gen 2 Low Band
tjphPCIeG2
Phase Jitter,
PCI Express
10kHz < f < 1.5MHz1,2,5
PCIe Gen 2 High Band
1.5MHz < f < Nyquist (50MHz)1,2,5
PCIe Gen 3
tjphPCIeG3
(PLL BW of 2-4MHz, CDR = 10MHz)
1,2,4,5
Typ.
Industry Limit
25
86
0.9
3
1.6
3.1
0.36
1
Units
ps
(p-p)
ps
(rms)
ps
(rms)
ps
(rms)
Notes:
1. Guaranteed by design and characterization, not 100% tested in production.
2. See http://www.pcisig.com for complete specs.
3. Sample size of at least 100k cycles. This figures extrapolates to 108ps pk-pk @ 1M cycles for a BER of 1-12.
4. Calculated from Intel-supplied Clock Jitter Tool.
5. Applies to all different outputs.
Thermal Characteristics
Symbol
Parameter
Conditions
θJA
Thermal Resistance Junction to Ambient
θJC
Thermal Resistance Junction to Case
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Still air
6
Min.
Typ.
Max.
Unit
90
°C/W
24
°C/W
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PI6CFGL202B
Low Power PCIe 3.0 Clock Generator with 2 HCSL Outputs
Application Notes
Crystal circuit connection
The following diagram shows crystal circuit connection with a parallel crystal. For the CL=18pF crystal, it is suggested to use C1=
27pF, C2= 27pF. C1 and C2 can be adjusted to fine tune to the target ppm of crystal oscillator according to different board layouts.
Crystal Oscillator Circuit
XTAL_IN
C1
27pF
SaRonix-eCera
FL2500047
Crystal�(CL�=�18pF)
XTAL_OUT
C2
27pF
ASIC
X1
CL= crystal spec. loading cap.
X2
Cj
Cj = chip in/output cap. (3~5pF)
Cj
Cb = PCB trace/via cap. (2~4pF)
Cb
Rf
C1
Pseudo
sine
C1,2 = load cap. components
Rd
Cb
Rd = drive level res. (100Ω)
C2
Final choose/trim C1=C2=2 *CL - (Cb +Cj) for the target +/-ppm
Example: C1=C2=2*(18pF) – (4pF+5pF)=27pF
Recommended Crystal Specification
a) FL2500047, SMD 3.2X2.5(4P), 25MHz, CL=18pF, +/-20ppm, http://www.pericom.com/pdf/datasheets/se/FL.pdf
b) FY2500091, SMD 5x3.2(4P), 25MHz, CL=18pF, +/-30ppm, http://www.pericom.com/pdf/datasheets/se/FY_F9.pdf
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PI6CFGL202B
Low Power PCIe 3.0 Clock Generator with 2 HCSL Outputs
Packaging Mechanical: 16-Pin TSSOP (L)
DATE: 05/03/12
Notes:
1. Refer JEDEC MO-153F/AB
2. Controlling dimensions in millimeters
3. Package outline exclusive of mold flash and metal burr
DESCRIPTION: 16-Pin, 173mil Wide TSSOP
PACKAGE CODE: L
DOCUMENT CONTROL #: PD-1310
REVISION: F
12-0372
Note: For latest package info, please check: http://www.pericom.com/products/packaging/mechanicals.php
Ordering Information
Ordering Code
Package Code
PI6CFGL202BLIE
L
Description
16-pin, 173mil Wide (TSSOP)
Notes:
• Thermal characteristics can be found on the company web site at www.pericom.com/packaging/
• "E" denotes Pb-free and Green
• Adding an "X" at the end of the ordering code denotes tape and reel packaging
Pericom Semiconductor Corporation • 1-800-435-2336
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