Cree, CMPA2560025F 25W, ,2.5-6.0GHz, GaN HEMT

CMPA2560025F
25 W, 2500 - 6000 MHz, GaN MMIC Power Amplifier
Cree’s CMPA2560025F is a gallium nitride (GaN) High Electron Mobility
Transistor (HEMT) based monolithic microwave integrated circuit (MMIC).
GaN has superior properties compared to silicon or gallium arsenide, including
higher breakdown voltage, higher saturated electron drift velocity and higher
thermal conductivity. GaN HEMTs also offer greater power density and wider
bandwidths compared to Si and GaAs transistors. This MMIC contains a
two-stage reactively matched amplifier enabling very wide bandwidths to
be achieved in a small footprint screw-down package featuring a CopperTungsten heat-sink.
PN: CMPA2560
025F
Package Type
: 780019
Typical Performance Over 2.5-6.0 GHz (TC = 25˚C)
Parameter
2.5 GHz
4.0 GHz
6.0 GHz
Units
Gain
27.5
24.3
23.1
dB
Saturated Output Power, PSAT1
35.8
37.5
25.6
W
Power Gain @ POUT 43 dBm
23.1
20.9
16.3
dB
PAE @ POUT 43 dBm
31.5
32.8
30.7
%
Note : PSAT is defined as the RF output power where the device starts to draw positive gate current in the range of 7-13 mA.
1
Features
Applications
• 24 dB Small Signal Gain
• Ultra Broadband Amplifiers
• 25 W Typical PSAT
• Fiber Drivers
• Operation up to 28 V
• Test Instrumentation
• High Breakdown Voltage
• EMC Amplifier Drivers
15
Rev 3.0 – May 20
• High Temperature Operation
Figure 1.
Subject to change without notice.
www.cree.com/rf
1
Absolute Maximum Ratings (not simultaneous) at 25˚C
Symbol
Rating
Drain-source Voltage
Parameter
VDSS
84
Units
VDC
Gate-source Voltage
VGS
-10, +2
VDC
Storage Temperature
TSTG
-65, +150
˚C
Operating Junction Temperature
TJ
225
˚C
Forward Gate Current
IG
13
mA
Screw Torque
Thermal Resistance, Junction to Case
T
40
in-oz
RθJC
2.5
˚C/W
Electrical Characteristics (Frequency = 2.5 GHz to 6.0 GHz unless otherwise stated; TC = 25˚C)
Characteristics
Symbol
Min.
Typ.
Max.
Units
Conditions
Gate Threshold Voltage
V(GS)TH
-3.8
-3.0
-2.3
V
Gate Quiescent Voltage
V(GS)Q
–
-2.7
–
VDC
Drain-Source Breakdown Voltage
VBD
84
100
–
V
VGS = -8 V, ID = 20 mA
Saturated Drain Current1
IDC
8.0
9.7
–
A
VDS = 6.0 V, VGS = 2.0 V
Small Signal Gain
S21
19.5
24
–
dB
VDD = 28 V, ID = 1200 mA
Input Return Loss
S11
–
-8
-5
dB
VDD = 28 V, ID = 1200 mA
Output Return Loss
S22
–
-8
-3
dB
VDD = 28 V, ID = 1200 mA
Power Output1
POUT
22.0
30
–
W
VDD = 28 V, ID = 1200 mA, PIN = 26 dBm, Freq = 4.0 GHz
Power Output2
POUT
12.5
17
–
W
VDD = 28 V, ID = 1200 mA, PIN = 26 dBm, Freq = 5.0 GHz
Power Output3
POUT
15.5
20
–
W
VDD = 28 V, ID = 1200 mA, PIN = 26 dBm, Freq = 6.0 GHz
Power Added Efficiency1
PAE
34
40
–
%
VDD = 28 V, ID = 1200 mA, PIN = 26 dBm, Freq = 4.0 GHz
Power Added Efficiency2
PAE
20
26
–
%
VDD = 28 V, ID = 1200 mA, PIN = 26 dBm, Freq = 5.0 GHz
Power Added Efficiency3
PAE
24
30
–
%
VDD = 28 V, ID = 1200 mA, PIN = 26 dBm, Freq = 6.0 GHz
Power Gain1
GP
17.5
18.8
–
dB
VDD = 28 V, ID = 1200 mA, PIN = 26 dBm, Freq = 4.0 GHz
Power Gain2
GP
15.0
16.3
–
dB
VDD = 28 V, ID = 1200 mA, PIN = 26 dBm, Freq = 5.0 GHz
Power Gain3
GP
16.0
17.0
–
dB
VDD = 28 V, ID = 1200 mA, PIN = 26 dBm, Freq = 6.0 GHz
VSWR
–
–
5:1
Y
No damage at all phase angles,
VDD = 28 V, IDQ = 1200 mA, PIN = 26 dBm
DC Characteristics
RF Characteristics
VDS = 10 V, ID = 20 mA
VDD = 28 V, ID = 1200 mA
2
Output Mismatch Stress
Notes:
1
Scaled from PCM data.
2
All data CW tested in CMPA2560025F-AMP.
Copyright © 2008-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific
product and/or vendor endorsement, sponsorship or association.
2
CMPA2560025F Rev 3.0
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
www.cree.com/rf
Typical Performance
30
0
28
-2
26
-4
24
-6
22
-8
Gain (dB)
Gain (dB)
Small Signal Gain vs Frequency
Input & Output Return Losses
vs Frequency
20
18
S22 Typical
-10
-12
16
-14
14
-16
12
-18
10
S11 Typical
-20
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
2.0
2.5
3.0
3.5
4.0
Frequency (GHz)
4.5
5.0
5.5
6.0
6.5
Frequency (GHz)
Power Gain vs Frequency
Gain vs Output Power as
a Function of Frequency
30
30
28
28
Output Power = 44 dBm
26
Output Power = 43 dBm
24
24
22
22
Gain (dB)
Power Gain (dB)
26
20
18
20
2.5 GHz
18
4.0 GHz
16
16
14
14
12
12
6.0 GHz
10
10
2.0
2.5
3.0
3.5
4.0
4.5
Frequency (GHz)
5.0
5.5
6.0
6.5
18
22
26
30
Copyright © 2008-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific
product and/or vendor endorsement, sponsorship or association.
3
CMPA2560025F Rev 3.0
34
38
42
46
Output Power (dBm)
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
www.cree.com/rf
Typical Performance
Saturated Output Power Performance (PSAT) vs Frequency
50
Frequency (GHz)
PSAT (dBm)
PSAT (W)
2.5
45.54
35.8
47
3.0
44.43
27.7
46
3.5
45.52
35.7
45
4.0
45.74
37.5
44
4.5
44.82
30.4
43
5.0
45.08
32.2
5.5
45.07
32.1
6.0
44.08
25.6
Saturated Output Power, PSAT (dBm)
49
48
Typical Psat (dBm)
42
41
40
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
Frequency (GHz)
Note: PSAT is defined as the RF output power where the device starts to draw positive gate current in the range of 7-13 mA.
45%
45%
40%
40%
2.5 GHz
35%
Power Added Efficiency, PAE (%)
Power Added Efficiency, PAE (%)
Power Added Efficiency vs Output Power
PAE at 43 dBm and 44 dBm Output
as a Function of Frequency
Power vs Frequency
4.0 GHz
30%
6.0 GHz
25%
20%
15%
10%
5%
35%
30%
25%
20%
15%
PAE 44 dBm
PAE 43 dBm
10%
5%
0%
18
20
22
24
26
28
30
32
34
36
Output Power, POUT (dBm)
38
40
42
44
46
0%
2.0
2.5
3.0
3.5
4.0
Copyright © 2008-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific
product and/or vendor endorsement, sponsorship or association.
4
CMPA2560025F Rev 3.0
4.5
5.0
5.5
6.0
6.5
Frequency (GHz)
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
www.cree.com/rf
Typical Performance
2ND Harmonic vs Output Power
as a Function of Frequency
0
IM3 vs Total Average Power as a Function of Frequency
0
2.5 GHz
-10
-5
4.0 GHz
6.0 GHz
4.0 GHz
-15
-20
6.0 GHz
-20
-30
IM3 (dBc)
2ND Harmonic (dBc)
2.5 GHz
-10
-40
-25
-30
-35
-40
-50
-45
-50
-60
-55
-60
-70
22
24
26
28
30
32
34
36
38
40
42
44
46
22
24
26
28
30
32
34
36
38
40
42
44
Total Average Output Power (dBm)
Output Power, POUT (dBm)
Gain at POUT of 40 dBm at
25°C & 75°C vs Frequency
30
25
Gain (dB)
20
15
Ambient (25°C)
10
Hot (75°C)
5
0
2.5
2.8
3.1
3.4
3.7
4.0
Frequency (GHz)
Note: The temperature coefficient is -0.05 dB/°C
Copyright © 2008-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific
product and/or vendor endorsement, sponsorship or association.
5
CMPA2560025F Rev 3.0
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
www.cree.com/rf
General Device Information
The CMPA2560025F is a two stage GaN HEMT MMIC Power Amplifier, which operates between 2.5- 6.0 GHz. The amplifier
typically provides 25 dB of small signal gain and 25 W saturated output power with an associated power added efficiency of better than
30 %. The wideband amplifier’s input and output are internally matched to 50 Ohm. The amplifier requires bias from dedicated ports.
The RF-input and output both require an external DC-block. DC voltage should not be applied to the RF output pin due to the internal
matching elements. The two gate pins, G1 and G2, are internally connected so it is sufficient to apply bias to only one of them. The drain
pins, D1 and D2, should both be connected to the drain supply. The component has internal DC-decoupling on the gate and drain pins,
1840pF and 920pF respectively. The test fixture also provides extra decoupling capacitors on all supply lines. Details of these components can be found on the bill of materials.
The CMPA2560025F is provided in a lead-less package format. The input and output connections are gold plated to enable
gold bond wire attach at the next level assembly.
The measurements in this data sheet were taken on devices wire-bonded to the test fixture with 2 mil gold bond wires. All
losses associated with the test fixture are included in the measurements.
Electrostatic Discharge (ESD) Classifications
Parameter
Symbol
Class
Test Methodology
Human Body Model
HBM
1A (> 250 V)
JEDEC JESD22 A114-D
Charge Device Model
CDM
II (200 < 500 V)
JEDEC JESD22 C101-C
Copyright © 2008-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific
product and/or vendor endorsement, sponsorship or association.
6
CMPA2560025F Rev 3.0
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
www.cree.com/rf
CMPA2560025F CW Power Dissipation De-rating Curve
CMPA2560025F Derating
70
DC Power Dissipation (W)
60
50
40
30
20
Note 1
10
0
0
50
100
150
200
250
Maximum Case Temperature (C)
Note 1. Area exceeds Maximum Case Operating Temperature (See Page 2).
Copyright © 2008-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific
product and/or vendor endorsement, sponsorship or association.
7
CMPA2560025F Rev 3.0
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
www.cree.com/rf
CMPA2560025F-AMP Demonstration Amplifier Circuit
CMPA2560025F-AMP Demonstration Amplifier Circuit Outline
Copyright © 2008-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific
product and/or vendor endorsement, sponsorship or association.
8
CMPA2560025F Rev 3.0
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
www.cree.com/rf
CMPA2560025F-AMP Demonstration Amplifier Circuit Bill of Materials
Designator
Description
Qty
J1,J2
CONNECTOR, SMA, AMP1052901-1
2
J3
HEADER, RT. PLZ. 1, CEN LK, 5 POS
1
C1,C2,C3
CAP, 2400 pF, BROADBAND BLOCK, C08BL242X-5UNX0T 2
3
C4,C5,C6
CAP, 0.1 UF, +/- 10 % , 0805
3
RES, 0 OHM, 1206
1
PCB, TACONIC, RF-35-0100-CH/CH
1
CMPA2560025F
1
R1
Q1
Notes
1
The CMPA2560025F is connected to the PCB with 2.0 mil Au bond wires.
2
An external DC Block is required on the input and output.
Product Dimensions CMPA2560025F (Package Type —
­ 780019)
PRELIMINARY
Copyright © 2008-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific
product and/or vendor endorsement, sponsorship or association.
9
CMPA2560025F Rev 3.0
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
www.cree.com/rf
Product Ordering Information
Order Number
Description
Unit of Measure
CMPA25650025F
GaN HEMT
Each
Test board without GaN HEMT
Each
Test board with GaN HEMT installed
Each
CMPA2560025F-TB
CMPA2560025F-AMP
Copyright © 2008-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific
product and/or vendor endorsement, sponsorship or association.
10
CMPA2560025F Rev 3.0
Image
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
www.cree.com/rf
Disclaimer
Specifications are subject to change without notice. Cree, Inc. believes the information contained within this data sheet to be accurate
and reliable. However, no responsibility is assumed by Cree for its use or for any infringement of patents or other rights of third parties
which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Cree. Cree makes
no warranty, representation or guarantee regarding the suitability of its products for any particular purpose. “Typical” parameters are the
average values expected by Cree in large quantities and are provided for information purposes only. These values can and do vary in
different applications, and actual performance can vary over time. All operating parameters should be validated by customer’s technical
experts for each application. Cree products are not designed, intended, or authorized for use as components in applications intended for
surgical implant into the body or to support or sustain life, in applications in which the failure of the Cree product could result in personal
injury or death, or in applications for the planning, construction, maintenance or direct operation of a nuclear facility. CREE and the CREE
logo are registered trademarks of Cree, Inc.
For more information, please contact:
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
www.cree.com/RF
Sarah Miller
Marketing
Cree, RF Components
1.919.407.5302
Ryan Baker
Marketing & Sales
Cree, RF Components
1.919.407.7816
Tom Dekker
Sales Director
Cree, RF Components
1.919.407.5639
Copyright © 2008-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific
product and/or vendor endorsement, sponsorship or association.
11
CMPA2560025F Rev 3.0
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
www.cree.com/rf