CGHV60170D 170 W, 6.0 GHz, 50V GaN HEMT Die Cree’s CGHV60170D is a gallium nitride (GaN) High Electron Mobility Transistor (HEMT). GaN has superior properties compared to silicon or gallium arsenide, including higher breakdown voltage, higher saturated electron drift PN: CGHV60 170D velocity, and higher thermal conductivity. GaN HEMTs offer greater power density and wider bandwidths compared to Si and GaAs transistors. FEATURES APPLICATIONS • 18 dB Typical Small Signal Gain at 4 GHz • Broadband amplifiers • 17 dB Typical Small Signal Gain at 6 GHz • Tactical communications • 65% Typical Power Added Efficiency • Satellite communications • 170 W Typical PSAT • Industrial, Scientific, and Medical ampli- • 50 V Operation fiers • High Breakdown Voltage • Class AB, Linear amplifiers suitable for • Up to 6 GHz Operation OFDM, W-CDMA, LTE, EDGE, CDMA waveforms Packaging Information • • Bare die are shipped on tape or in Gel-Pak® containers. Non-adhesive tacky membrane immobilizes die during ember 2014 Rev 0.1 – Dec shipment. Subject to change without notice. www.cree.com/rf 1 Absolute Maximum Ratings (not simultaneous) Parameter Symbol Rating Units Conditions Drain-source Voltage VDSS 150 VDC 25˚C Gate-source Voltage VGS -10, +2 VDC 25˚C Storage Temperature TSTG -65, +150 ˚C TJ 225 ˚C Maximum Drain Current1 IMAX 12.6 A Maximum Forward Gate Current IGMAX 20.8 mA 25˚C Thermal Resistance, Junction to Case (packaged)2 RθJC 1.36 ˚C/W 85˚C, 83.2W Dissipation Thermal Resistance, Junction to Case (die only) RθJC 0.83 ˚C/W 85˚C, 83.2W Dissipation TS 320 ˚C 30 seconds Operating Junction Temperature Mounting Temperature 25˚C Note Current limit for long term reliable operation. Note2 Eutectic die attach using 80/20 AuSn mounted to a 10 mil thick Cu15Mo85 carrier. 1 Electrical Characteristics (Frequency = 6 GHz unless otherwise stated; TC = 25˚C) Characteristics Symbol Min. Typ. Max. Units Conditions VP -3.8 -3.0 –2.3 V VDS = 10 V, ID = 20.8 mA Drain Current1 IDSS 16.8 20.8 – A VDS = 6 V, VGS = 2.0 V Drain-Source Breakdown Voltage VBD 150 – – V VGS = -8 V, ID = 20.8 mA On Resistance RON – 0.14 – Ω VDS = 0.1 V VG-ON – 1.9 – V IGS = 20.8 mA Small Signal Gain GSS – 17 – dB VDD = 50 V, IDQ = 260 mA Saturated Power Output2,3 PSAT – 170 – W VDD = 50 V, IDQ = 260 mA η – 65 – % VDD = 50 V, IDQ = 260 mA, PSAT = 170 W IM3 – -30 – dBc VSWR – – 10 : 1 Y No damage at all phase angles, VDD = 50 V, IDQ = 260 mA POUT = 170 W CW Input Capacitance CGS – 28.3 – pF VDS = 50 V, Vgs = -8 V, f = 1 MHz Output Capacitance CDS – 6.35 – pF VDS = 50 V, Vgs = -8 V, f = 1 MHz Feedback Capacitance CGD – 0.6 – pF VDS = 50 V, Vgs = -8 V, f = 1 MHz DC Characteristics Gate Pinch-Off Voltage Gate Forward Voltage RF Characteristics Drain Efficiency4 Intermodulation Distortion Output Mismatch Stress VDD = 50 V, IDQ = 260 mA, POUT = 170 W PEP Dynamic Characteristics Notes: 1 Scaled from PCM data 2 PSAT is defined as IG = 2.0 mA. 3 Pulsed 100 μsec, 10% 4 Drain Efficiency = POUT / PDC Copyright © 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. 2 CGHV60170D Rev 0.1 Cree, Inc. 4600 Silicon Drive Durham, North Carolina, USA 27703 USA Tel: +1.919.313.5300 Fax: +1.919.869.2733 www.cree.com/rf DIE Dimensions (units in microns) Overall die size 820 x 5400 (+0/-50) microns, die thickness 100 microns. All Gate and Drain pads must be wire bonded for electrical connection. Assembly Notes: • Recommended solder is AuSn (80/20) solder. Refer to Cree’s website for the Eutectic Die Bond Procedure application note at www.cree.com/RF. • • • • • • Vacuum collet is the preferred method of pick-up. The backside of the die is the Source (ground) contact. Die back side gold plating is 5 microns thick minimum. Thermosonic ball or wedge bonding are the preferred connection methods. Gold wire must be used for connections. Use the die label (XX-YY) for correct orientation. Electrostatic Discharge (ESD) Classifications Parameter Symbol Class Test Methodology Human Body Model HBM 1A (> 250 V) JEDEC JESD22 A114-D Charge Device Model CDM 2 (125 V to 250 V) JEDEC JESD22 C101-C Copyright © 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. 3 CGHV60170D Rev 0.1 Cree, Inc. 4600 Silicon Drive Durham, North Carolina, USA 27703 USA Tel: +1.919.313.5300 Fax: +1.919.869.2733 www.cree.com/rf Typical Performance Figure 1. - CGHV60170D Output Power, Gain and Efficiency vs. Input Power at Tcase = 25°C VDD = 50 V, IDQ = 260 mA, Frequency = 2.7 GHz Figure 2. - CGHV60170D GMAX and K Factor vs. Frequency at Tcase = 25°C VDD = 50 V, IDQ = 260 mA Copyright © 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. 4 CGHV60170D Rev 0.1 Cree, Inc. 4600 Silicon Drive Durham, North Carolina, USA 27703 USA Tel: +1.919.313.5300 Fax: +1.919.869.2733 www.cree.com/rf Typical Die S-Parameters (Small Signal, VDS = 50 V, IDQ = 260 mA, magnitude / angle) Frequency Mag S11 Ang S11 Mag S21 Ang S21 Mag S12 Ang S12 Mag S22 Ang S22 0.5 0.943 -168.72 9.039 75.28 0.009 -13.64 0.544 -156.15 0.6 0.946 -170.27 7.375 70.86 0.009 -17.83 0.571 -155.58 0.7 0.948 -171.36 6.170 66.84 0.009 -21.63 0.600 -155.23 0.8 0.951 -172.18 5.255 63.13 0.009 -25.12 0.627 -155.11 0.9 0.953 -172.81 4.538 59.69 0.008 -28.34 0.654 -155.19 1 0.956 -173.33 3.961 56.48 0.008 -31.32 0.680 -155.45 1.1 0.959 -173.76 3.488 53.50 0.008 -34.08 0.704 -155.84 1.2 0.961 -174.13 3.095 50.72 0.008 -36.64 0.726 -156.32 1.3 0.963 -174.45 2.764 48.12 0.007 -39.02 0.747 -156.87 1.4 0.966 -174.73 2.482 45.69 0.007 -41.22 0.766 -157.45 1.5 0.968 -174.99 2.239 43.42 0.007 -43.27 0.783 -158.07 1.6 0.970 -175.23 2.030 41.30 0.007 -45.17 0.799 -158.69 1.7 0.971 -175.44 1.848 39.31 0.006 -46.94 0.814 -159.31 1.8 0.973 -175.64 1.688 37.44 0.006 -48.59 0.827 -159.93 1.9 0.974 -175.83 1.548 35.68 0.006 -50.12 0.839 -160.53 2 0.976 -176.00 1.424 34.02 0.006 -51.55 0.850 -161.11 2.1 0.977 -176.17 1.314 32.47 0.005 -52.88 0.860 -161.68 2.2 0.978 -176.32 1.216 31.00 0.005 -54.13 0.869 -162.23 2.3 0.979 -176.46 1.128 29.60 0.005 -55.30 0.877 -162.76 2.4 0.980 -176.60 1.049 28.29 0.005 -56.39 0.885 -163.27 2.5 0.981 -176.73 0.977 27.04 0.005 -57.41 0.892 -163.75 2.6 0.982 -176.85 0.913 25.85 0.005 -58.37 0.898 -164.22 2.7 0.983 -176.97 0.855 24.72 0.004 -59.27 0.904 -164.67 2.8 0.984 -177.08 0.802 23.65 0.004 -60.11 0.909 -165.09 2.9 0.984 -177.18 0.753 22.63 0.004 -60.91 0.914 -165.50 3 0.985 -177.29 0.709 21.65 0.004 -61.66 0.919 -165.90 3.2 0.986 -177.47 0.631 19.82 0.004 -63.03 0.927 -166.63 3.4 0.987 -177.65 0.566 18.13 0.004 -64.25 0.934 -167.31 3.6 0.988 -177.81 0.510 16.57 0.003 -65.34 0.940 -167.93 3.8 0.989 -177.95 0.462 15.12 0.003 -66.31 0.945 -168.50 4 0.989 -178.09 0.420 13.78 0.003 -67.19 0.950 -169.02 4.2 0.990 -178.22 0.384 12.51 0.003 -67.97 0.954 -169.51 4.4 0.991 -178.34 0.352 11.32 0.003 -68.67 0.958 -169.96 4.6 0.991 -178.45 0.324 10.20 0.003 -69.30 0.961 -170.38 4.8 0.991 -178.56 0.299 9.14 0.002 -69.86 0.964 -170.77 5 0.992 -178.66 0.277 8.13 0.002 -70.36 0.966 -171.14 5.2 0.992 -178.76 0.258 7.18 0.002 -70.81 0.968 -171.48 5.4 0.992 -178.85 0.240 6.26 0.002 -71.20 0.970 -171.80 5.6 0.993 -178.94 0.224 5.38 0.002 -71.55 0.972 -172.10 5.8 0.993 -179.02 0.210 4.54 0.002 -71.85 0.974 -172.38 6 0.993 -179.10 0.197 3.73 0.002 -72.10 0.975 -172.65 To download the s-parameters in s2p format, go to the CGHV60170D Product Page and click the documentation tab. Copyright © 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. 5 CGHV60170D Rev 0.1 Cree, Inc. 4600 Silicon Drive Durham, North Carolina, USA 27703 USA Tel: +1.919.313.5300 Fax: +1.919.869.2733 www.cree.com/rf Part Number System CGHV60170D Die Power Output (W) Upper Frequency (GHz) Cree GaN High Voltage Parameter Value Units Upper Frequency 6.0 GHz Power Output 170 W Bare Die - 1 Package Table 1. Note : Alpha characters used in frequency 1 code indicate a value greater than 9.9 GHz. See Table 2 for value. Character Code Code Value A 0 B 1 C 2 D 3 E 4 F 5 G 6 H 7 J 8 K 9 Examples: 1A = 10.0 GHz 2H = 27.0 GHz Table 2. Copyright © 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. 6 CGHV60170D Rev 0.1 Cree, Inc. 4600 Silicon Drive Durham, North Carolina, USA 27703 USA Tel: +1.919.313.5300 Fax: +1.919.869.2733 www.cree.com/rf Disclaimer Specifications are subject to change without notice. Cree, Inc. believes the information contained within this data sheet to be accurate and reliable. However, no responsibility is assumed by Cree for its use or for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Cree. Cree makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose. “Typical” parameters are the average values expected by Cree in large quantities and are provided for information purposes only. These values can and do vary in different applications, and actual performance can vary over time. All operating parameters should be validated by customer’s technical experts for each application. Cree products are not designed, intended, or authorized for use as components in applications intended for surgical implant into the body or to support or sustain life, in applications in which the failure of the Cree product could result in personal injury or death, or in applications for the planning, construction, maintenance or direct operation of a nuclear facility. CREE and the CREE logo are registered trademarks of Cree, Inc. For more information, please contact: Cree, Inc. 4600 Silicon Drive Durham, NC 27703 www.cree.com/rf Sarah Miller Cree, Marketing & Export, RF Components 1.919.407.5302 Ryan Baker Cree, Marketing, RF Components 1.919.407.7816 Tom Dekker Cree, Sales Director, RF Components 1.919.407.5639 Copyright © 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. 7 CGHV60170D Rev 0.1 Cree, Inc. 4600 Silicon Drive Durham, North Carolina, USA 27703 USA Tel: +1.919.313.5300 Fax: +1.919.869.2733 www.cree.com/rf